Abstract: A mask member for a deposition mask is provided. The deposition mask has a resin film in which a pattern of opening portions is formed. The mask member includes a resin film and a reflective film. The reflective film is on a surface of the resin film. The reflective film is adapted to reflect light having wavelengths of laser light.

Abstract: A deposition mask includes a resin film defining a plurality of opening portions. Each opening portions extends through the resin film. The resin film includes a first surface and a second surface opposite to the first surface. The second surface is a surface faced to a vapor deposition source during vapor deposition. The resin film defines dents comprising laser marks on the first surface. A mask member for a deposition mask is also provided.

Abstract: A deposition mask includes a resin film defining a plurality of opening portions. Each opening portions extends through the resin film. The resin film includes a first surface and a second surface opposite to the first surface. The second surface is a surface faced to a vapor deposition source during vapor deposition. The resin film defines dents comprising laser marks on the first surface. A mask member for a deposition mask is also provided.

Abstract: A deposition mask in which a resin film can be completely removed in opening portions, a method of manufacturing the deposition mask, and a mask member for the deposition mask are provided. A light irradiation source for laser light is disposed on one side of a resin film (11) and emits the laser light for forming a pattern of opening portions. A reflective film (30) is provided on another side of the resin film (11) and reflects light having a wavelength of the laser light emitted from the light irradiation source for the laser light. The laser light reflected by the reflective film (30) is used to form the patterns of the opening portion (11a) in the resin film (11).

Abstract: A vapor deposition method and a vapor deposition apparatus that, when a vapor deposition material is deposited on a substrate, make it possible to form deposition layer pattern precisely so that the deposition layer pattern is formed uniformly without a gap formed between a deposition mask and the substrate. A deposition mask is disposed with its periphery held by a frame. A substrate on which a vapor deposition layer is to be formed is mounted over the deposition mask. A vapor deposition source is disposed facing the deposition mask and evaporates a vapor deposition material. The vapor deposition is performed while the substrate is pressed vertically at a position of a center of deflection of the deposition mask and on an upper surface of the substrate until that a length of the substrate substantially becomes identical to a length of the deposition mask being bowed down and expanded.

Abstract: A metal layer is formed on a first surface of a flat-plate-like support member, and then a resin cured layer is formed on the metal layer. The resin cured layer is irradiated with laser light for fine processing to form a desired fine pattern, thereby manufacturing a resin film having a fine pattern. Subsequently, ultraviolet light having a wavelength different from that of the laser light for fine processing is irradiated toward a second surface of the support member, which is opposed to the first surface to detach the resin film from the support member.

Abstract: A vapor deposition method and a vapor deposition apparatus that, when a vapor deposition material is deposited on a substrate, make it possible to form deposition layer pattern precisely so that the deposition layer pattern is formed uniformly without a gap formed between a deposition mask and the substrate. A deposition mask is disposed with its periphery held by a frame. A substrate on which a vapor deposition layer is to be formed is mounted over an upper surface of the deposition mask. A vapor deposition source is disposed facing the deposition mask and evaporates a vapor deposition material. The vapor deposition is performed while the substrate is pressed vertically at a position of a center of deflection of the deposition mask and on an upper surface of the substrate until that a length of the substrate substantially becomes identical to a length of the deposition mask being bowed down and expanded.

Abstract: A vapor deposition mask (100) includes a resin layer (10) including a plurality of openings (11); a magnetic metal layer (20) located so as to overlap the resin layer, the magnetic metal layer including a mask portion (20a) having such a shape as to expose the plurality of openings and a peripheral portion (20b) located so as to enclose the mask portion; and a frame (30) secured to the peripheral portion of the magnetic metal layer. The resin layer is not joined to the mask portion of the magnetic metal layer but is joined to at least a part of the peripheral portion of the magnetic metal layer.

Abstract: A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal body formed on the resin layer, the method including the steps of: (A) providing a magnetic metal body having at least one first opening; (B) providing a substrate; (C) forming a resin layer by applying a solution including a resin material or a varnish of a resin material on a surface of a substrate, and then performing a heat treatment thereon; (D) securing the resin layer formed on the substrate on the magnetic metal body so as to cover the at least one first opening; (E) forming a plurality of second openings in a region of the resin layer that is located in the at least one first opening of the magnetic metal body; and (F) after the step (E), removing the substrate from the resin layer.

Abstract: A method for manufacturing a deposition mask having a plurality of openings arranged in a matrix pattern in an active region formation portion of a mask base, which is fixed to a frame while being tensioned, the method including: a step A of preparing a mask base of an initial state fixed to a frame while being tensioned in a predetermined condition so as to define an xy plane; a step B of preparing target coordinate data that identifies a position of each of the plurality of openings in the xy plane; a step C of predicting, for each of the plurality of openings, an amount of displacement from the target coordinate data caused by the formation of the openings to generate such correction data that reduces the amount of displacement; and a step D of forming each of the plurality of openings at a position that is identified based on the target coordinate data and the correction data, wherein: in the step C, the correction data for each of the plurality of openings is associated with an order in which the plurali

Abstract: A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal layer formed on the resin layer, the method including the steps of: providing a substrate; forming a resin layer by applying a solution including a resin material or a precursor solution of a resin material on a surface of the substrate, and then performing a heat treatment thereon; forming a magnetic metal layer on the resin layer, mask portion including a solid portion where a metal film is present and a hollow portion where the metal film is absent; forming a plurality of openings in a region of the resin layer that is located in the hollow portion of the mask portion; and removing the resin layer from the substrate after forming a plurality of openings in a region of the resin layer.

