Abstract: A method for fabricating and especially for encapsulating a semiconductor device in a plastic package is disclosed. In accordance with one embodiment of the invention the method includes steps of providing an encapsulation mold having a first chamber and a second chamber, with the second chamber spaced outwardly from and substantially surrounding the first chamber. The first chamber is shaped to receive a removable insert. An insert is selected for the particular body type and style which is desired and that insert is secured in the first chamber. The insert has a cavity which is shaped to define the desired encapsulated device package body. A lead frame is provided including a bonding area and a plurality of leads, each lead having a inner portion near the bonding area and an outer portion extending outwardly from the bonding area.

Abstract: A pad array electronic device for mounting on a substrate, such as a printed circuit board (PCB), has a relatively rigid package body with a plurality of holes bearing connecting mechanisms for bonding to lands on the PCB. The package body may be a thermoset plastic or other material that can be injection molded around an electronic component, such as an integrated circuit (IC) bonded to a lead frame. An integrated circuit die or other electronic component is mounted in proximity with or on the lead frame and electrical connections between the integrated circuit chip and the frame are made by any conventional means. In one aspect, the substrate leads are provided at their outer ends that are exposed by holes in the package with solder balls or pads for making connections to the PCB. The package body may be optionally used to stand off the device a set distance from the PCB so that the solder balls will form the proper concave structure.

Abstract: An electronic pad array carrier IC device for mounting on a printed circuit board (PCB) or flex circuit substrate has a thin, flexible "tape" substrate having a plurality of traces. The substrate may be a polyimide or other material that can withstand relatively large lateral mechanical displacement. An integrated circuit die is mounted in proximity with or on the substrate and electrical connections between the integrated circuit chip and the traces are made by any conventional means. The substrate traces are provided at their outer ends with solder balls or pads for making connections to the PCB. A package body covers the die, which body may be optionally used to stand off the package a set distance from the PCB so that the solder balls will form the proper concave structure. Alternatively, a carrier structure may be provided around the periphery of the substrate to add rigidity during handling, testing and mounting, but which may also provide the stand-off function.

Abstract: The disclosed invention comprises multiple semiconductor devices within a single carrier structure. In accordance with one embodiment of the invention, a plurality of semiconductor die are coupled to the leads of a leadframe and are encapsulated by individual package bodies. A carrier structure is formed which encircles all of the die and encapsulates portions of the distal ends of the leads. The extreme distal portions of the leads extend through the carrier to form contact points which are used to access the semiconductor die. By having multiple devices within a single carrier, productivity is improved and costs associated with leadframe and carrier structure materials are reduced.

Abstract: In a lockable folding joint of a ladder having two arms with their flat heads pivoted to one another, a detent block used to engage one of spaced notches of one of the flat heads is held resiliently and firmly by an improved mechanism. The mechanism includes a one-piece curved rod spring which has two opposite arc-shaped rod portions whose one ends are attached to the detent block, two coiled portions formed at another ends of the arc-shaped rod portions and a U-shaped rod portion extending from the coiled portions. A spring plate has a rolled end pivoted to one of the arm with the same pivot pin as the coiled portions. The U-shaped portion depresses the spring plate so that the hook end of the spring plate is engaged tightly with the detent block.

Abstract: An electronic component having a flexible substrate with conductive traces thereon may have the leads separated into arrays that are shaped to contact and be surface mounted to the bonding lands on a printed circuit board (PCB). The flexible substrate, such as polyimide, adheres to the traces and is formed into lead arrays with them. The lead arrays thus keep portions of the leads and the outer bonding areas corresponding thereto aligned with respect to each other during handling and mounting to the PCB. An alignment mechanism may be optionally present on the lead arrays that mates with a corresponding mechanism on the PCB. The package body itself may be overmolded, assembled from prior parts, etc. Another alternate version includes test points on the perimeter of the substrate beyond the outer bonding areas that may be used to test the device, such as an integrated circuit chip or die, at an intermediate stage in the assembly process.

Abstract: An improved packaged semiconductor device is provided having an electronic component, such as an integrated circuit, enclosed within a single layer ceramic PGA package. A cap, of substantially the same areal dimension as the base, is sealed to the base forming a cavity in which the integrated circuit is mounted. Input/output pins are attached to through-holes in the base and extend through the base and are exposed by holes in the cap aligned to the through-holes in the base. Extensive glass sealing of the cap to the base, made possible by the substantially co-extensive nature of the cap with respect to the base, provides a sturdy highly reliable seal making the packaged semiconductor device better able to withstand mechanical stress.

Abstract: A wheel of a unicycle has two beams disposed in parallel in a rim. A bolt is extended between the beams. The head of the bolt is disposed away from the geometric center of the wheel and the bolt extends through the geometric center of the wheel. Two plates which are connected together by a nut are slidably disposed between the beams. The bolt is engaged with the nut. An axle is extended outward from each plate. A rotation of the head of the bolt causes the axles to move either away or toward the geometric center of the wheel.

