Abstract: The present disclosure provides a pixel circuit with pulse width compensation, and the pixel circuit includes a pulse width modulation circuit and a pulse amplitude modulation circuit, and the pulse amplitude modulation circuit is electrically connected to the pulse width modulation circuit. The pulse width modulation circuit includes a P-type pulse width compensation transistor and a first P-type control transistor, and the first P-type control transistor is electrically connected to the P-type pulse width compensation transistor. The pulse amplitude modulation circuit includes a second P-type control transistor, a first capacitor, a P-type driving transistor and a light-emitting element. The second P-type control transistor is electrically connected to the first P-type control transistor. The first capacitor is electrically connected to the second P-type control transistor.

Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Abstract: In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Abstract: A fixing device for a rotary shaft of a milling head includes an outer washer, an inner washer, and a locking unit. The outer washer is mounted between a housing and a first shaft, and includes an outer peripheral surface, an inner peripheral surface, and detent holes. Each detent hole is defined by a conical surface that has a bottom side portion and a top side portion. The inner washer is mounted between the outer washer and the first shaft. The locking unit includes fastening holes and adjusting members corresponding in position to the detent holes. Each adjusting member has a threaded section engaging threadedly with a corresponding fastening hole, and a conical section connected to the threaded section. The conical section has a conical pressuring surface that presses against the bottom side portion.

Abstract: A waterproof rotary milling head includes a fixed unit, a rotating unit, at least one bearing unit, and a waterproof unit. The rotating unit is rotatable relative to the fixed unit, and the fixed unit and the rotating unit have a gap therebetween. The at least one bearing unit is disposed between the fixed unit and the rotating unit, and provides smooth rotation of the rotating unit relative to the fixed unit. The waterproof unit has an inner guiding conical surface that is disposed outside the at least one bearing unit and that is adjacent to the gap.

Abstract: A data storage device includes a memory device and a memory controller. The memory controller uses a first predetermined memory block as a buffer to receive data from a host device. In response to a write command received from the host device, the memory controller determines a sub-region corresponding to the write command, determines whether the sub-region is a system data sub-region and accordingly determines whether to use a second predetermined memory block as another buffer to receive data from the host device. When the memory controller determines that the sub-region corresponding to the write command is a system data sub-region, the memory controller writes the data into the second predetermined memory block. When the memory controller determines that the sub-region corresponding to the write command is not a system data sub-region, the memory controller writes the data into the first predetermined memory block.

Abstract: A transportation monitoring method is provided, including the following steps. A monitoring image of a robot blade outside a carrier is captured from a fixed field of view by an image capturing device. The robot blade is configured to move an item into or out of the carrier. Next, a sampling area is obtained from the monitoring image by a processing device. Also, a tilting state of the robot blade is determined according to the sampling area by the processing device. When the processing device determines that the robot blade is tilted, the processing device sends a warning signal. A transportation monitoring system is also provided.

Abstract: A chromatographic separation column for characterizing surfactant purity is disclosed. The column includes a separation medium having a particulate porous substrate with monofunctional silane with diisopropyl side chain groups and a pendant cyano functional group held within a column. The porous substrate has a pore size of about 50 ? to about 500 ? and an average particle size of about 1.0 ?m to about 100 ?m. The column has an inner diameter of about 1.0 to 100 mm, e.g., 4.6 mm and a length from about 10 mm to about 250 mm. Methods of facilitating characterization of polysorbate 80 by providing a sample containing polysorbate 80 and one or more reaction products of polysorbate 80 and a chromatographic separation column are disclosed. Methods of characterizing polysorbate 80 by separating polysorbate 80 and one or more reaction products of polysorbate 80 are also disclosed.

Abstract: In a method of forming a pattern, a first pattern is formed over an underlying layer, the first pattern including main patterns and a lateral protrusion having a thickness of less than 25% of a thickness of the main patterns, a hard mask layer is formed over the first pattern, a planarization operation is performed to expose the first pattern without exposing the lateral protrusion, a hard mask pattern is formed by removing the first pattern while the lateral protrusion being covered by the hard mask layer, and the underlying layer is patterned using the hard mask pattern as an etching mask.

