Abstract: A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed around the first die and one side of the traces. The film of transfer material forms, at this stage of the process, one side of the first package. The film of transfer material is then peeled from the pattern of conductive traces and the first resin body to expose the other side of the traces. A second semiconductor die (23) is interconnected to the exposed side of the traces. A second resin body (25) is formed around the second die and portions of the exposed traces. Solder balls (26) are coupled to the exposed portions of the traces to establish external electrical connections to each die.

Abstract: Apparatus for improving the angular resolution of a stepping motor in which the effective step angle of the motor is reduced by a factor of two with no change in the nominal pitch angle. In one embodiment, a group of two stator laminations, angularly offset from one another, are used. In a second embodiment, two rotors, angularly offset from one another, are used, together with two non-offset stator stacks. In an alternative mode of the second embodiment, two stator stacks, angularly offset from one another, are used, together with two non-offset rotors. In a first mode of a third embodiment, a rotor having first and second rotor caps is laterally surrounded by first and second stators, and the two rotor caps, but not the two stators, are angularly offset from one another by the step angle. In a second mode of the third embodiment, the two stators, but not the two rotor caps, are angularly offset from one another by the step angle.

Abstract: A composite flip chip semiconductor device (10) permits burn-in testing and rework to be performed on the device while also enhancing electrical, thermal, and mechanical device performance. The device includes a semiconductor die (12) having a plurality of bonding pads (14). Also included in the composite device is an interposer (22) having a first surface with a plurality of traces (26). A plurality of vias (24) extend from the first surface of the interposer (22) to a second surface. The semiconductor die (12) is electrically coupled to the plurality of vias of the interposer which in turn is to be coupled to a substrate.

Abstract: The method and material of this invention eliminates the necessity of removing imbedded particles remaining after shot blasting by providing a method for surface finishing an orthopaedic implant wherein the blasting medium is bioactive. The surface finishing with bioactive material may also be used to clean the porous surface after sintering or diffusion bonding. Since the particles are made from bioactive material, it is not a concern if particles remain in the porous surface after blasting.

Abstract: A stackable three dimensional leadless multi-chip module (10) is provided whereby each level of semiconductor device (11) is interconnected to another level through reflowing of solder plated wires (22). Each semiconductor device (11) contains a semiconductor die (24) overmolded by a package body (12) on a PCB substrate (14) having a plurality of edge metal conductors (16) that form half-vias (18). The half-vias (18) at the edges of substrate (14) give the substrate a castellated appearance, where the castellations serve as the self-aligning feature during the stacking of the devices (11). Each device (11) is simply stacked on top of each other without any additional layers to give the semiconductor module (10) a lowest possible profile. A plurality of solder plated wires (22) fits into the half-vias (18) and is solder reflowed to the metal conductors (16) to interconnect the semiconductor devices (11). The wires (22) are bent to enable the module (10) to be surface mounted to a PC board.

Abstract: A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a second surface of the substrate (12). A first semiconductor die (20) is interconnected to the first traces (14), and a package body (24) is formed around the first die and a portion of the traces. A second semiconductor die (26) is interconnected to the second traces (16) on the second surface. A second package body (28) is formed around the second die and a portion of the traces (16). Solder balls (32) are coupled to exposed portions of the second traces (16) around the perimeter of the package body (28) to establish external power and ground connections to each die. Edge leads (36) are externally soldered to the traces (14 & 16) around the periphery of the substrate (12) to establish remaining electrical connections.

Abstract: A stackable three-dimensional multi-chip module (MCM) is provided whereby each level of chip carrier is interconnected to another level of chip carrier through reflowing of solder balls pre-bumped onto each carrier. Each level of chip carrier, except for the top carrier, has solder balls on both top and bottom surfaces of the substrate. Optional lids can be used to seal each device, and the lid height would serve as a natural positive stand-off between each level of carriers, giving rise to hour glass shaped solder joints which maximizes the fatigue life of the joints. Heat sinks to further enhance heat dissipation of the MCM can be easily accommodated in this stacking approach. Furthermore, each substrate is capable of carrying multiple chips, so the module incorporates planar chip density growth concurrently with the three-dimensional growth giving rise to an ultradense MCM.

