Abstract: When an emphasis setting of a next track is different from that of a current track, a silent signal having the emphasis setting of the next track written in its subcode information is output for a predetermined time prior to reproduction of the next track. The emphasis setting is changed for the next track while the silent signal is being output, so that the next track can be reproduced appropriately without involving an unwanted lack in its leading portion.

Abstract: Audio data which are read out from a compact disc drive are written into a hard disk drive (6) at a rate that is higher than an audio playback rate. The written audio data are read out at a rate which is higher than the audio playback rate, and then output to audio output interfaces (buffer memories). The audio output interfaces read out the audio data at the playback rate and output the data. Since the hard disk drive (6) can perform reading/writing at a rate which is sufficiently higher than the playback rate of audio data, monitoring is enabled while performing ripping.

Abstract: A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.

Abstract: An optical compensatory sheet producing apparatus produces an optical compensatory sheet having a liquid crystal layer. In the apparatus, a rubbing unit is supplied with resin film having a first layer including resin, and subjects the first layer to a rubbing process, so as to form an orientation layer. A dust remover removes dust from the orientation layer by use of liquid such as perfluorocarbon, to which the orientation layer is insoluble. A liquid crystal layer coater is disposed downstream from the dust remover, for coating the orientation layer with coating liquid including liquid crystalline compound, so that the liquid crystal layer is formed.

Abstract: An image forming apparatus according to the present invention includes: a first sheet feeding unit; a second sheet feeding unit provided adjacent to the first sheet feeding unit; one or plural first shutter(s) provided in the first sheet feeding unit; a driving unit that drives the first shutter(s); and one or plural second shutter(s) provided in the second sheet feeding unit, the second shutter(s) opening and closing in association with the opening and closing of the first shutter(s) driven by the driving unit. According to the present invention, when plural shutters for designating a stacking range of sheets are provided, an operation of any one of the shutters can be suitably associated with operations of the other shutters.

Abstract: A game system includes a game apparatus. To the game apparatus are connected a monitor, a controller, and a load controller. When the game apparatus starts a game, prior to starting the main content, a weight value of a player is detected and the weight value is set as a reference value. When the reference value is already set, the detected weight value of the player is compared with the reference value. When a comparison result shows a match, the game apparatus continues game play. On the other hand, when the comparison result shows a mismatch, the game apparatus confirms the player whether to continue the game and when the game is continued, the weight value of the player detected this time is reset as the reference value.

Abstract: When a write operation is to be performed for writing digital audio data (track), stored on a hard disk, to a CDR disk in an audio-digital-signal recording apparatus, control is performed, prior to execution of the write operation, such that the digital audio data stored on the hard disk can not be accessed by any other operation than the write operation, to thereby cause the other operation to regard the digital audio data as already erased from the storage section. After completion of the writing or copying of the digital audio data to the disk-shaped storage medium, the digital audio data are actually erased from the hard disk. Thus, even when power failure or shutdown occurs immediately after the copying of the digital audio data and before initiation of the audio data erasure from the hard disk, any operation, other than the write operation, can be prevented from accessing the digital audio data, so that the copyright on the digital audio data can be protected.

Abstract: A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.

Abstract: An image forming apparatus includes an apparatus body which includes an attachment portion, a standby tray which is provided adjacent to the attachment portion of the apparatus body and stacks a paper thereon, a paper feeding tray stacks the paper thereon, a movement mechanism which moves the paper from the paper feeding tray located at the mounted position onto the standby tray along the paper conveying path, a holder member which moves to a first position so as to hold the paper at a predetermined position on the paper feeding tray and moves to a second position so as to recede from the paper conveying path, and a lock mechanism which engages with the holder member so as to hold the holder member at the first position when the paper feeding tray is located at the withdrawn position.

Abstract: The paper thickness of a medium to be recorded is detected, and the pressurization force of a conveyance roller is controlled. When a thick paper is detected, the pressurization force of the conveyance roller is made high. When a normal paper or a thin paper is detected, the pressurization force of the conveyance roller is decreased or the pressurization is released.

Abstract: A game controller includes at least four load sensors for detecting a load applied on a support board on which player's legs are ridden, and the game controller transmits a load value detected as manipulation data by the four load sensors to a game machine. The game machine determines a necessary quantity of load values, and the game machine computes the necessary quantity of load values based on the detected load value from the game controller. Then, game processing is performed based on the necessary quantity of computed load values.

Abstract: A belt guide anchor is provided to improve handling operability of a seat belt even when a belt opening angle between a portion of the seat belt adjacent to a retractor and that adjacent to an occupant is increased. A belt guide anchor has a belt insertion hole into which a seat belt is fitted so as to be slidable and expanded portions formed on surfaces of the belt guide anchor facing the interior and exterior, respectively, of the vehicle adjacent to the belt insertion hole. In one form, a thin portion is formed in the expanded portion on the surface facing the interior of the vehicle at a position adjoining a part of the belt insertion hole facing the front side of the vehicle, and a thin part is formed in the expanded portion on the surface facing the exterior of the vehicle at a position adjoining a part of the belt insertion hole facing the rear side of the vehicle.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: The present invention relates to a manufacturing method for an optical glass element, in which molten glass 9 is pressed between a lower mold 1 and an upper mold 8, and the pressing process is carried out while maintaining a space 10 between a border area (5, 6) of a molding face 2 belonging to the lower mold 1 and a circumferential face 3 located on the periphery thereof and glass 9, and an optical glass element manufactured by such a method.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A preform is supplied between a pair of molding dies, followed by heating, softening and pressing. A smallest radius of curvature in the preform is smaller than a radius of a globular member having a volume equal to that of the preform. In this fabricating method, -an abutment portion between the molding die and the preform is located at a curved surface or the center of the molding die, thereby preventing any local abutment of the preform against the molding die.