Abstract: The present disclosure provides a scan driving circuit, which includes a pull-up output charging circuit, a pull-down discharge circuit, a pre-charge circuit, an anti-noise start-up circuit and an anti-noise pull-down discharge circuit. The pull-up output charging circuit is electrically connected to an output terminal, and the pull-down discharge circuit is electrically connected to the output terminal. The pre-charge circuit is electrically connected to the pull-up output charging circuit and the pull-down discharge circuit through a driving node. The anti-noise start-up circuit is electrically connected to the pre-charge circuit. The anti-noise pull-down discharge circuit is electrically connected to the anti-noise start-up circuit, and the anti-noise pull-down discharge circuit is electrically connected to the driving node.

Abstract: A manufacturing method of a semiconductor structure including the following steps is provided. A substrate is provided. A first dielectric layer is formed on the substrate. A first conductive layer is formed in the first dielectric layer. A capping layer is formed on the first dielectric layer and the first conductive layer. The material of the capping layer is nitride. A diffusion barrier layer covering the capping layer is formed. The material of the diffusion barrier layer is silicon-rich oxide (SRO). A second dielectric layer is formed on the diffusion barrier layer. An opening is formed in the second dielectric layer. The opening exposes the diffusion barrier layer. A patterned photoresist layer is formed on the second dielectric layer. A patterning process is performed by using the patterned photoresist layer as a mask to expand the opening and to expose the first conductive layer.

Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Abstract: A method for designing an integrated circuit layout includes: generating an analog standard cell library and designing the integrated circuit layout by using at least the analog standard cell library, where the step of generating the analog standard cell library includes creating a target analog standard cell that is included in the analog standard cell library and does not violate layout rules of digital standard cells. Another method for designing an integrated circuit layout includes: generating a mixed-signal standard cell library and designing the integrated circuit layout by using at least the mixed-signal standard cell library, where the step of generating the mixed-signal standard cell library includes creating a target mixed-signal standard cell that is included in the mixed-signal standard cell library and does not violate layout rules of digital standard cells.

Abstract: A light emitting diode display device includes: a substrate, a plurality of signal lines, and a plurality of transparent apertures. A plurality of element packages arranged in matrix on one side of the substrate, the two element packages are connected by the signal lines, and the transparent aperture is surrounded by the signal lines. The signal line is a multi-layer structure for transmitting signal, which can reduce the risk of breaking the signal transmission line during stretching. The transparent aperture is stacked with organic materials, and the inorganic material is removed, which reduces the problem of the cracking and extension of the inorganic material layer when the product is stretched. It also has the effect of reducing the penetration loss caused by the refraction of light through multiple layers, so that the transparent aperture forms a high light-transmitting effect.

Abstract: A micro light-emitting diode display is based on a conventional micro light-emitting diode display and includes at least one electrically conductive material layer or at least one functional material added to an encapsulation layer, so as to achieve antistatic effect. The micro light-emitting diode display solves the problem that the conventional micro light-emitting diode display is easily damaged by electrostatic breakdown.

Abstract: In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Abstract: A method of manufacturing a semiconductor device includes forming an underlying structure in a first area and a second area over a substrate. A first layer is formed over the underlying structure. The first layer is removed from the second area while protecting the first layer in the first area. A second layer is formed over the first area and the second area, wherein the second layer has a smaller light transparency than the first layer. The second layer is removed from the first area, and first resist pattern is formed over the first layer in the first area and a second resist pattern over the second layer in the second area.

Abstract: A vibrotactile device and method including an audio signal input unit, manual parameter input unit, microcontroller, vibration motor controller, and at least one vibration motor are provided. The microcontroller is coupled to the audio signal input unit and manual parameter input unit. The vibration motor controller is coupled to the microcontroller and the at least one vibration motor. At least one signal is generated by at least the audio signal input unit or the manual parameter input unit. A modulated signal is generated based, in part, on a filtered signal from the audio signal input unit and a vibration duty cycle is generated, based on a tempo value and a note value of the manual parameter input unit, to generate at least one driving parameter, respectively. The vibration motor controller drives the at least one vibration motor based on the at least one driving parameter.