Abstract: An integrated circuit die test apparatus adapted to minimize damage to solder balls in a ball grid array. The apparatus includes a plurality of flexible pillars or other flexible support structures. The pillars may be formed of an electrically conductive polymer or other material, or formed of polymer and coated with a metallic substance. One or more pillars may be used to contact each solder ball during burn-in. The pillars flex under contact with the solder balls, and spring back upon disengagement. The support structures may be rectangular or wedge-shaped.

Abstract: The invention is directed to the application of viscous materials, such as the adhesives used in LOC die attach processes, to a lead frame by forming a film of viscous material and then bringing a portion of the lead frame and the film of viscous material into contact with one another. In one exemplary embodiment of the method of the invention, the viscous material is drop dispensed, sprayed, pumped or otherwise placed on a carrier surface, the material is spread to a uniform film thickness and then brought into contact with the die attach portion of the lead frame. One embodiment of the apparatus for applying the viscous material includes (1) a carrier surface, (2) a plurality of orifices in fluid communication with the carrier surface, and (3) a pump for pumping the viscous material through the orifices to the carrier surface. The apparatus may also include a metering blade for spreading the material to a uniform film thickness over the carrier surface.

Abstract: The invention is directed to the application of viscous materials, such as the adhesives used in LOC die attach processes, to a lead frame by forming a film of viscous material and then bringing a portion of the lead frame and the film of viscous material into contact with one another. In one exemplary embodiment of the method of the invention, the viscous material is drop dispensed, sprayed, pumped or otherwise placed on a carrier surface, the material is spread to a uniform film thickness and then brought into contact with the die attach portion of the lead frame. One embodiment of the apparatus for applying the viscous material includes (1) a carrier surface, (2) a plurality of orifices in fluid communication with the carrier surface, and (3) a pump for pumping the viscous material through the orifices to the carrier surface. The apparatus may also include a metering blade for spreading the material to a uniform film thickness over the carrier surface.

Abstract: The invention is directed to the application of viscous materials, such as the adhesives used in LOC die attach processes, to a lead frame by forming a film of viscous material and then bringing a portion of the lead frame and the film of viscous material into contact with one another. In one exemplary embodiment of the method of the invention, the viscous material is drop dispensed, sprayed, pumped or otherwise placed on a carrier surface, the material is spread to a uniform film thickness and then brought into contact with the die attach portion of the lead frame. One embodiment of the apparatus for applying the viscous material includes (1) a carrier surface, (2) a plurality of orifices in fluid communication with the carrier surface, and (3) a pump for pumping the viscous material through the orifices to the carrier surface. The apparatus may also include a metering blade for spreading the material to a uniform film thickness over the carrier surface.

Abstract: An integrated circuit die or chip may be positioned within an integrated circuit package by providing a spacer connected to the die and extending upwardly therefrom. When the die is overmolded, the spacer contacts the mold and spaces the die with respect to the mold. By forming the spacer using conventional wire bonding techniques, no additional process steps are necessary in forming the spacer and no additional parts are needed. The spacer wire bonds may be formed with wires which extend upwardly above the remaining wires, protecting the remaining wires from being contacted by the mold or from being positioned too close to the upper surface of the resulting molded package.

Abstract: Methods for applying an adhesive material to a semiconductor connection component and the resulting structures. The method is practiced by providing a flowable adhesive material, providing a semiconductor connection component having a first portion horizontally offset from a second portion, and contacting the first portion of the semiconductor connection component with the adhesive material so a portion of the adhesive material attaches to the first portion. The semiconductor connection component may be a lead frame element having a lead finger. The adhesive material is an electrically conductive material. The first portion of the semiconductor connection component may also be vertically offset from the second portion. The semiconductor connection component with the adhesive material attached to the first portion thereof may then be contacted with a surface of a semiconductor die to attach the component to the die.

Abstract: A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. The consistent depth of immersion is defined by a stop which is attached to a reservoir used to form the adhesive material pool, attached to a stencil which is used in conjunction with the reservoir to form a level upper surface on the adhesive material, or operates independently from the reservoir and/or stencil.

Abstract: An integrated circuit die or chip may be positioned within an integrated circuit package by providing a spacer connected to the die and extending upwardly therefrom. When the die is overmolded, the spacer contacts the mold and spaces the die with respect to the mold. By forming the spacer using conventional wire bonding techniques, no additional process steps are necessary in forming the spacer and no additional parts are needed. The spacer wire bonds may be formed with wires which extend upwardly above the remaining wires, protecting the remaining wires from being contacted by the mold or from being positioned too close to the upper surface of the resulting molded package.

Abstract: A disposable screen used in a screen printing system for printing onto electronic devices is formed of a non-metallic material. The screen is patterned from a foil. The material can be selected from a group consisting of plastic, nylon, paper, and resin. A disposable screen is mounted in the screen printing system, after which a paste material (including solder or an adhesive such as polyimide, bismaleimide, or a thermoset or thermoplastic compound) can be printed through the screen to a target structure. The used screen is discarded after one or more uses and a new screen is mounted in the screen printing system. A teaching sheet having a disposable transparent film is also used to set up the screen printing system. The film is detachably attached to a frame. After one or more prints, the used film is detached and replaced with a new film.

Abstract: A packaged LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. Reduced-size filler particles are used in the encapsulant with the maximum allowable diameter of any particle depending upon the gap width between the lead frame and the die surface. Specifically, the maximum particle diameter is limited such that the ratio of maximum particle diameter to gap width is 0.95 or less, or preferably approximately 0.75. The reduced-size particles do not lodge between the leads and the active surface of the die during transfer molding of the encapsulant, thus, reducing point stresses on the active surface of the die by the filler particles.