Abstract: A data storage device includes a memory device and a memory controller. The memory controller maintains a write count for each sub-region of the memory device. When the memory controller has selected one or more sub-regions to perform a data rearrangement procedure, the memory controller further determines whether a selected sub-region is a hot-write sub-region according to the write count corresponding to the selected sub-region. When the memory controller determines that the selected sub-region is not a hot-write sub-region, the memory controller performs the data rearrangement procedure on the selected sub-region to move data corresponding to logical addresses belonging to the selected sub-region to a memory space of the memory device having continuous physical addresses. When the memory controller determines that the selected sub-region is a hot-write sub-region, the memory controller does not perform the data rearrangement procedure on the selected sub-region.

Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.

Abstract: A data storage device includes a memory device and a memory controller. The memory controller uses a first predetermined memory block as a buffer to receive data from a host device. In response to a write command received from the host device, the memory controller determines a sub-region corresponding to the write command, determines whether the sub-region is a system data sub-region and accordingly determines whether to use a second predetermined memory block as another buffer to receive data from the host device. When the memory controller determines that the sub-region corresponding to the write command is a system data sub-region, the memory controller writes the data into the second predetermined memory block. When the memory controller determines that the sub-region corresponding to the write command is not a system data sub-region, the memory controller writes the data into the first predetermined memory block.

Abstract: A data storage device includes a memory device and a memory controller. When a sub-region of the memory device is selected based on a predetermined rule to perform a data rearrangement procedure, the memory controller determines whether the selected sub-region is a system data sub-region. When determining that the selected sub-region is not a system data sub-region, the memory controller performs the data rearrangement procedure on the selected sub-region to move data corresponding to logical addresses belonging to the selected sub-region to a memory space of the memory device having continuous physical addresses, and when determining that the selected sub-region is a system data sub-region, the memory controller does not perform the data rearrangement procedure on the selected sub-region.

Abstract: The present disclosure provides a circuit board with an embedded chip, which includes a dielectric layer, a first circuit layer, a chip, a conductive connector, and an insulating protection layer. The first circuit layer includes at least one first trace in the dielectric layer. The chip is in the dielectric layer and adjacent to the first trace, where the chip includes a plurality of chip pads at an upper surface of the chip. The conductive connector is on the upper surface of the chip and on the first circuit layer, where a lower surface of the conductive connector contacts at least one chip pad of the chip pads and an upper surface of the first trace. The insulating protection layer is on the chip, the first circuit layer, and the conductive connector, where the insulating protection layer contacts the upper surface of the chip.

Abstract: A lens array includes an edge lens region provided with multiple first type lenslets, a middle lens region provided with multiple second type lenslets and a center lens region provided with multiple third type lenslets. One of the first type lenslets has a first curved surface with a first vertex, one of the second type lenslets has a second curved surface with a second vertex, and one of the third type lenslets has a third curved surface with a third vertex. A first tangent plane to the first curved surface at the first vertex, a second tangent plane to the second curved surface at the second vertex, and a third tangent plane to the third curved surface at the third vertex are parallel to or coincide with each other.

Abstract: A first group of semiconductor fins are over a first region of a substrate, the substrate includes a first stepped profile between two of the first group of semiconductor fins, and the first stepped profile comprises a first lower step, two first upper steps, and two first step rises extending from opposite sides of the first lower step to the first upper steps. A second group of semiconductor fins are over a second region of the substrate, the substrate includes a second stepped profile between two of the second group of semiconductor fins, and the second stepped profile comprises a second lower step, two second upper steps, and two second step rises extending from opposite sides of the second lower step to the second upper steps, in which the second upper steps are wider than the first upper steps in the cross-sectional view.

Abstract: An image sleep analysis method and system thereof are disclosed. During sleep duration, a plurality of visible-light images of a body are obtained. Positions of image differences are determined by comparing the visible-light images. A plurality of features of the visible-light images are identified and positions of the features are determined. According to the positions of the image differences and features, the motion intensities of the features are determined. Therefore, a variation of the motion intensities is analyzed and recorded to provide accurate sleep quality.

Abstract: An arteriovenous fistula (AVF) stenosis detection system and method thereof and sensing device are provided. The AVF stenosis detection system includes: a sensing device including a microphone; and a server coupled to the sensing device. The sensing device contacts a first location of a patient body, wherein there is a first distance between the first location and a second location of an AVF of the patient body, and the first location is located on an extended path of an artery or a vein corresponding to the AVF. The sensing device receives a frequency spectrum signal through the microphone and transmits the frequency spectrum signal to the server. The server calculates a stenosis percentage of the AVF corresponding to the frequency spectrum signal through a machine learning module and transmits the stenosis percentage to the sensing device.

