Patents by Inventor Ta-Wei Liu

Ta-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220122952
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: January 3, 2022
    Publication date: April 21, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20220057887
    Abstract: The present disclosure provides a touch screen control method and system. The touch screen control method includes steps of: (a) providing a smart device, wherein the smart device includes a touch screen and a sensor, the smart device has a software architecture, the software architecture includes an application layer, an application architecture layer, a hardware abstraction layer and a kernel layer, and the touch screen is controlled by a driver of the kernel layer; (b) utilizing the sensor to determine if an object is approaching to the touch screen when the smart device is in a call mode, performing a step (c) if the determining result is satisfied, performing the step (b) again if the determining result is not satisfied; (c) transmitting a sensing signal to the kernel layer through the hardware abstraction layer; and (d) turning off a specific area of the touch screen.
    Type: Application
    Filed: October 26, 2020
    Publication date: February 24, 2022
    Inventors: Ta-Wei Liu, Pu-Wei Wang
  • Patent number: 11217570
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 4, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20210390415
    Abstract: A dynamic gradient calibration method for a computing-in-memory neural network is performed to update a plurality of weights in a computing-in-memory circuit according to a plurality of inputs corresponding to a correct answer. A forward operating step includes performing a bit wise multiply-accumulate operation on a plurality of divided inputs and a plurality of divided weights to generate a plurality of multiply-accumulate values, and performing a clamping function on the multiply-accumulate values to generate a plurality of clamped multiply-accumulate values according to a predetermined upper bound value, and comparing the clamped multiply-accumulate values with the correct answer to generate a plurality of loss values. A backward operating step includes performing a partial differential operation on the loss values relative to the weights to generate a weight-based gradient. The weights are updated according to the weight-based gradient.
    Type: Application
    Filed: June 16, 2020
    Publication date: December 16, 2021
    Inventors: Meng-Fan CHANG, Shao-Hung HUANG, Ta-Wei LIU
  • Publication number: 20210248478
    Abstract: A quantization method for a plurality of partial sums of a convolution neural network based on a computing-in-memory hardware includes a probability-based quantizing step and a margin-based quantizing step. The probability-based quantizing step includes a network training step, a quantization-level generating step, a partial-sum quantizing step, a first network retraining step and a first accuracy generating step. The margin-based quantizing step includes a quantization edge changing step, a second network retraining step and a second accuracy generating step. The quantization edge changing step includes changing a quantization edge of at least one of a plurality of quantization levels. The probability-based quantizing step is performed to generate a first accuracy value, and the margin-based quantizing step is performed to generate a second accuracy value. The second accuracy value is greater than the first accuracy value.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 12, 2021
    Inventors: Meng-Fan CHANG, Jing-Hong WANG, Ta-Wei LIU
  • Patent number: 11061507
    Abstract: A method for controlling a touch system capable of reducing electromagnetic interference includes generating a first transmitting signal with a first frequency and a first alternating current shielding signal with the first frequency, transmitting the first transmitting signal to a first scan line of a plurality of scan lines of a touch panel, transmitting the first alternating current shielding signal to the plurality of scan lines exclusive of the first scan line, generating a second transmitting signal with a second frequency and a second alternating current shielding signal with the second frequency, transmitting the second transmitting signal to a second scan line of the plurality of scan lines, and transmitting the second alternating current shielding signal to the plurality of scan lines exclusive of the second scan line.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: July 13, 2021
    Assignee: ITE Tech. Inc.
    Inventors: Yi-Chung Chou, Hsu-Min Chen, Ta-Wei Liu
  • Patent number: 11016714
    Abstract: A multi-screen splicing structure has a plurality of display devices. Each display device includes a display panel, a plurality of transceivers, a wireless communications module, and a control circuit. Each transceiver has a transmitting component and a receiving component. The control circuit is coupled to the display panel, the transceivers and the wireless communications module, and is used to turn on the wireless communications module when the control circuit determines that another display device is approaching based on a status of signals received by the receiving components of the transceivers to enable the wireless communications module performing wireless communications with a wireless communications module of another display device. The control circuit may also control an orientation of an image relative to the display panel according to the status of signals received by the receiving components of the transceivers of the display device.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: May 25, 2021
    Assignees: BENQ CORPORATION
    Inventors: Chin-Jui Chi, Ta-Wei Liu, Pei-Wen Huang
  • Publication number: 20210041981
    Abstract: A method for controlling a touch system capable of reducing electromagnetic interference includes generating first frequency data, generating a first transmitting signal with a first frequency and a first alternating current shielding signal with the first frequency according to the first frequency data, transmitting the first transmitting signal to a first scan line of a plurality of scan lines of a touch panel, transmitting the first alternating current shielding signal to the plurality of scan lines exclusive of the first scan line, generating second frequency data, generating a second transmitting signal with a second frequency and a second alternating current shielding signal with the second frequency according to the second frequency data, transmitting the second transmitting signal to a second scan line of the plurality of scan lines, and transmitting the second alternating current shielding signal to the plurality of scan lines exclusive of the second scan line.
    Type: Application
    Filed: November 14, 2019
    Publication date: February 11, 2021
    Inventors: Yi-Chung Chou, Hsu-Min Chen, Ta-Wei Liu
  • Publication number: 20210018999
    Abstract: A touch pad driving device and a touch driving method are provided. The touch pad driving device is configured to scan a plurality of sensing channels of a touch pad, cause the selected sensing channel in the plurality of sensing channels receive a touch driving signal, cause the sensing channels adjacent to or around the selected sensing channel receive a shielding signal, and cause the remaining sensing channels receive a reference signal, so as to reduce electromagnetic interference generated by the touch pad.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 21, 2021
    Applicant: ITE Tech. Inc.