Abstract: Solder balls are transferred onto a semiconductor device (50), for example a flip chip semiconductor device, without using solder evaporation techniques. In one form, pre-formed solder balls (36) are placed in recesses (32) formed in a transfer substrate (30). A semiconductor die (12) having a plurality of bond pads (14) is positioned with respect to the transfer substrate so that the solder balls are aligned to, and in contact with, the bond pads. The solder balls are then reflowed to form a metallurgical bond to the bond pads. One embodiment of the invention utilizes a transfer substrate made of silicon so that the coefficient of thermal expansion of the transfer substrate will closely match that of the semiconductor die, thereby minimizing solder ball alignment variances. Use of silicon as a transfer substrate material also allows the recesses to easily be made non-wettable by conventional silicon oxidation techniques.

Abstract: A semiconductor device is disclosed having an electronic component mounted to a mounting surface opposite a heat transfer surface of a die support member. The electronic component includes a plurality of bonding pads each electrically coupled to a plurality of package leads by a number of inner leads. A package body encloses the electronic component, the inner leads, the proximal ends of the package leads and the mounting surface of the die support member. The package body includes an opening exposing a portion of the heat transfer surface of the die support member. An insertable thermally conductive heat sink extends into the opening in the package body making thermal contact with the heat transfer surface of the die support member. A thermally conductive electrically insulating adhesive joins the heat sink to the package body securing the heat sink to the package body. In the assembly process, the package body is formed prior to attachment of the heat sink.

Abstract: A semiconductor device (10) having first and second wiring layers (30, 33) on opposite surfaces of a carrier substrate (12) interconnected through vias (32) formed in the carrier substrate (12) electrically coupling an electronic component (18) to a mounting substrate through compliant solder balls (26) displaced away from vias (32), the semiconductor device (10) characterized by a standard size carrier substrate (12) having high performance electrical package interconnections (24) and good heat dissipation. Improved electrical performance is obtained by providing independent wiring layers (30, 33) each having a lead trace layout specifically designed for a particular electronic component (18) and a particular board connection requirement while using a standard size package outline. Assembly costs are reduced by providing a plastic package mold (36) over a standard size carrier substrate (12) capable of supporting a variety of different electronic components (18) themselves having varying dimensions.

Abstract: A process for preparing an improved durable glass composition is described. In the first step of the process, a glass batch containing from 40 to 80 mole percent of phosphorous and from 3 to 40 mole percent of iron is provided. In the second step of the process, the glass batch is melted under an enriched oxygen atmosphere.

Abstract: A semiconductor device and a method for its fabrication are disclosed. In a preferred embodiment, a pattern of conductive traces is formed on a film of transfer material. A semiconductor device die is interconnected to the pattern of conductive traces and a resin body is formed around the die, one side of the conductive traces, and the interconnecting means. The film of transfer material forms, at this stage of the process, one side of the package. The film of transfer material is then peeled from the pattern of conductive traces and the resin body to expose the other side of the pattern of conductive traces. Contact to the other side of the pattern provides electrical contact to the senmiconductor device die.

Abstract: A dish antenna including a dish, a base fixed to the outer surface of the dish and including a pair of lugs each including a curved slot, a coupler including a pair of flanges pivotally coupled to the lugs of the base at a pivot axle which is located at the center of curvature of the curved slots, a bolt slidably engaged in each of the curved slots and engaged on the flange for fixing the lugs to the flanges so that the angular position of the base relative to the coupler can be adjusted.

Abstract: A chain with an easily adjustable number of links for bicycles. The chain has links each having a first outer chain plate, a second outer chain plate, a first inner chain plate, a second inner chain plate, and a pin. The first outer chain plate has two holes each defined by overlapping circles of different diameters, forming a figure-eight outline. The pin has a flat button at an end thereof, a neck at the other end thereof, and a dome button formed on the neck.

