Patents by Inventor Ta-Wei Liu

Ta-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200312732
    Abstract: A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 1, 2020
    Inventors: Yen-Yao CHI, Nai-Wei LIU, Ta-Jen YU, Tzu-Hung LIN, Wen-Sung HSU, Shih-Chin LIN
  • Patent number: 10781266
    Abstract: An antibody, or an antigen-binding fragment there, binding human ENO1 (GenBank: AAH506421.1) is provided. Methods for treating an ENO1 protein-related disease or disorder, inhibiting cancer invasion and diagnosis of cancer are also provided.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: September 22, 2020
    Assignees: DEVELOPMENT CENTER FOR BIOTECHNOLOGY, NATIONAL HEALTH RESEARCH INSTITUTES
    Inventors: Shih-Chong Tsai, Ta-Tung Yuan, Shih-Chi Tseng, Jiann-Shiun Lai, Chia-Cheng Wu, Po-Yin Lin, Ya-Wei Tsai, Chao-Yang Huang, Ying-Yung Lok, Chung-Hsiun Wu, Hsien-Yu Tsai, Neng-Yao Shih, Ko-Jiunn Liu, Li-Tzong Chen
  • Publication number: 20200147158
    Abstract: The present invention relates to the preparation of a liquid fermentate of Sanghuangporus or an extract of Sanghuangporus, compounds identified from the liquid fermentate or the extract, and their novel activity.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 14, 2020
    Applicants: FOOD INDUSTRY RESEARCH AND DEVELOPMENT INSTITUTE, NATIONAL MUSEUM OF NATURAL SCIENCE
    Inventors: Sue-Fan Wu, Ta-Wei Liu, Ming-Der Wu, I-Ching Chen, Sheng-Hua Wu, Sung-Yuan Hsieh, Hing-Yuen Chan, Gwo-Fang Yuan, Ming-Jen Cheng
  • Publication number: 20200098545
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Application
    Filed: September 21, 2018
    Publication date: March 26, 2020
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Publication number: 20200091070
    Abstract: A semiconductor package structure including a semiconductor die having a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. A first protective insulating layer covers the first and third surfaces of the semiconductor die. A redistribution layer (RDL) structure is electrically coupled to the semiconductor die and surrounded by the first protective insulating layer on the first surface of the semiconductor die. A first passivation layer covers the first protective insulating layer and the RDL structure. At least one conductive structure passes through the first passivation layer and is electrically coupled to the RDL structure. A method of forming the semiconductor package is also provided.
    Type: Application
    Filed: June 3, 2019
    Publication date: March 19, 2020
    Applicant: MediaTek Inc.
    Inventors: Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu
  • Publication number: 20200083343
    Abstract: In some embodiments, an integrated circuit is provided. The integrated circuit may include an inner ring-shaped isolation structure that is disposed in a semiconductor substrate. Further, the inner-ring shaped isolation structure may demarcate a device region. An inner ring-shaped well is disposed in the semiconductor substrate and surrounds the inner ring-shaped isolation structure. A plurality of dummy gates are arranged over the inner ring-shaped well. Moreover, the plurality of dummy gates are arranged within an interlayer dielectric layer.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 12, 2020
    Inventors: Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei, Yi-Sheng Chen, Szu-Hsien Liu
  • Patent number: 10516029
    Abstract: In some embodiments, an integrated circuit is provided. The integrated circuit may include an inner ring-shaped isolation structure that is disposed in a semiconductor substrate. Further, the inner-ring shaped isolation structure may demarcate a device region. An inner ring-shaped well is disposed in the semiconductor substrate and surrounds the inner ring-shaped isolation structure. A plurality of dummy gates are arranged over the inner ring-shaped well. Moreover, the plurality of dummy gates are arranged within an interlayer dielectric layer.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei, Yi-Sheng Chen, Szu-Hsien Liu
  • Publication number: 20190322762
    Abstract: An antibody, or an antigen-binding fragment there, binding human ENO1 (GenBank: AAH506421.1) is provided. Methods for treating an ENO1 protein-related disease or disorder, inhibiting cancer invasion and diagnosis of cancer are also provided.
    Type: Application
    Filed: March 19, 2018
    Publication date: October 24, 2019
    Applicants: DEVELOPMENT CENTER FOR BIOTECHNOLOGY, NATIONAL HEALTH RESEARCH INSTITUTES
    Inventors: SHIH-CHONG TSAI, TA-TUNG YUAN, SHIH-CHI TSENG, JIANN-SHIUN LAI, CHIA-CHENG WU, PO-YIN LIN, YA-WEI TSAI, CHAO-YANG HUANG, YING-YUNG LOK, CHUNG-HSIUN WU, HSIEN-YU TSAI, NENG-YAO SHIH, KO-JIUNN LIU, LI-TZONG CHEN
  • Publication number: 20190296121
    Abstract: In some embodiments, an integrated circuit is provided. The integrated circuit may include an inner ring-shaped isolation structure that is disposed in a semiconductor substrate. Further, the inner-ring shaped isolation structure may demarcate a device region. An inner ring-shaped well is disposed in the semiconductor substrate and surrounds the inner ring-shaped isolation structure. A plurality of dummy gates are arranged over the inner ring-shaped well. Moreover, the plurality of dummy gates are arranged within an interlayer dielectric layer.
