Abstract: The present application discloses a semiconductor integrated circuit including a substrate having electrical devices formed thereon, a local interconnection layer formed over the substrate, and a global interconnection layer formed over the local interconnection layer. The local interconnection layer has a first set of conductive structures arranged to electrically connect within the individual electrical devices, among one of the electrical devices and its adjacent electrical devices, or vertically between the devices and the global interconnection layer. At least one of the first set of conductive structures is configured to have a resistance value greater than 50 ohms. The global interconnection layer has a second set of conductive structures arranged to electrically interconnect the electrical devices via the first set conductive structures.

Abstract: An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is spaced from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. The first metallic layer is electrically coupled with the first source region. The first metallic layer and the first diffusion area overlap with a first distance. A second metallic layer is electrically coupled with the first drain region and the second drain region. The second metallic layer and the first diffusion area overlap with a second distance. The first distance is larger than the second distance.

Abstract: A method of designing an integrated circuit includes defining at least one dummy layer covering at least one of a portion of a first metallic layer and a portion of a second metallic layer of an integrated circuit. The second metallic layer is disposed over the first metallic layer. The first metallic layer, the second metallic layer and a gate electrode of the integrated circuit have a same routing direction. A logical operation is performed to a file corresponding to the at least one of the portion of the first metallic layer and the portion of the second metallic layer covered by the dummy layer so as to size at least one of the portion of the first metallic layer and the portion of the second metallic layer.

Abstract: An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is spaced from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. The first metallic layer is electrically coupled with the first source region. The first metallic layer and the first diffusion area overlap with a first distance. A second metallic layer is electrically coupled with the first drain region and the second drain region. The second metallic layer and the first diffusion area overlap with a second distance. The first distance is larger than the second distance.

Abstract: An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is separated from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. A first metallic structure is electrically coupled with the first source region. A second metallic structure is electrically coupled with the second drain region. A third metallic structure is disposed over and electrically coupled with the first and second metallic structures. A width of the first metallic structure is substantially equal to or larger than a width of the third metallic structure.

Abstract: A circuit, includes first, second, and third inverters. The first inverter has a first input coupled to a first port and a first output coupled to a second port. The second inverter has a second input coupled to the second port and a second output coupled to the first port. The third inverter has a third input coupled to the first port through a first capacitor and to a third port. The third inverter has an output coupled to the second port through a second capacitor. The circuit receives a signal having a voltage between a first voltage potential and a second voltage potential and in response outputs a signal having a voltage between the second voltage potential and a third voltage potential. The third voltage potential is higher than the first and second voltage potentials with respect to ground.

Abstract: An integrated circuit including type-1 cells and a type-2 cell is presented. The type-1 cells have poly lines with a default poly pitch. The type-2 cell has poly lines with a non-default poly pitch. A first boundary region has at least one isolation area that lies between the type-1 cells and the type-2 cell in the X-direction. The first boundary region includes at least one merged dummy poly line, wherein the at least one merged dummy poly line has a first portion that complies with the default poly pitch of the type-1 cells and a second portion that complies with the non-default poly pitch of the type-2 cell.

Abstract: Integrated circuit libraries include a first standard cell having a first left boundary and a first right boundary, and a second standard cell having a second left boundary and a second right boundary. The first standard cell and the second standard cell are of a same cell variant. A first active region in the first standard cell has a different length of diffusion than a second active region in the second standard cell. The first active region and the second active region are corresponding active regions represented by a same component of a same circuit diagram representing both the first standard cell and the second standard cell.

Abstract: An integrated circuit structure includes an integrated circuit structure including a PMOS transistor including a first gate electrode; a first source region; and a first drain region; an NMOS transistor including a second gate electrode, wherein the first gate electrode and the second gate electrode are portions of a gate electrode strip; a second source region; and a second drain region. No additional transistors are formed between the PMOS transistor and the NMOS transistor. The integrated circuit further includes a VDD power rail connected to the first source region; a VSS power rail connected to the second source region; and an interconnection port electrically connected to the gate electrode strip. The interconnection port is on an outer side of a MOS pair region including the PMOS transistor, the NMOS transistor, and the region between the PMOS transistor and the NMOS transistor. The portion of the gate electrode strip in the MOS pair region is substantially straight.