Abstract: A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal body formed on the resin layer, the method including the steps of: (A) providing a magnetic metal body having at least one first opening; (B) providing a substrate; (C) forming a resin layer by applying a solution including a resin material or a varnish of a resin material on a surface of a substrate, and then performing a heat treatment thereon; (D) securing the resin layer formed on the substrate on the magnetic metal body so as to cover the at least one first opening; (E) forming a plurality of second openings in a region of the resin layer that is located in the at least one first opening of the magnetic metal body; and (F) after the step (E), removing the substrate from the resin layer.

Abstract: A rigid material whose linear expansion coefficient is small and whose relative density is small is used to provide a vapor-deposition mask using a lightweight and highly dimension-accurate frame. A frame (15) of the vapor-deposition mask disclosed in accordance with the present embodiment is formed with a carbon-fiber reinforced plastic (CFRP).

Abstract: A vapor deposition mask (100) including: a magnetic metal member (20) including at least one first opening (25); and a layered member (30) that is arranged on the magnetic metal member (20) so as to cover the at least one first opening (25) and has a plurality of second openings (13) located in the at least one first opening (25), wherein: the layered member (30) includes a first layer (m1) and a second layer (m2) that is arranged between the first layer (m1) and the magnetic metal member (20); and in the at least one first opening (25), at a first temperature that is greater than or equal to room temperature, an elastic modulus E1 of the first layer, a thickness a1 of the first layer, an internal stress ?1 of the first layer, an elastic modulus E2 of the second layer, a thickness a2 of the second layer and an internal stress ?2 of the second layer (where ?1 and ?2 are positive for tensile stress) satisfy Expressions (1) and (2) below: ?1/E1??2/E2<0??(1) 0<a1×?1+a2×?2??(2).

Abstract: A film formation device according to an embodiment is provided with: a substrate holder for holding a substrate in an upright position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor-deposited film is to be formed; and an evaporation source for spraying a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source.

Abstract: A vapor deposition mask (100) includes a resin layer (10) including a plurality of openings (11); a magnetic metal layer (20) located so as to overlap the resin layer, the magnetic metal layer including a mask portion (20a) having such a shape as to expose the plurality of openings and a peripheral portion (20b) located so as to enclose the mask portion; and a frame (30) secured to the peripheral portion of the magnetic metal layer. The resin layer is not joined to the mask portion of the magnetic metal layer but is joined to at least a part of the peripheral portion of the magnetic metal layer.

Abstract: A vapor deposition method and a vapor deposition apparatus that, when a vapor deposition material is deposited on a substrate, make it possible to form deposition layer pattern precisely so that the deposition layer pattern is formed uniformly without a gap formed between a deposition mask and the substrate. A deposition mask is disposed with its periphery held by a frame. A substrate on which a vapor deposition layer is to be formed is mounted over an upper surface of the deposition mask. A vapor deposition source is disposed facing the deposition mask and evaporates a vapor deposition material. The vapor deposition is performed while the substrate is pressed vertically at a position of a center of deflection of the deposition mask and on an upper surface of the substrate until that a length of the substrate substantially becomes identical to a length of the deposition mask being bowed down and expanded.

Abstract: A rigid material whose linear expansion coefficient is small and whose relative density is small is used to provide a vapor-deposition mask using a lightweight and highly dimension-accurate frame. A frame (15) of the vapor-deposition mask disclosed in accordance with the present embodiment is formed with a carbon-fiber reinforced plastic (CFRP).

Abstract: A film formation apparatus according to an embodiment comprising: a substrate holder for holding a substrate in a standing position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor deposition layer is formed; and an evaporation source to supply a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source. The apparatus further comprises an adjustment means for reducing a variation in the thickness of the vapor deposition layer, which results from the inclination of the substrate.

Abstract: A vapor deposition apparatus disclosed by an embodiment comprises: a vacuum chamber (8); a mask holder (15) for holding a deposition mask 1; a substrate holder (29) for holding a substrate for vapor deposition (2); an electromagnet (3) disposed above a surface; a vapor deposition source 5 for vaporizing or sublimating a vapor deposition material; and a heat pipe (7) including at least a heat absorption part (71) and a heat dissipation part (72), the heat absorption part being in contact with the electromagnet (3), and the heat dissipation part being derived to an outside of the vacuum chamber (8). The heat pipe (7) and the electromagnet (3) are in intimate contact with each other at an area of a contact part between the heat pipe (7) and the electromagnet (3), the area being equal to or more than a cross-sectional area within an inner perimeter of a coil (32).