    Type: Application
    Filed: June 11, 2019
    Publication date: September 26, 2019
    Inventors: Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei, Yi-Sheng Chen, Szu-Hsien Liu
  • Patent number: 10340357
    Abstract: In some embodiments, an integrated circuit is provided. The integrated circuit may include an inner ring-shaped isolation structure that is disposed in a semiconductor substrate. Further, the inner-ring shaped isolation structure may demarcate a device region. An inner ring-shaped well is disposed in the semiconductor substrate and surrounds the inner ring-shaped isolation structure. A plurality of dummy gates are arranged over the inner ring-shaped well. Moreover, the plurality of dummy gates are arranged within an interlayer dielectric layer.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: July 2, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei, Yi-Sheng Chen, Szu-Hsien Liu
  • Publication number: 20190131283
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 2, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Patent number: 8986051
    Abstract: A socket connector having high current carrying capacity is provided by enlarging cross-section of particular terminals, to meet requirement such as transmitting large current or quick charge. Furthermore, a plug connector coupled with the socket connector, a connector assembly including the socket connector and the plug connector, and a handheld electronic device applying the socket connector are provided.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: March 24, 2015
    Assignee: HTC Corporation
    Inventors: Chih-Wei Tu, Ta-Wei Liu, I-Cheng Chuang
  • Publication number: 20150035767
    Abstract: A method for disabling a touch point and an electronic device adapted for this method are disclosed. The electronic device includes a touch screen and has a register table. The method includes periodically receiving touch information on the touch screen; generating touch point data corresponding to the touch information; updating the register table according to the touch point data; determining whether there exists a touch point in the register table that remains unmoved for more than a predetermined time period; and if yes, ignoring the touch point. Therefore, the method can exclude the effect to an application program due to unexpected touch behavior, so that the application program can keep operating normally.
    Type: Application
    Filed: June 23, 2014
    Publication date: February 5, 2015
    Inventors: Cheng-Chou Chen, Sung-Chen Yang, Ta-Wei Liu
  • Patent number: 8840334
    Abstract: A tiltable linkage mechanism including a first plate, a second plate, a swinging plate, a first hinge, a second hinge and a third hinge is provided. The first plate includes an upper surface, the second plate includes a bottom surface facing the upper surface of the first plate and a position limiting structure disposed on the bottom surface. The position limiting structure further has two opposite clamping surfaces. The first plate and the second plate pivotally connect with each other through the first hinge. The swinging plate and the first plate pivotally connect with each other through the second hinge. The swinging plate and the second plate pivotally connect with each other through the third hinge which is disposed in the position limiting structure. The third hinge has an end portion that can slide between the two clamping surfaces.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: September 23, 2014
    Assignee: HTC Corporation
    Inventors: Che-Hung Huang, Ta-Wei Liu
  • Patent number: 8785402
    Abstract: Methods of diagnosing Helicobacter pylori infection or associated conditions are based in part on the correlation of the presence of a ?-L-fucosidase 2 marker with the infection. Methods and compositions for treating or preventing Helicobacter pylori infection or associated conditions are based in part on administering an ?-L-fucosidase 2 inhibitor to an infected subject or a subject at risk of developing the infection.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: July 22, 2014
    Assignee: Academia Sinica
    Inventors: Chun-Hung Lin, Ta-Wei Liu
  • Patent number: 8670229
    Abstract: A handheld electronic device includes a first body, a second body stacked with the first body, a first plate between the first and second body and fixed to the first body, a second plate between the first plate and second body and fixed to the second body, a first locating structure, and a second locating structure. The first plate includes a sliding slot and a rib transversely disposed in the sliding slot and extended along the sliding slot. An edge of the second plate includes a sliding block clamped on the rib, so the second plate can move along the sliding slot. The first locating structure is disposed on the first plate and located on a moving path of the second plate. The second locating member is disposed on the sliding block, and adapted to interfere with the first locating structure on a locking position of the moving path.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: March 11, 2014
    Assignee: HTC Corporation
    Inventors: Hsin-Chih Liu, Ta-Wei Liu, Che-Hung Huang
  • Publication number: 20130149914
    Abstract: A socket connector having high current carrying capacity is provided by enlarging cross-section of particular terminals, to meet requirement such as transmitting large current or quick charge. Furthermore, a plug connector coupled with the socket connector, a connector assembly including the socket connector and the plug connector, and a handheld electronic device applying the socket connector are provided.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 13, 2013
    Applicant: HTC CORPORATION
    Inventors: Chih-Wei Tu, Ta-Wei Liu, I-Cheng Chuang
  • Publication number: 20120195677
    Abstract: A tiltable linkage mechanism including a first plate, a second plate, a swinging plate, a first hinge, a second hinge and a third hinge is provided. The first plate includes an upper surface, the second plate includes a bottom surface facing the upper surface of the first plate and a position limiting structure disposed on the bottom surface. The position limiting structure further has two opposite clamping surfaces. The first plate and the second plate pivotally connect with each other through the first hinge. The swinging plate and the first plate pivotally connect with each other through the second hinge. The swinging plate and the second plate pivotally connect with each other through the third hinge which is disposed in the position limiting structure. The third hinge has an end portion that can slide between the two clamping surfaces.
    Type: Application
    Filed: July 18, 2011
    Publication date: August 2, 2012
    Applicant: HTC CORPORATION
    Inventors: Che-Hung HUANG, Ta-Wei LIU
  • Patent number: D681556
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: May 7, 2013
    Assignee: HTC Corporation
    Inventors: Chih-Wei Tu, Ta-Wei Liu, I-Cheng Chuang
  • Patent number: D727674
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: April 28, 2015
    Assignee: Pegatron Corporation
    Inventors: Ta-Wei Liu, Cheng-Yi Lee