Abstract: In some examples, a controller of a wearable device causes display by the wearable device of a test image, and adjusts a color property of the displayed test image. In response to an input provided by a user responsive to the displayed test image as the color property is adjusted, the controller determines a distribution of color wavelengths for an eye of the user, and detects a color vision deficiency of the user based on the determined distribution of color wavelengths. The controller provides control information to control a display device of the wearable device to compensate for the color vision deficiency.

Abstract: A sewing machine includes a main body and a quick release needle plate module. The main body includes a base seat having an inner frame, and an outer case that is mounted to the inner frame and that defines an accommodating compartment. The quick release needle plate module includes a catch member, and a needle plate that covers the accommodating compartment, that is detachably pivoted to a rear section of the inner frame, and that engages the catch member. The quick release needle plate module further includes a press member inserted through the outer case and the inner frame, and operable to push the catch member to disengage the catch member. The needle plate has a plate body that covers the accommodating compartment, and a resilient member mounted between the inner frame and the plate body for driving pivot action of the plate body away from the inner frame.

Abstract: An imaging lens module includes a casing, an imaging lens disposed to the casing, a lens carrier supporting the image lens, an elastic element connected to the lens carrier to provide the lens carrier with a translational degree of freedom along an optical axis, a frame connected to the elastic element such that the lens carrier is movable along the optical axis with respect to the frame, a variable through hole module coupled to the imaging lens and having a light passable hole with a variable aperture size, and a wiring assembly including a fixed wiring part at least partially located closer to the opening than the elastic element and a movable wiring part electrically connected to the fixed wiring part and the variable through hole module. The optical axis passes through lens elements of the imaging lens and the center of the variable through hole module.

Abstract: A method for preparing antibacterial stainless steel by surface alloying includes the steps of coating an infiltration promoter layer on a stainless steel surface, coating an antibacterial metal layer on a surface of the infiltration promoter layer, and performing heat treatment of the stainless steel to diffuse an antibacterial metal into the stainless steel. This method can be applied to various types of stainless steel, and the antibacterial metal can be diffused and quenched into the stainless steel, such that the finally formed surface of the stainless steel has an antibacterial alloy layer with a specific thickness to provide better corrosion resistance and antibacterial ability without changing the advantages and properties of the antibacterial metal or stainless steel substrate, and the thickness and concentration of the antibacterial metal layer, and the parameters for heat treatment can be adjusted to control the chemical composition and thickness of the antibacterial alloy layer.

Abstract: An integrated circuit includes an inductor that includes a first set of conductors in at least a first metal layer, and a guard ring enclosing the inductor. The guard ring includes a first conductor extending in a first direction, a second conductor extending in a second direction, and a first set of staggered conductors coupled to a first end of the first conductor and a first end of the second conductor. The first set of staggered conductors includes a second set of conductors in a second metal layer, a third set of conductors in a third metal layer and a first set of vias coupling the second set of conductors with the third set of conductors. The third metal layer is above the second metal layer. All metal lines in the second metal layer that are part of the guard ring extend in the first direction.

Abstract: A double patterning method of manufacturing select gates and word lines is provided in the present invention, including forming first string patterns composed of word line patterns and select gate patterns on a target layer, forming a conformal spacer layer on first string patterns, wherein the spacer layer forms trenches between first string patterns, forming a fill layer filling up the trenches on the spacer layer, removing fill layer outside of the trenches, so that fill layer in the trenches forms second string patterns, wherein the second string patterns and the first string patterns are spaced apart, removing exposed spacer layer, so that the first string patterns and the second string patterns constitute target patterns spaced apart from each other on the target layer, and performing an etching process using those target patterns as a mask to remove exposed target layer, so as to form word lines and select gates.

Abstract: The present disclosure provides an apparatus for a lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame including a material selected from the group consisting of boron nitride (BN), boron carbide (BC), and a combination thereof, a mask, a first adhesive layer that secures the pellicle membrane to the pellicle frame, and a second adhesive layer that secures the pellicle frame to the mask.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.

Abstract: An apparatus comprises a processing device that is configured to obtain information about driver installations of a given driver on a plurality of computing devices and to obtain information about system failures from the plurality of computing devices. The processing device is further configured to determine a correlation between the driver installations and the system failures and to determine that the given driver is likely to cause a system failure based at least in part on the determined correlation between the driver installations and the system failures. The processing device is further configured to provide an indication that the given driver is likely to cause a system failure to a given computing device. The indication is configured to cause the given computing device to inhibit a presentation of a recommendation to install the given driver to a user of the given computing device.