Abstract: A sunglass, which includes a glass with a pair of of spectacle bows connected thereto by means of a pair of fastening elements. The fastening elements each includes a front opening defining therein two retaining recessed for convenient connection with either part of snap ends made at both sides of the glass without the use of any screw elements.

Abstract: A non-stinging aqueous anti-inflammatory steroid formulation suitable for intranasal administration comprises: an anti-inflammatory steroid in an amount between about 0.01% and about 0.05% (w/v); propylene glycol in an amount between about 2% and about 10% (w/v); PEG 400 in an amount between about 10% and about 25% (w/v); polysorbate 20 in an amount between about 1% and about 4% (w/v); an effective amount of a preservative; an effective amount of a stabilizer; an effective amount of an antioxidant; water; and pH buffering agent sufficient to adjust the pH of the resulting solution to between about 3.5 and about 7.

Abstract: An under-the-hub spin motor for a disk drive includes a stabilizer for supporting the outer diameter of the stator to stiffen the base of the spin motor. Stiffening the base in the region surrounding the shaft of the motor increases the resonant frequency of the spin motor, increasing the tolerance of the spin motor to applied vibrations. The stabilizer may be a ring formed integrally with the base plate of the disk drive or the mounting flange of the motor.

Abstract: A detachable mono-glass sports goggles includes a curved rod-like spectacle frame with two bows bilaterally connected thereto; an unitary glass having its top edge inserted into the bottom scoop channel of the spectacle frame; and a nose piece having an inverted V-shaped portion to support the unitary glass and to mount on user's nose, a split pin for insertion through the unitary glass into the spectacle frame to firmly retain the unitary glass therebetween, and a corrugated face portion for touching of fingers to correct the position of the goggles when it is in wear.

Abstract: Triglyceride cooking/salad oil compositions with fatty acid content balanced for health purposes. The fatty acid composition of the triglycerides comprises by weight:Oleic: 60-92%Linoleic: 5-25%.alpha.-Linolenic: 0-15%Saturates: Less than about 3%At least about 20% of the triglycerides are triglycerides of mixed fatty acids.

Abstract: A bicycle with an eccentric rear wheel including a inner rim with two plates set in parallel with each other across a diameter of the inner rim and an outer rim. A sleeve with a seat formed on it is provided around a hub of the eccentric wheel and serves to receive a shaft head extending from one end of a threaded shaft. The threaded shaft has a pinion on an end thereof opposite to said shaft head. Toothed blocks are slidably mounted on each seat stay to be engageable with the toothed pinion so as to cause the wheel to rotate more or less eccentrically about the hub.

Abstract: Hybrid stepping motor apparatus that produces a step angle of 1/K.sub.p times the pitch angle .DELTA..theta..sub.p of the stator on rotor teeth, where K.sub.p is the number of phases for the motor, using a plurality of stator poles whose center-to-center angular spacings are not uniform, and depend on the number of stator poles used. In one embodiment with M poles, the first M-1 center-to-center pole angular spacings are equal to a first angle A, and the Mth center-to-center pole angular spacing is an angle B with .vertline.A-B.vertline.=m.DELTA..theta..sub.p, where m is a positive integer.

Abstract: An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.

Abstract: An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.

Abstract: A circulatory steam sterilizer and, in particular, the circulatory steam sterilizer having a steam boiler poised in a transverse array and its two ends respectively joined with two-tier compartment partition plates which are arranged in an asymmetrical manner in a plurality of layers and the inner compartment partition plates are connected and in communication with the transversely arranged conduits. The conduits in the upper-most conduits for discharge and delivery are connected and communicative to the outer compartment partition plates, and then these inner conduits are transversely arranged in the inner part of the conduits in the lower layer to specially generate the inner and outer double circulatory heating, thereby achieving the multi-purpose practical benefits live circulatory preheating, heated sterilization and cooling as its features.

Abstract: A process for making hermetic, low cost pin grid array (PGA) semiconductor die packages. The process involves die bonding a semiconductor die or integrated circuit chip to a substrate having an interconnect or metallization pattern thereon. The die is electrically connected to the pattern and then the die and the inner bonds are hermetically sealed inside a cap that is smaller than the substrate so that the ends of the metallization pattern are exposed. The leads are then electrically connected, such as by solder or other technique to the exposed ends of the pattern.

Abstract: A non-stinging aqueous anti-inflammatory steroid formulation suitable for intranasal administration comprises: an anti-inflammatory steroid in an amount between about 0.01% and about 0.05% (w/v); propylene glycol in an amount between about 2% and about 10% (w/v); PEG 400 in an amount between about 10% and about 25% (w/v); polysorbate 20 in an amount between about 1% and about 4% (w/v); an effective amount of a preservative; an effective amount of a stabilizer; an effective amount of an antioxidant; water; and pH buffering agent sufficient to adjust the pH of the resulting solution to between about 3.5 and about 7.