    Inventors: Yi-Chung Chou, Chih-Yuan Kuo, Ta-Wei Liu
  • Patent number: 10890989
    Abstract: A touch pad driving device and a touch driving method are provided. The touch pad driving device is configured to scan a plurality of sensing channels of a touch pad, cause the selected sensing channel in the plurality of sensing channels receive a touch driving signal, cause the sensing channels adjacent to or around the selected sensing channel receive a shielding signal, and cause the remaining sensing channels receive a reference signal, so as to reduce electromagnetic interference generated by the touch pad.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: January 12, 2021
    Assignee: ITE Tech. Inc.
    Inventors: Yi-Chung Chou, Chih-Yuan Kuo, Ta-Wei Liu
  • Publication number: 20200380905
    Abstract: A multi-screen splicing structure has a plurality of display devices. Each display device has a display panel, a sensing module, and a control circuit. When the sensing module of a display device senses the sensing module of another display device, the control circuit determines which side of the display panel is adjacent to the proximate display device according to the sensing states of a plurality of sensors of the sensing module. The control circuit controls a portion of pixels adjacent to the proximate display device to display a pattern.
    Type: Application
    Filed: April 20, 2020
    Publication date: December 3, 2020
    Inventors: Chin-Jui Chi, Pei-Wen Huang, Ta-Wei Liu
  • Publication number: 20200379705
    Abstract: A multi-screen splicing structure has a plurality of display devices. Each display device includes a display panel, a plurality of transceivers, a wireless communications module, and a control circuit. Each transceiver has a transmitting component and a receiving component. The control circuit is coupled to the display panel, the transceivers and the wireless communications module, and is used to turn on the wireless communications module when the control circuit determines that another display device is approaching based on a status of signals received by the receiving components of the transceivers to enable the wireless communications module performing wireless communications with a wireless communications module of another display device. The control circuit may also control an orientation of an image relative to the display panel according to the status of signals received by the receiving components of the transceivers of the display device.
    Type: Application
    Filed: April 14, 2020
    Publication date: December 3, 2020
    Inventors: Chin-Jui Chi, Ta-Wei Liu, Pei-Wen Huang
  • Publication number: 20200251456
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: April 23, 2020
    Publication date: August 6, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20200147158
    Abstract: The present invention relates to the preparation of a liquid fermentate of Sanghuangporus or an extract of Sanghuangporus, compounds identified from the liquid fermentate or the extract, and their novel activity.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 14, 2020
    Applicants: FOOD INDUSTRY RESEARCH AND DEVELOPMENT INSTITUTE, NATIONAL MUSEUM OF NATURAL SCIENCE
    Inventors: Sue-Fan Wu, Ta-Wei Liu, Ming-Der Wu, I-Ching Chen, Sheng-Hua Wu, Sung-Yuan Hsieh, Hing-Yuen Chan, Gwo-Fang Yuan, Ming-Jen Cheng
  • Patent number: 10636775
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: April 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20190131283
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 2, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Patent number: 8986051
    Abstract: A socket connector having high current carrying capacity is provided by enlarging cross-section of particular terminals, to meet requirement such as transmitting large current or quick charge. Furthermore, a plug connector coupled with the socket connector, a connector assembly including the socket connector and the plug connector, and a handheld electronic device applying the socket connector are provided.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: March 24, 2015
    Assignee: HTC Corporation
    Inventors: Chih-Wei Tu, Ta-Wei Liu, I-Cheng Chuang
  • Publication number: 20150035767
    Abstract: A method for disabling a touch point and an electronic device adapted for this method are disclosed. The electronic device includes a touch screen and has a register table. The method includes periodically receiving touch information on the touch screen; generating touch point data corresponding to the touch information; updating the register table according to the touch point data; determining whether there exists a touch point in the register table that remains unmoved for more than a predetermined time period; and if yes, ignoring the touch point. Therefore, the method can exclude the effect to an application program due to unexpected touch behavior, so that the application program can keep operating normally.
    Type: Application
    Filed: June 23, 2014
    Publication date: February 5, 2015
    Inventors: Cheng-Chou Chen, Sung-Chen Yang, Ta-Wei Liu
  • Patent number: 8840334
    Abstract: A tiltable linkage mechanism including a first plate, a second plate, a swinging plate, a first hinge, a second hinge and a third hinge is provided. The first plate includes an upper surface, the second plate includes a bottom surface facing the upper surface of the first plate and a position limiting structure disposed on the bottom surface. The position limiting structure further has two opposite clamping surfaces. The first plate and the second plate pivotally connect with each other through the first hinge. The swinging plate and the first plate pivotally connect with each other through the second hinge. The swinging plate and the second plate pivotally connect with each other through the third hinge which is disposed in the position limiting structure. The third hinge has an end portion that can slide between the two clamping surfaces.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: September 23, 2014
    Assignee: HTC Corporation
    Inventors: Che-Hung Huang, Ta-Wei Liu
  • Patent number: D727674
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: April 28, 2015
    Assignee: Pegatron Corporation
    Inventors: Ta-Wei Liu, Cheng-Yi Lee