Tadashi Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: Using a scanning type electron microscope, a spot where a particle is detected is determined by acquiring the evaluation of detection of particles on the surface of a wafer, etc., based on the coordinate information of a particle spot, by particle detection equipment, from the image within the view, shifting the view from the most probable spot of particle existence to less probable spots in sequence, and manipulating evaluation of detection as follows; supposing that the variance of histogram of the image is .sigma., and that the value N is equal to or more than 3, which is empirically known, and assuming that the spots where the data out of the range of .+-.N.sigma. exist is that of particles detected, pixels of particles are counted. In this manipulation, weighting corresponding to the spot of histogram and weighting corresponding to the mean of intensity of detection at the neighborhood of particles are executed.
Abstract: A method of automatically setting a coordinate conversion factor in which, under the condition where a sample having a simple contour, such as a wafer with a known contour, is installed in a shape observing unit, in order to determine the conversion factor between a coordinate system defined by the contour of the sample and a control coordinate system for an observing position such as a stage coordinate system, the edge position of the contour of the sample is automatically recognized at a high accuracy from a secondary electron picture which has been obtained from the shape observing unit, from the result of which the conversion factor between the sample coordinate system and the stage coordinate system is automatically set.
Abstract: There is disclosed a resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 of number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 of number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 of number-average molecular weight is disclosed. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used to reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.
Abstract: The invention provides oiled-face adherable, hot-melt adhesive composition which has constitutive components consisting of thermoplastic resin such as ethylene-acrylate ester resin, tacky resin such as rosin ester derivative and waxes such as paraffin wax and/or plasticizer such as naphthene oil, and also contains modified resin components obtained by introducing into the molecular chains of these components a phosphoric acid group or, if desired, a carboxyl or its anhydride group, for example, by grafting 2-hydroxy-3-(meth)acryloxypropyl phosphate.By providing the composition, adhesion and seal of metals with difficulty adhesive plastics are improved and a non-slip processing method of face-oiled metal scaffolding boards can be accomplished.
Abstract: Conductive cured products which have superior initial conductivity which is substantially retained even under high temperature and humidity conditions are obtained by curing a resinous composition comprising (a) a metallic copper powder, (b) a copper compound, (c) a compound having a 1,4-dihydroxy benzene ring or 1,2-dihydroxy benzene ring structure, and (d) a resinous curable component. Additionally, inclusion of a chelate forming compound in the uncured composition prevents a curing phenomenon on the surface of the composition during storage. The compound having the dihydroxy benzene ring (compound c) reduces the copper compound (b) to deposit metallic copper, and the resinous curable component integrates the constituents into a conductive product upon curing. The compositions are used as paints, adhesives, printing inks, and moulded articles, and they are useful in the electric, electronic, automobile, and housing fields.
Abstract: Process for producing conductive cured products are disclosed. In one embodiment a copper compound is reacted with a reducing substance capable of reducing said copper compound to metallic copper, in the presence of a metallic copper powder on a substrate, thereby reducing the copper compound to metallic copper and forming a conductive connected unit of said metallic copper powder, and the connected unit is then subjected to cure molding with a resinous curable component to integrate the constituent elements into the conductive cured product. In a second embodiment, the ligand portion of a copper compound of a ligand capable of reducing copper in a compound state is reacted with the copper moiety present in said copper compound in the presence of a metallic copper powder on a substrate. The copper moiety is reduced and precipitated to form a conductive connected unit of a metallic copper powder and the connected unit is then subjected to cure molding with a resinous curable component.