Abstract: A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component.

Abstract: A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.

Abstract: A method of manufacturing a multilayer printed circuit board, including providing a substrate, embedding an electronic component having a die pad on a surface of the component into the substrate such that the component has the surface and pad exposed from a surface of the substrate, forming a metallic layer including metallic film layers such that the surface of the substrate and the pad and surface of the component are covered with the metallic layer, providing a resist on the metallic layer such that a portion of the metallic layer on the pad is exposed from the resist, forming a thickening metallic layer on the portion of the metallic layer exposed, removing the resist from the substrate and surface of the component, and etching to remove the metallic layer such that a mediate layer including the portion of the metallic layer is formed between the pad and the thickening layer.

Abstract: A game controller includes at least four load sensors for detecting a load applied on a support board on which player's legs are ridden, and the game controller transmits a load value detected as manipulation data by the four load sensors to a game machine. The game machine determines a necessary quantity of load values, and the game machine computes the necessary quantity of load values based on the detected load value from the game controller. Then, game processing is performed based on the necessary quantity of computed load values.

Abstract: A game controller includes at least four load sensors for detecting a load applied on a support board on which player's legs are ridden, and the game controller transmits a load value detected as manipulation data by the four load sensors to a game machine. The game machine determines a necessary quantity of load values, and the game machine computes the necessary quantity of load values based on the detected load value from the game controller. Then, game processing is performed based on the necessary quantity of computed load values.

Abstract: A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component.

Abstract: A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.

Abstract: A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, removing a film on a surface of a die pad of said electronic component, forming a mediate layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad, forming the interlayer insulating layers on said substrate, and forming the via holes connected to the conductor circuits and the mediate layers, in said interlayer resin insulating layers.

Abstract: An image forming apparatus includes an apparatus body which includes an attachment portion, a standby tray which is provided adjacent to the attachment portion of the apparatus body and stacks a paper thereon, a paper feeding tray stacks the paper thereon, a movement mechanism which moves the paper from the paper feeding tray located at the mounted position onto the standby tray along the paper conveying path, a holder member which moves to a first position so as to hold the paper at a predetermined position on the paper feeding tray and moves to a second position so as to recede from the paper conveying path, and a lock mechanism which engages with the holder member so as to hold the holder member at the first position when the paper feeding tray is located at the withdrawn position.

Abstract: An image forming apparatus according to the present invention includes: a first sheet feeding unit; a second sheet feeding unit provided adjacent to the first sheet feeding unit; one or plural first shutter(s) provided in the first sheet feeding unit; a driving unit that drives the first shutter(s); and one or plural second shutter(s) provided in the second sheet feeding unit, the second shutter(s) opening and closing in association with the opening and closing of the first shutter(s) driven by the driving unit. According to the present invention, when plural shutters for designating a stacking range of sheets are provided, an operation of any one of the shutters can be suitably associated with operations of the other shutters.

Abstract: Upon receipt of an IR code from a remote controller, a peripheral device control apparatus generates, on the basis of peripheral device control information acquired from a server, a code for causing a peripheral device, which is an object of remote control by the control apparatus, to perform an operation as instructed by the received IR code, and then the control apparatus outputs the generated code as an IR code via an infrared ray generation section. In this way, the peripheral device control apparatus can readily control any one of a plurality of types of peripheral devices, in response to a user just giving an operation signal to a single input section.

Abstract: A multilayer printed circuit board has an IC chip included in a core substrate in advance, and an intermediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the intermediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole, and to improve reliability.

Abstract: A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.

Abstract: A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.

Abstract: A belt guide anchor is provided to improve handling operability of a seat belt even when a belt opening angle between a portion of the seat belt adjacent to a retractor and that adjacent to an occupant is increased. A belt guide anchor has a belt insertion hole into which a seat belt is fitted so as to be slidable and expanded portions formed on surfaces of the belt guide anchor facing the interior and exterior, respectively, of the vehicle adjacent to the belt insertion hole. In one form, a thin portion is formed in the expanded portion on the surface facing the interior of the vehicle at a position adjoining a part of the belt insertion hole facing the front side of the vehicle, and a thin part is formed in the expanded portion on the surface facing the exterior of the vehicle at a position adjoining a part of the belt insertion hole facing the rear side of the vehicle.

Abstract: A multilayer printed circuit board has an IC chip (20) included in a core substrate (30) in advance and a transition layer (38) provided on a pad (24) of the IC chip (20). Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer (38) made of copper on the die pad (24), it is possible to prevent resin residues on the pad (24) and to improve connection characteristics between the pad (24) and a via hole (60) and reliability.

Abstract: Audio data which are read out from a compact disc drive are written into a hard disk drive (6) at a rate that is higher than an audio playback rate. The written audio data are read out at a rate which is higher than the audio playback rate, and than output to audio output interfaces (buffer memories). The audio output interfaces read out the audio data at the playback rate and output the data. Since the hard disk drive (6) can perform reading/writing at a rate which is sufficiently higher than the playback rate of audio data, monitoring is enabled while performing ripping.

Abstract: A process for producing a glass molding, in which a glass molding of stable quality can be efficiently produced through minimizing of temperature fluctuation of molten glass drops at pressure molding operation; and an apparatus for production of a glass molding used in this process. Molten glass drops are fed into an inferior die by causing the molten glass drops to fall from above toward the inferior die. The arrival of molten glass drops having fallen at a given location is detected, and pressurization of the molten glass drops by means of molding dies is initiated upon the passage of a given time since the detection.

Abstract: A wireless network system includes a user device, a client and an access point. In the wireless network system, a wireless network mode of the client is started in an AdHoc mode in response to specific operation, a wireless network mode of the user device is switched to an AdHoc mode when it is detected that the wireless network mode of the client is started in the AdHoc mode. Then, infrastructure network information including a network name and an encryption key for setting the wireless network communication in the infrastructure mode is transmitted from the user device to the client, and the wireless network mode of the client is switched to the infrastructure mode on the basis of the infrastructure network information.

Abstract: A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, removing a film on a surface of a die pad of said electronic component, forming a mediate layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad, forming the interlayer insulating layers on said substrate, and forming the via holes connected to the conductor circuits and the mediate layers, in said interlayer resin insulating layers.