Abstract: This invention provides a composition, device and method for the treatment or prevention of septic shock syndrome or other conditions evidenced by the presence of cytokines in a patient by contacting the patient's whole blood with a composition comprising silica and a surface treatment material, such as heparin, but preferably human serum albumin (HSA). The treatment lowers the cytokine concentration of the blood.

Abstract: A semiconductor (30) is shielded from electromagnetic interference by a combination of a reference plane (22) of a circuitized substrate (12) and two different encapsulants. The first encapsulant (38) is an electrically insulative encapsulant which mechanically protects a semiconductor die (32). The first encapsulant is constrained by a dam structure (40) so as not to encapsulate conductive reference pads (18) which are electrically connected to the reference plane by conductive vias (20). A second encapsulant (42) is dispensed over the first encapsulant and is in contact with the reference pads. The second encapsulant is an electrically conductive encapsulant, and is preferably made of a precursor material having the same or similar properties as that of the first encapsulant, but is filled with conductive filler particles to establish electrical conductivity of the encapsulant.

Abstract: Nondigestible fats having relatively flat Solid Fat Content (SFC) profile slopes between typical room and body temperatures are disclosed. These nondigestible fat contain a liquid nondigestible oil and relatively small nondigestible particles dispersed in the oil to control passive oil loss. Edible fat-containing products containing these nondigestible fats can be less waxy tasting due to the lower level of solids required for passive oil loss control.

Abstract: A honeycomb grass planting unit includes a hexagonal body with six peripheral walls extending vertically and including a plurality of soilpots and a central fence therein. The soilpots are interconnected by plates to reinforce the structure. Holes are formed in the soilpots and the fence through which hoses pass. Two receiving sockets are disposed on diagonal apexes of the hexagonal body and are releasably engaged with four snapping fasteners disposed on the remaining apexes of another hexagonal body to provide a releasable interconnection between two honeycomb grassplanting units.

Abstract: A dish type antenna includes a board fixed to the back surface of a dish, a frame having a lower portion fixed to a base and an upper portion pivotally coupled to the board at a pivot axle, and a cylinder pivotally coupled between the base and the board so as to rotate the dish about the pivot axle. The antenna includes a simplified configuration and can be easily disengaged and removed.

Abstract: A tool box includes a cover shell having a rectangular socket on a back wall thereof, a bottom shell having a rectangular socket on a back wall thereof, and a hinge connected between the rectangular socket of the cover shell and the rectangular socket of the bottom shell permitting the cover and bottom shells to be turned on the hinge relative to each other, wherein the rectangular socket of either shell has two opposite projecting portions on the inside; the hinge is integrally molded from a resilient plastic material having two symmetrical parts linked by a grooved horizontal connecting portion, each part of the hinge having two hooks inserted into the rectangular socket of either shell and engaged with the projecting portions of the respective rectangular socket.

Abstract: A quad leadframe (22') for a CERQUAD is manufactured using conventional cladding and stamping technologies. A first metal layer (12) is provided with multiple cavities (14). A second metal layer (14) is clad to the first metal layer. A leadframe strip (22) can then be stamped from the clad metal. The leadframe has a leads (24) and bonding posts (28). The leads comprise two metal layers, and the bonding posts comprise only the second metal layer. The leadframe can then be used in the assembly of a semiconductor device (32). The portion of the leads external to the package body can be optionally etched to remove the second metal layer.

Abstract: A water soluble graft copolymer useful as retention and drainage aids in papermaking processes having the structure: ##STR1## wherein E is the repeat unit obtained after polymerization of an .alpha.,.beta. ethylenically unsaturated compound, the molar percentage of a:b is from about 95:5 to 5:95, with the proviso that the sum of a and b equals 100%; G comprises the structure: ##STR2## wherein d is a cationic monomer, R.sub.1, R.sub.2 and R.sub.3 are the same or different and are hydrogen or a lower alkyl group having C.sub.1 to C.sub.3, F is the salt of an ammonium cation and the molar percentage of c:d is from 95:5 to 5:95 with the proviso that the sum of c and d equals 100%.

Abstract: The synthesis of a nonlinear chromophoric co-monomer 3,5-diamino-4'-nitrodiphenylamine and use as a reactive component in combination with a bismaleimide monomer in a NLO-active polyimide matrix is disclosed. After concurrent corona or contact poling and thermal polymerization, thin films of these chromophoric polyimides exhibit high second harmonic generation efficiencies and high DSC-determined glass transition temperatures. These poled polyimides also exhibit excellent SHG temporal stability, retaining 85-90% of the initial second harmonic efficiency after more than one month in air at 85.degree. C.

Abstract: An improved decorative button of a pet collar, including a decorative cap, a resilient pad member and a decorative attaching paper. The decorative cap has a projecting rectangular rivet stem and a lower arch surface around the rivet stem corresponding to a curve of the pet collar. The resilient pad member is formed with a central rectangular hole corresponding to the rivet stem of the decorative cap. The rectangular hole of the resilient pad member has four slightly upward bent side edges. Each of four corners of the rectangular hole is formed with a linear fissure and a middle portion of each long side edge of the rectangular hole is also formed with a linear fissure, whereby the rivet stem is irreversibly fitted into the rectangular hole of the resilient pad member. The resilient pad member is resiliently deformed in accordance with the curve of the decorative cap and the pet collar so as to closely associate therewith without producing any clearance or unplane projecting portion.

