Patents by Inventor Tadashi Watanabe

Tadashi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11117379
    Abstract: An ink replenish container comprises a container main body that is able to store the ink; an ink outlet formation member, attached to a front end side of the container main body, to form an ink outlet; and a cap attachable to a front end side of the ink outlet formation member. The ink outlet includes an outer circumferential surface and an inner circumferential surface located inward of the outer circumferential surface, the inner circumferential surface surrounding an opening through which the ink passes. The cap includes a first protrusion that is configured to contact with the outer circumferential surface of the ink outlet to form a first exit seal portion, and a second protrusion that is configured to contact with the inner circumferential surface of the ink outlet to form a second exit seal portion.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: September 14, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Noriyuki Fukasawa, Taku Ishizawa, Tadashi Watanabe, Ryoichi Tanaka, Tadahiro Mizutani
  • Patent number: 11102443
    Abstract: Provided is a tuner module including: a casing body adapted to house a tuner module board on which a tuner function unit is formed; and at least one antenna connector fixed to the casing body and having a terminal portion of a center electrode connected to the tuner module board, in which the casing body includes a plate-like portion formed with a hole portion into which a screw member is inserted, and a plurality of protrusions is provided apart from each other at a peripheral portion of the hole portion.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: August 24, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Koki Hino, Toyomi Fujino, Tadashi Imai, Makoto Watanabe, Toshiyuki Sudo
  • Publication number: 20210249522
    Abstract: A method for manufacturing a semiconductor device includes steps of forming a protective film on a semiconductor substrate, forming a resist film on the protective film such that the resist film includes a region where the resist film becomes thicker from a drain electrode to a source electrode, forming a first opening in the resist film by irradiating the resist film in the region with an electron beam and developing the resist film, forming a second opening that exposes an upper surface of semiconductor substrate by removing the protective film using the resist film on which the first opening is formed as a mask, forming a third opening in the resist film by further developing the resist film after forming the second opening, the third opening being formed by expanding the first opening toward the drain electrode, and forming a gate electrode in the second and the third openings.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 12, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Tadashi WATANABE
  • Publication number: 20210216014
    Abstract: A method for manufacturing a semiconductor device includes steps of forming a first photoresist film on a semiconductor substrate, and forming a second photoresist film having a higher acidity than the first photoresist film on the first photoresist film, forming an opening for exposing a surface of the semiconductor substrate by patterning the first photoresist film and the second photoresist film, applying a shrink material to an upper surface of the second photoresist film and an inside of the opening, and reacting the shrink material and the second photoresist film in the inside of the opening by heat-treating the first photoresist film, the second photoresist film and the shrink material, and removing an unreacted shrink material that do not react with the second photoresist film from the upper surface of the second photoresist film and the inside of the opening.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 15, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tadashi WATANABE, Takahide HIRASAKI
  • Patent number: 11045069
    Abstract: A flexible waveguide includes an inner dielectric, and a flexible external conductor disposed in a position covering an outer periphery of the dielectric, the flexible waveguide conducting a radio wave in a frequency band equal to or longer than a millimeter wave or a submillimeter wave near 60 GHz or more. The external conductor includes a metal layer, the metal layer has a shape displacement structure, a shape of an inner periphery side section of which faces the inner dielectric and is cyclic in the waveguide longitudinal direction, the shape displacement structure being a cyclic structure satisfying ?mr<?ch, where ?mr represents a center wavelength of a main reflection band due to the cyclic structure and ?ch represents a cutoff wavelength in a high-order mode of the waveguide.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: June 29, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Keigo Ito, Tadashi Watanabe
  • Patent number: 11046025
    Abstract: A method of producing a resin-impregnated fiber bundle roll body includes unwinding a fiber bundle from a bobbin; winding the fiber bundle on a winding core rotating around a fixed axis through a movable winding head to prepare a product; and leading the fiber bundle taken off in the unwinding to the winding between the unwinding and winding, wherein the leading or winding includes a resin impregnating the fiber bundle, and the winding includes a fiber content calculation of a fiber content in a layer of the fiber bundle on the winding core of an intermediate product to control one according to the fiber content: a resin adhesion amount in the resin adhesion operation; a winding tension of the fiber bundle applied to the intermediate product; a removal amount of a surplus resin layer on an outer surface of the intermediate product; and a resin viscosity in the intermediate product.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: June 29, 2021
    Assignee: Toray Industries, Inc.