Abstract: An integrated circuit structure includes a semiconductor substrate; a first active region in the semiconductor substrate; and a second active region in the semiconductor substrate and of an opposite conductivity type than the first active region. A gate electrode strip is over the first and the second active regions and forms a first MOS device and a second MOS device with the first active region and the second active region, respectively. A first spacer bar is in the semiconductor substrate and connected to the first active region. At least a portion of the first spacer bar is adjacent to and spaced apart from a portion of the first active region. A second spacer bar is in the semiconductor substrate and connected to the second active region. At least a portion of the second spacer bar is adjacent to and spaced apart from a portion of the second active region.

Abstract: An integrated circuit including type-1 cells and a type-2 cell is presented. The type-1 cells have poly lines with a default poly pitch. The type-2 cell has poly lines with a non-default poly pitch. A first boundary region has at least one isolation area that lies between the type-1 cells and the type-2 cell in the X-direction. The first boundary region includes at least one merged dummy poly line, wherein the at least one merged dummy poly line has a first portion that complies with the default poly pitch of the type-1 cells and a second portion that complies with the non-default poly pitch of the type-2 cell.

Abstract: The present disclosure provides an integrated circuit. The integrated circuit includes an active region in a semiconductor substrate; a first field effect transistor (FET) disposed in the active region; and an isolation structure disposed in the active region. The FET includes a first gate; a first source formed in the active region and disposed on a first region adjacent the first gate from a first side; and a first drain formed in the active region and disposed on a second region adjacent the first gate from a second side. The isolation structure includes an isolation gate disposed adjacent the first drain; and an isolation source formed in the active region and disposed adjacent the isolation gate such that the isolation source and the first drain are on different sides of the isolation gate.

Abstract: An integrated circuit structure includes a semiconductor substrate; a first active region in the semiconductor substrate; and a second active region in the semiconductor substrate and of an opposite conductivity type than the first active region. A gate electrode strip is over the first and the second active regions and forms a first MOS device and a second MOS device with the first active region and the second active region, respectively. A first spacer bar is in the semiconductor substrate and connected to the first active region. At least a portion of the first spacer bar is adjacent to and spaced apart from a portion of the first active region. A second spacer bar is in the semiconductor substrate and connected to the second active region. At least a portion of the second spacer bar is adjacent to and spaced apart from a portion of the second active region.

Abstract: An integrated circuit structure includes an integrated circuit structure including a PMOS transistor including a first gate electrode; a first source region; and a first drain region; an NMOS transistor including a second gate electrode, wherein the first gate electrode and the second gate electrode are portions of a gate electrode strip; a second source region; and a second drain region. No additional transistors are formed between the PMOS transistor and the NMOS transistor. The integrated circuit further includes a VDD power rail connected to the first source region; a VSS power rail connected to the second source region; and an interconnection port electrically connected to the gate electrode strip. The interconnection port is on an outer side of a MOS pair region including the PMOS transistor, the NMOS transistor, and the region between the PMOS transistor and the NMOS transistor. The portion of the gate electrode strip in the MOS pair region is substantially straight.

Abstract: A new DRAM architecture, HPPC DRAM, is provided to support a high performance and low cost memory system. The HPPC DRAM has integrated the following concepts into a single DRAM chip. First, superset pin definitions backward-compatible to the traditional fast-page-mode DRAM SIMM. This allows one memory controller to support a memory system having both a traditional fast-page-mode DRAM and HPPC DRAM of this invention. Secondly, combining a memory array, a register of 4:1 Mux/Demux function, a RAS buffer/decoder, a CAS buffer/decoder, a burst address counter, a page register/comparator, a sequencer and a data buffer into a single DRAM IC chip. Using these intelligent peripheral circuits, the HPPC DRAM execute a pipeline cycle request and precharge cycle stealing. Thirdly, a precharge cycle stealing pipeline is implemented to the timing chain of read operation to eliminate the precharge cycle time which is achieved by executing read drive concurrently to the precharge cycle.

