Abstract: A multi-screen splicing structure has a plurality of display devices. Each display device has a display panel, a sensing module, and a control circuit. When the sensing module of a display device senses the sensing module of another display device, the control circuit determines which side of the display panel is adjacent to the proximate display device according to the sensing states of a plurality of sensors of the sensing module. The control circuit controls a portion of pixels adjacent to the proximate display device to display a pattern.

Abstract: A multi-screen splicing structure has a plurality of display devices. Each display device includes a display panel, a plurality of transceivers, a wireless communications module, and a control circuit. Each transceiver has a transmitting component and a receiving component. The control circuit is coupled to the display panel, the transceivers and the wireless communications module, and is used to turn on the wireless communications module when the control circuit determines that another display device is approaching based on a status of signals received by the receiving components of the transceivers to enable the wireless communications module performing wireless communications with a wireless communications module of another display device. The control circuit may also control an orientation of an image relative to the display panel according to the status of signals received by the receiving components of the transceivers of the display device.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: The present invention relates to the preparation of a liquid fermentate of Sanghuangporus or an extract of Sanghuangporus, compounds identified from the liquid fermentate or the extract, and their novel activity.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A socket connector having high current carrying capacity is provided by enlarging cross-section of particular terminals, to meet requirement such as transmitting large current or quick charge. Furthermore, a plug connector coupled with the socket connector, a connector assembly including the socket connector and the plug connector, and a handheld electronic device applying the socket connector are provided.

Abstract: A method for disabling a touch point and an electronic device adapted for this method are disclosed. The electronic device includes a touch screen and has a register table. The method includes periodically receiving touch information on the touch screen; generating touch point data corresponding to the touch information; updating the register table according to the touch point data; determining whether there exists a touch point in the register table that remains unmoved for more than a predetermined time period; and if yes, ignoring the touch point. Therefore, the method can exclude the effect to an application program due to unexpected touch behavior, so that the application program can keep operating normally.

Abstract: A tiltable linkage mechanism including a first plate, a second plate, a swinging plate, a first hinge, a second hinge and a third hinge is provided. The first plate includes an upper surface, the second plate includes a bottom surface facing the upper surface of the first plate and a position limiting structure disposed on the bottom surface. The position limiting structure further has two opposite clamping surfaces. The first plate and the second plate pivotally connect with each other through the first hinge. The swinging plate and the first plate pivotally connect with each other through the second hinge. The swinging plate and the second plate pivotally connect with each other through the third hinge which is disposed in the position limiting structure. The third hinge has an end portion that can slide between the two clamping surfaces.

Abstract: Methods of diagnosing Helicobacter pylori infection or associated conditions are based in part on the correlation of the presence of a ?-L-fucosidase 2 marker with the infection. Methods and compositions for treating or preventing Helicobacter pylori infection or associated conditions are based in part on administering an ?-L-fucosidase 2 inhibitor to an infected subject or a subject at risk of developing the infection.

Abstract: A handheld electronic device includes a first body, a second body stacked with the first body, a first plate between the first and second body and fixed to the first body, a second plate between the first plate and second body and fixed to the second body, a first locating structure, and a second locating structure. The first plate includes a sliding slot and a rib transversely disposed in the sliding slot and extended along the sliding slot. An edge of the second plate includes a sliding block clamped on the rib, so the second plate can move along the sliding slot. The first locating structure is disposed on the first plate and located on a moving path of the second plate. The second locating member is disposed on the sliding block, and adapted to interfere with the first locating structure on a locking position of the moving path.

Abstract: A socket connector having high current carrying capacity is provided by enlarging cross-section of particular terminals, to meet requirement such as transmitting large current or quick charge. Furthermore, a plug connector coupled with the socket connector, a connector assembly including the socket connector and the plug connector, and a handheld electronic device applying the socket connector are provided.

Abstract: A tiltable linkage mechanism including a first plate, a second plate, a swinging plate, a first hinge, a second hinge and a third hinge is provided. The first plate includes an upper surface, the second plate includes a bottom surface facing the upper surface of the first plate and a position limiting structure disposed on the bottom surface. The position limiting structure further has two opposite clamping surfaces. The first plate and the second plate pivotally connect with each other through the first hinge. The swinging plate and the first plate pivotally connect with each other through the second hinge. The swinging plate and the second plate pivotally connect with each other through the third hinge which is disposed in the position limiting structure. The third hinge has an end portion that can slide between the two clamping surfaces.

Abstract: An ejecting mechanism capable of preventing an accidental touch is disposed in a housing having a tray and used for ejecting the tray out of the housing. The ejecting mechanism includes a tray ejecting button and a front cover. The front cover is disposed at the housing and located at the ejecting direction of the tray. The front cover has a sliding key including a pressing body and a triggering body connected to one end of the pressing body. When the pressing body drives the triggering body to slide until the triggering body aligns to the tray ejecting button, the pressing body is capable of being forced to drive one end of the triggering body to trigger the tray ejecting button to eject the tray.

Abstract: A handheld electronic device includes a first body, a second body stacked with the first body, a first plate between the first and second body and fixed to the first body, a second plate between the first plate and second body and fixed to the second body, a first locating structure, and a second locating structure. The first plate includes a sliding slot and a rib transversely disposed in the sliding slot and extended along the sliding slot. An edge of the second plate includes a sliding block clamped on the rib, so the second plate can move along the sliding slot. The first locating structure is disposed on the first plate and located on a moving path of the second plate. The second locating member is disposed on the sliding block, and adapted to interfere with the first locating structure on a locking position of the moving path.

Abstract: A battery pack of a handheld device has two coupling sections configured at a side surface in the face of a battery slot of the handheld device, where the coupling sections correspond to a coupling structure of the battery slot. As the battery pack is installed in the battery slot, the coupling sections engage with the coupling structure respectively for keeping the battery pack from detaching out of the battery slot. The battery pack may also have an upturned position to be installed in a second type of battery slot of another handheld device, where the coupling sections also correspond to and engage with a coupling structure of the second battery slot and keep the battery pack from detaching out of the second battery slot.