    Inventors: Jumpei Takahashi, Shigeru Kawashima, Daisuke Nagamatsu, Tadashi Watanabe
  • Publication number: 20210167188
    Abstract: A process of forming a field effect transistor (FET) of a type of high electron mobility transistor (HEMT) reducing damages caused in a semiconductor layer is disclosed. The process carries out steps of: (a) depositing an insulating film on a semiconductor stack; (b) depositing a conductive film on the insulating film; (c) forming an opening in the conductive film and the insulating film by a dry-etching using ions of reactive gas to expose a surface of the semiconductor stack; and (d) forming a gate electrode to be in contact with the surface of the semiconductor stack through the opening, the gate electrode filling the opening in the conductive film and the insulating film.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 3, 2021
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi WATANABE, Hajime MATSUDA
  • Patent number: 11001068
    Abstract: An ink replenish container comprises a container main body that is able to store the ink; and an ink outlet formation member, attached to a front end side of the container main body, to form an ink outlet. The container main body includes a screw formation portion having a screw for engaging with the ink outlet formation member, and a shoulder portion provided on a front end side of the screw formation portion. The ink outlet formation member includes an abutting portion that abuts the shoulder portion.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: May 11, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Noriyuki Fukasawa, Taku Ishizawa, Tadashi Watanabe, Ryoichi Tanaka, Tadahiro Mizutani
  • Patent number: 10952320
    Abstract: A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 16, 2021
    Assignee: Kyocera Corporation
    Inventors: Tadashi Watanabe, Masakazu Nakamura, Hiroshi Omodera, Tomoko Oyama
  • Publication number: 20210062027
    Abstract: An ink set to be used for printing poorly absorbent or non-absorbent printing media includes an aqueous non-white ink composition containing a non-white pigment, an aqueous white ink composition containing a white pigment, and a treatment liquid containing a flocculant and an alkanolamine.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Inventors: Tadashi WATANABE, Ippei OKUDA
  • Patent number: 10913280
    Abstract: An ink replenish container comprises a container main body that is able to store the ink; and an ink outlet formation member, attached to a front end side of the container main body, to form an ink outlet. The container main body includes a screw formation portion having a screw for engaging with the ink outlet formation member, and a shoulder portion provided on a front end side of the screw formation portion. The ink outlet formation member includes an abutting portion that abuts the shoulder portion.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: February 9, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Noriyuki Fukasawa, Taku Ishizawa, Tadashi Watanabe, Ryoichi Tanaka, Tadahiro Mizutani
  • Publication number: 20210031552
    Abstract: Provided is an ink jet recording method using an ink jet recording apparatus having an ink jet head, the method including: a colored ink adhesion step of discharging an aqueous colored ink composition containing a coloring material from an ink jet head to adhere to a recording medium; and a clear ink adhesion step of discharging an aqueous clear ink composition from an ink jet head to adhere to the recording medium, in which the aqueous clear ink composition contains wax particles, the ink jet recording apparatus has a circulation path for circulating the aqueous clear ink composition, and in the clear ink adhesion step, the aqueous clear ink composition circulated in the circulation path is discharged.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 4, 2021
    Inventors: Ippei OKUDA, Tadashi WATANABE
  • Patent number: 10896970
    Abstract: A process of forming a field effect transistor (FET) of a type of high electron mobility transistor (HEMT) reducing damages caused in a semiconductor layer is disclosed. The process carries out steps of: (a) depositing an insulating film on a semiconductor stack; (b) depositing a conductive film on the insulating film; (c) forming an opening in the conductive film and the insulating film by a dry-etching using ions of reactive gas to expose a surface of the semiconductor stack; and (d) forming a gate electrode to be in contact with the surface of the semiconductor stack through the opening, the gate electrode filling the opening in the conductive film and the insulating film.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: January 19, 2021
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi Watanabe, Hajime Matsuda
  • Publication number: 20200312982
    Abstract: A process of forming a field effect transistor (FET) of a type of high electron mobility transistor (HEMT) reducing damages caused in a semiconductor layer is disclosed. The process carries out steps of: (a) depositing an insulating film on a semiconductor stack; (b) depositing a conductive film on the insulating film; (c) forming an opening in the conductive film and the insulating film by a dry-etching using ions of reactive gas to expose a surface of the semiconductor stack; and (d) forming a gate electrode to be in contact with the surface of the semiconductor stack through the opening, the gate electrode filling the opening in the conductive film and the insulating film.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 1, 2020