Abstract: An article which includes at least one layer of a network of high strength fibers, preferably extended chain polyethylene fibers. The fibers of the network are coated with a very low modulus elastomeric matrix material, preferably an acrylic ester copolymer, which has a tensile modulus of less than about 100 psi, a tenacity of less than 450 psi (3105 kPa), a glass transition temperature (T.sub.g) of about -10.degree. C. to about -20.degree. C., and an elongation-to-break of at least about 2000%. The article can further include a second matrix material, preferably made of polyethylene, adjacent to the fiber network layer.

Abstract: A bone cement composition has adjustable rheological properties, high strength, and produces a uniform radiological image. The cement comprises beads containing a polymerization initiator in controllable concentrations from 0% to 5% or more by weight. These same beads or others may also contain an opacifier. The polymerization initiator and the opacifier may be selectively distributed throughout the beads or at specific radial locations in the beads or within the beads in specific strata. They may also be selectively placed in beads of a particular advantageous size range. Furthermore, in other embodiments of the invention, other advantageous additives can be incorporated in the beads such as dyes, antibiotics, bone growth factors, and other pharmacological or therapeutic agents.

Abstract: An improved semiconductor device is disclosed having a predetermined amount of solder, or other electrically conductive binder adsorbed onto the exterior package leads of the semiconductor device. A de-wettable coating comprising preferably nickel, or alternatively chromium, is plated to a superior portion of the package leads, such that, when the heat is applied to the substrate mounting end of the leads, solder desorbes from the de-wettable layer and flows down the lead to the contact pads on the mounting substrate and forms a solder joint. The amount of solder delivered to the contact pad for joint formation is determined by the thickness of the adsorbed solder layer overlying each package lead. Only enough solder is provided on each lead sufficient to form the joint thus avoiding solder bridging between adjacent contact pads.

Abstract: A quad leadframe (22') for a CERQUAD is manufactured using conventional cladding and stamping technologies. A first metal layer (12) is provided with multiple cavities (14). A second metal layer (14) is clad to the first metal layer. A leadframe strip (22) can then be stamped from the clad metal. The leadframe has a leads (24) and bonding posts (28). The leads comprise two metal layers, and the bonding posts comprise only the second metal layer. The leadframe can then be used in the assembly of a semiconductor device (32). The portion of the leads external to the package body can be optionally etched to remove the second metal layer.

Abstract: A solar recharge station is described having a contact area, a battery bank charge area and a solar panel array for maintaining the battery bank charged. The contact area includes electric contacts formed for engagement automatically by contacts on an electric powered vehicle as the vehicle enters the contact area. The battery bank is connected so that its energy is available for either recharging the vehicle or other use, and in case the vehicle needs a recharge but the battery banks lacks sufficient charge, ordinary house voltage is used.

Abstract: An apparatus and method to simultaneously evaluate the drainage, retention and formation characteristics of paper pulp comprising mixing the paper pulp furnish in the top chamber of the apparatus, releasing the furnish into a middle chamber via a valve having a cone shaped structure for even distribution of the furnish onto a wire screen, and utilizing a time delay before opening a vent valve in order to attenuate impingement forces. The apparatus utilizes a rotating blade under the wire screen to duplicate the pulsation forces of full scale papermaking equipment, an externally applied means to assist in the removal of water similar to a paper machine couch roll. Data generated during the foregoing steps is fed into a computer to evaluate the entire free water drainage process of the furnish. The device is able to set parameters to simulate the water removal process on most paper machines via level control and duration of pertinent variables.

Abstract: A handy torch including a holder for accommodating a handy lighter and a torch body detachably mountable on the holder for holding the lighter in the holder, wherein the torch body is consisted of two opposing half shells abutted against each other to define a narrow, horizontal clamping space between vertically spaced clamping strips thereon, in which a heat-insulation partition board is retained to hold a torch nozzle bearing block, the partition board having a rectangular hole for guiding a link mechanism controlled by a firing button to trigger a firing device and a fuel gas flow control push button on the lighter.

Abstract: Contaminants are removed from a semiconductor material by heating the semiconductor material to temperature within the range of a minimum temperature where a halogen compound will decompose to halogen atoms without the use of ultraviolet irradiation and react with contaminants present on the semiconductor material and a maximum temperature of 800.degree. C., wherein less than or equal to approximately 50 Angstroms of oxide is formed on the semiconductor material. The ambient in which the semiconductor material is heated is an ambient comprised of a nonreactive gas and a halogen compound for at least a time sufficient to remove a substantial amount of contaminants from the semiconductor material.

Abstract: The present invention is an apparatus and method for maximizing light beam utilization in patterning applications by positioning a plurality of mask mirrors in the light beam path to form patterned light onto a plurality of work pieces. Each mask mirror is designed so that a portion of the light beam area needed for exposing a work piece to patterned light is reflected from the mask mirror, while the remainder is passed through the mask mirror to another mask mirror. Alternatively, each mask mirror can be designed so that a portion of the light beam area needed for exposing a work piece to patterned light is passed through the mask mirror, while the remainder is reflected to another mask mirror.

Abstract: A semiconductor multiple package module (10) on a PCB material substrate (18) is provided, wherein semiconductor dice are directly mounted onto the PCB material substrate (18) thereby eliminating a subsequent board mounting at the customer level. A plurality of semiconductor dice are mounted and electrically connected to a plurality of circuit traces (22) on the PCB material substrate (18) having a plurality of edge connectors (20). The plurality of circuit traces (22) has conductive paths to electrically interconnect the semiconductor dice to the edge connectors (20) and to each other. The semiconductor dice are directly overmolded on the PCB material substrate (18) with a molding compound to form individual semiconductor devices (12, 14, and 16) having separate package bodies. The individualized package bodies enable repair to the module by making removal of only nonfunctional semiconductor devices from the PCB material substrate (18) possible.