Abstract: A first user re-programmable interconnect architecture is provided wherein N switching elements are connected between selected interconnect conductors. The switching elements are controlled by M active storage elements, where M<N. A group of N switching elements are controlled by a group of M active storage elements, where M<N. The states of the M active storage elements are collectively decoded to identify the one of N switching elements to be turned on. A second user re-programmable interconnect architecture is provided wherein a group of N switching elements are connected between selected interconnect conductors and are partially selected by decoding the states of m.sub.1 active storage elements. The group of N switching elements are also partially selected by decoding the states of m.sub.2 active storage elements. The decoding is arranged such that the states of m.sub.1 and m.sub.

Abstract: Apparatus for forcing a memory cell to a user-selected logic level upon power-up includes circuitry for providing two signals PWRUP and PWRUPB which are used during chip power-up. At power-up, as V.sub.CC rises from 0 volt to 3.5 volts, the PWRUP signal follows V.sub.CC and the PWRUPB signal maintains 0 volts. The PWRUP and PWRUPB signals are used to drive the gates of P-Channel and N-Channel MOS transistors, respectively, including pass gates connected between word line driver circuits and bit line driver circuits driving the word lines and bit lines associated with the memory cells. In addition, the PWRUPB signal is used to drive P-Channel MOS pullup transistors connected between the word lines and V.sub.CC and bit lines and V.sub.CC. During power-up, the pass gates are disabled, disconnecting the word lines and bit lines from their drivers. The word lines and bit lines are forced to follow the rise of V.sub.CC by the P-Channel pullup transistors. When V.sub.

Abstract: A level-shifting static random access memory cell includes a first stage having a first P-Channel MOS transistor having its source connected to a high voltage supply rail, and its drain connected to the drain of a first N-Channel MOS transistor. The source of the first N-Channel MOS transistor is connected to the drain of a second N-Channel MOS transistor. The source of the second N-channel MOS transistor is connected to a VSS power supply rail. A second stage comprises a second P-Channel MOS transistor having its source connected to the high voltage supply rail V.sub.HS, and its drain connected to the drain of a third N-Channel MOS transistor. The source of the third N-Channel MOS transistor is connected to the drain of a fourth N-Channel MOS transistor. The source of the fourth N-channel MOS transistor is connected to VSS. The gates of the first and second P-Channel MOS transistors are cross coupled and the gates of the second and fourth N-Channel MOS transistors are cross coupled.

Abstract: A first passive ESD protection device for an electronic component in a microcircuit includes a fuse element shunting the component to be protected and includes a passive programming path from the outside of the microcircuit to the fuse element. A second passive ESD protection device is deactivatable and reactivatable and includes a first fuse element shunted by a second fuse element in series with a first antifuse element. Shunting the second fuse element with a third fuse element in series with a second antifuse element permits a second deactivation and reactivation to be performed. Additional deactivation/reactivation cycles may be permitted by providing additional series combinations of fuse elements and antifuse elements shunting the preceding fuse element. Combinations of the passive protection device and dual elements comprise ESD protection schemes which may be deactivated and activated multiple times.

Abstract: A first user re-programmable interconnect architecture is provided wherein N switching elements are connected between selected interconnect conductors. The switching elements are controlled by M active storage elements, where M<N. A group of N switching elements are controlled by a group of M active storage elements, where M<N. The states of the M active storage elements are collectively decoded to identify the one of N switching elements to be turned on. A second user re-programmable interconnect architecture is provided wherein a group of N switching elements are connected between selected interconnect conductors and are partially selected by decoding the states of m.sub.1 active storage elements. The group of N switching elements are also partially selected by decoding the states of m.sub.2 active storage elements. The decoding is arranged such that t the states of m.sub.1 and m.sub.