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi WATANABE, Hajime MATSUDA
  • Publication number: 20200276828
    Abstract: An ink jet printing method includes an application step of ejecting a coloring ink composition functioning to color a printing medium through an ejection opening of a first ink jet head to apply the coloring ink composition onto a printing medium, and an application step of ejecting a non-coloring composition different from the coloring ink composition through an ejection opening of a second ink jet head to apply the non-coloring composition onto the printing medium. The coloring ink composition is circulated through a circulation path connected to the first ink jet head after being fed into the first ink jet head and before being ejected through the ejection opening of the first ink jet head. The non-coloring composition is not circulated through a circulation path after being fed into the second ink jet head and before being ejected through the ejection opening of the second ink jet head.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 3, 2020
    Inventors: Tadashi WATANABE, Ippei OKUDA
  • Patent number: 10686053
    Abstract: A high electron mobility transistor (HEMT) includes a semiconductor layer on a substrate; an insulating film on the semiconductor layer; a gate electrode in contact with a surface of the semiconductor layer through an opening in the insulating film; and a conductive film provided between the insulating film and a portion of the gate electrode at peripheries of the opening. The insulating film and the conductive film are made of respective materials containing silicon (Si). The gate electrode includes a Schottky metal in contact with the semiconductor layer and a cover metal provided on the Schottky metal. The Schottky metal covers the conductive film thereunder.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 16, 2020
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi Watanabe, Hajime Matsuda
  • Patent number: 10658251
    Abstract: A process of forming an epitaxial substrate is disclosed, where the epitaxial substrate includes a nucleus forming layer made of aluminum nitride (AlN) grown on a substrate made of silicon carbide (SiC). The process includes steps of: (1) first measuring the first reflectivity R0 of a surface of the SiC substrate, (2) growing the nucleus forming layer made of AlN as measuring second reflectivity R1 of a grown surface of the AlN nucleus forming layer, and (3) ending the growth of the AlN nucleus forming layer when a ratio R1/R0 of the reflectivity enters a preset range.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: May 19, 2020
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS
    Inventor: Tadashi Watanabe
  • Publication number: 20200139716
    Abstract: Convenience of an ink bottle and a bottle set is improved. An ink bottle includes: a container portion that contains ink; a guiding portion that is formed in one end portion of the container portion, and includes an outflow port from which the ink in the container portion flow out; and a cover that covers at least an end portion of the container portion on the opposite side of the guiding portion.
    Type: Application
    Filed: December 27, 2019
    Publication date: May 7, 2020
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Taku ISHIZAWA, Tadahiro MIZUTANI, Ryoichi TANAKA, Manabu AKAHANE, Koichi TOBA, Takumi NAGASHIMA, Yoshiaki SHIMIZU, Tadashi WATANABE, Noriyuki FUKASAWA
  • Patent number: 10638611
    Abstract: Disclosed herein is a coil component that includes a first planar spiral conductor; a second planar spiral conductor laminated on the first planar spiral conductor and wound in an opposite direction to the first planar spiral conductor; a first external terminal electrically connected to an outer peripheral end of the first planar spiral conductor; a second external terminal electrically connected to an outer peripheral end of the second planar spiral conductor; and a third external terminal electrically connected in common to inner peripheral ends of the first and second planar spiral conductors.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: April 28, 2020
    Assignee: TDK CORPORATION
    Inventors: Tomonaga Nishikawa, Kouji Kawamura, Tomokazu Ito, Tadashi Watanabe, Mitsuhiko Endo, Fumio Watanabe
  • Patent number: 10618292
    Abstract: A printer comprises a main body cover configured to change over a state between a closed state and an open state; a tank including an ink container portion configured to contain ink and an ink inlet configured to inject the ink; a tank cover configured to change over a state between a closed state and an open state; and an ink bottle including a container portion and a delivery portion. In the open state of both the main body cover and the tank cover, the ink bottle is self-supported and configured to deliver the ink from the delivery portion of the ink bottle to the ink inlet. A space is formed between the main body cover and the ink bottle when the ink bottle is self-supported. At least part of the ink bottle is located in a locus drawn by the main body cover during rotation.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: April 14, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Noriyuki Fukasawa, Taku Ishizawa, Tadahiro Mizutani, Naomi Kimura, Shoma Kudo, Ryoichi Tanaka, Tadashi Watanabe