Abstract: A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact portion which are separated by an intermediate portion. A package body encapsulates the semiconductor device die and intermediate portions of the plurality of leads. The first contact portions of the leads are partially exposed on the bottom surface of the package body. The second contact portions extend from the package body along a portion of the package body perimeter. The first contact portions provide bottom-side contacts to the device, while the second contact portions provide peripheral contacts. The second contact portions are shaped into a desired lead configuration or are severed to establish a leadless device.

Abstract: A process and apparatus are disclosed for producing multiwavelength coherent radiations ranging from deep-ultraviolet to mid-infrared. The basic laser is a pulsed Nd:YAG or Nd:YLF laser which is frequency converted by a set of novel nonlinear crystals including D-CDA, LBO, BBO, KTP, and KNbO.sub.3, where efficient schemes using noncritical phase matching and cylindrical focusing are employed. A computer controlled integrated system suitable for multiple industrial and medical applications is described, particularly where a UV (at 210 nm and 213 nm) solid state laser is desired such as in refractive surgery. Furthermore, using optical parametric oscillation in nonlinear crystals, the laser system can produce tunable (1.5-4.5 microns) wavelengths covering a variety of medical applications.

Abstract: A handy gas torch controlled by a valve control mechanism to eject gas into a combustion chamber inside a nozzle for burning, said valve control mechanism comprising a valve control sleeve having a bearing plate fastened therein, a gas tube inserted through said bearing plate, said gas tube having a valve attached thereto at the bottom and stopped at a valve port through which gas is discharged out of a gas tank, a screw nut screwed up with said gas tube at the top above said bearing plate, a guide member mounted on said screw nut at the top, and spring means constantly forcing said valve to stop at said valve port. Moving said valve control sleeve causes said valve to disconnect from said valve port for discharging gas out of said gas tank into said nozzle for combustion. Releasing upward pressure from said valve control sleeve causes said valve to stop said valve port again. Said nozzle comprises a combustion tube having a commutator fastened therein through which a very hot flame is produced for welding.

Abstract: The disclosed invention comprises multiple semiconductor devices within a single carrier structure. In accordance with one embodiment of the invention, a plurality of semiconductor die are coupled to the leads of a leadframe and are encapsulated by individual package bodies. A carrier structure is formed which encircles all of the die and encapsulates portions of the distal ends of the leads. The extreme distal portions of the leads extend through the carrier to form contact points which are used to access the semiconductor die. By having multiple devices within a single carrier, productivity is improved and costs associated with leadframe and carrier structure materials are reduced.

Abstract: An apparatus and method for displaying ultrasonic data in real time reflected in a living organism. The apparatus comprises a plurality of analog-to-digital converters for digitizing reflected Doppler signals produced by reflecting a reference pulsed acoustic signal, each of the analog-to-digital converters capable of producing a plurality of digitized Doppler signals. The apparatus futher comprises a plurality of digital signal processors, each of the plurality of digital signal processors coupled to each of the plurality of analog-to-digital converters for processing digitized Doppler signals received from the analog-to-digital converters, each of the digital signal processors capable of producing a plurality of processed digital signals.

Abstract: An electronic component having a flexible substrate with conductive traces thereon may have the leads separated into arrays that are shaped to contact and be surface mounted to the bonding lands on a printed circuit board (PCB). The flexible substrate, such as polyimide, adheres to the traces and is formed into lead arrays with them. The lead arrays thus keep portions of the leads and the outer bonding areas corresponding thereto aligned with respect to each other during handling and mounting to the PCB. An alignment mechanism may be optionally present on the lead arrays that mates with a corresponding mechanism on the PCB. The package body itself may be overmolded, assembled from prior parts, etc. Another alternative version includes test points on the perimeter of the substrate beyond the outer bonding areas that may be used to test the device, such as an integrated circuit chip or die, at an intermediate stage in the assembly process.