Patents by Inventor Sven Albers

Sven Albers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICE FOR IMPLEMENTING A DRY ELECTRICAL CONNECTION OF A MOTOR VEHICLE LOCK
    Publication number: 20110034042
    Abstract: A device (1) for implementing a dry electrical connection of a motor vehicle lock (27), comprising a fastening part (2) for a lock housing (3), wherein an electrical connection to the lock housing (3) can be implemented through an opening (4) of the fastening part (2) from a first side (5) of the fastening part (2), wherein the lock housing (3) has an external plug (7) that is positioned at a distance to the fastening part (2) and at the circumference (8) of which a flexible collar (9) is fastened, extending to the first side (5) of the fastening part (2) and forming a seal (11) with a second distance (10) to the opening (4) of the fastening part (2).
    Type: Application
    Filed: March 14, 2009
    Publication date: February 10, 2011
    Applicant: KIEKERT AKTIENGESELLSCHAFT
    Inventor: Sven Albers
  • ESD Protection Apparatus and Electrical Circuit Including Same
    Publication number: 20100295094
    Abstract: An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.
    Type: Application
    Filed: August 2, 2010
    Publication date: November 25, 2010
    Inventors: Sven Albers, Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek, Eberhard Rohrer
  • Bonding pad for contacting a device
    Patent number: 7816791
    Abstract: A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: October 19, 2010
    Assignee: Infineon Technologies AG
    Inventors: Carsten Ahrens, Sven Albers, Klaus Gnannt, Ulrich Krumbein, Gunther Mackh, Patrick Schelauske, Berthold Schuderer, Georg Seidemann
  • ESD Protection Apparatus and Electrical Circuit Including Same
    Publication number: 20080192395
    Abstract: An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.
    Type: Application
    Filed: February 8, 2008
    Publication date: August 14, 2008
    Inventors: Sven Albers, Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek, Eberhard Rohrer
  • Bonding Pad for Contacting a Device
    Publication number: 20080067682
    Abstract: A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.
    Type: Application
    Filed: September 12, 2007
    Publication date: March 20, 2008
    Inventors: Carsten Ahrens, Sven Albers, Klaus Gnannt, Ulrich Krumbein, Gunther Mackh, Patrick Schelauske, Berthold Schuderer, Georg Seidemann