Patents by Inventor Tadashi Watanabe

Tadashi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11597207
    Abstract: Convenience of an ink bottle and a bottle set is improved. An ink bottle includes: a container portion that contains ink; a guiding portion that is formed in one end portion of the container portion, and includes an outflow port from which the ink in the container portion flow out; and a cover that covers at least an end portion of the container portion on the opposite side of the guiding portion.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: March 7, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Taku Ishizawa, Tadahiro Mizutani, Ryoichi Tanaka, Manabu Akahane, Koichi Toba, Takumi Nagashima, Yoshiaki Shimizu, Tadashi Watanabe, Noriyuki Fukasawa
  • Patent number: 11549461
    Abstract: An aluminum alloy having excellent high temperature strength and thermal conductivity; and an internal combustion engine piston including the alloy. The aluminum alloy includes 11.0-13.0% Si, ?0.3% Fe, 0.3-2.0% Mg, 2.0-5.0% Cu, 3.0-4.0% Ni, 0.2-1.0% Mn, 0.05-0.4% Cr, and 0.05-0.4% V, with the remainder including aluminum and unavoidable impurities.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: January 10, 2023
    Assignees: NIPPON LIGHT METAL COMPANY, LTD., ART METAL MFG. CO., LTD.
    Inventors: Izumi Yamamoto, Kazuhiro Oda, Hiroshi Horikawa, Katsumi Fukaya, Takashi Seki, Tadashi Watanabe
  • Publication number: 20220310803
    Abstract: A semiconductor device includes a substrate, a nitride semiconductor layer formed on the substrate, a source electrode and a drain electrode formed in the nitride semiconductor layer. The source electrode and drain electrode are arranged side by side in a first direction. A gate electrode is formed on the nitride semiconductor layer between the source electrode and the drain electrode. A first protective film is formed on the nitride semiconductor layer, and covers the first protective film covering the source electrode, the drain electrode, and the gate electrode. A source field plate is formed on the first protective film between the gate electrode and the drain electrode in a plan view. A dielectric-breakdown inhibition portion includes a part positioned between an end of the source field plate and an end of the drain electrode in a sectional view, and inhibits dielectric breakdown of the first protective film.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 29, 2022
    Inventors: Tadashi WATANABE, Yukinori NOSE
  • Patent number: 11443956
    Abstract: A method for manufacturing a semiconductor device includes steps of forming a protective film on a semiconductor substrate, forming a resist film on the protective film such that the resist film includes a region where the resist film becomes thicker from a drain electrode to a source electrode, forming a first opening in the resist film by irradiating the resist film in the region with an electron beam and developing the resist film, forming a second opening that exposes an upper surface of the semiconductor substrate by removing the protective film using the resist film in which the first opening is formed as a mask, forming a third opening in the resist film by further developing the resist film after forming the second opening, the third opening being formed by expanding the first opening toward the drain electrode, and forming a gate electrode in the second and the third openings.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: September 13, 2022
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Tadashi Watanabe
  • Publication number: 20220285815
    Abstract: A connection structure of a waveguide includes a rod-like dielectric, and an outer conductor. A three-dimensional component includes a connection surface, an insertion hole, and a corner which forms an opening edge of the insertion hole over an entire circumference on the connection surface, the connection surface at least partially including a conductive region to which a connection enlarged portion of the outer conductor is connected, the insertion hole having conductivity over an entire circumference of an inner surface, the corner having conductivity and being conducted with the inner surface of the insertion hole. In a state where the waveguide and the three-dimensional component are connected with each other, the connection enlarged portion is electrically conducted with the inner surface of the insertion hole through electrical connection with the connection surface and the corner, and smooth connection is made at the corner.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 8, 2022
    Applicants: OLYMPUS CORPORATION, FUKUI PREFECTURAL GOVERNMENT
    Inventors: Tadashi WATANABE, Shinji SUESADA
  • Publication number: 20220283357
    Abstract: A braider includes: a plurality of cylindrical bobbins around which flat foil yarns are wound so as not to be inverted; a plurality of carriers to which the bobbins are rotatably attached, the plurality of carriers being configured to feed out the flat foil yarns from the bobbins; a core material supply mechanism configured to supply a core material to be placed inside the outer conductor; a waveguide take-out mechanism configured to take out the flexible waveguide after the outer conductor is formed; and a carrier movement determination mechanism configured to determine movement of the carriers so that there are always three or more cross points formed by the individual flat foil yarns with other ones of the flat foil yarns in an enlarged portion before the flat foil yarns form a braided shape.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Applicants: OLYMPUS CORPORATION, FUKUI PREFECTURAL GOVERNMENT
    Inventors: Tadashi WATANABE, Keigo ITO, Shinji SUESADA, Tetsuhiko MURAKAMI
  • Patent number: 11420463
    Abstract: Provided is an ink jet recording method using an ink jet recording apparatus having an ink jet head, the method including: a colored ink adhesion step of discharging an aqueous colored ink composition containing a coloring material from an ink jet head to adhere to a recording medium; and a clear ink adhesion step of discharging an aqueous clear ink composition from an ink jet head to adhere to the recording medium, in which the aqueous clear ink composition contains wax particles, the ink jet recording apparatus has a circulation path for circulating the aqueous clear ink composition, and in the clear ink adhesion step, the aqueous clear ink composition circulated in the circulation path is discharged.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: August 23, 2022
    Inventors: Ippei Okuda, Tadashi Watanabe
  • Patent number: 11390767
    Abstract: An ink set to be used for printing poorly absorbent or non-absorbent printing media includes an aqueous non-white ink composition containing a non-white pigment, an aqueous white ink composition containing a white pigment, and a treatment liquid containing a flocculant and an alkanolamine.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: July 19, 2022
    Inventors: Tadashi Watanabe, Ippei Okuda
  • Publication number: 20220203698
    Abstract: A recording method for performing recording on a recording medium includes a processing liquid attaching step of attaching a processing liquid including an aggregating agent to the recording medium, a white ink attaching step of attaching a white ink composition including a white coloring material to the recording medium, and a non-white ink attaching step of attaching a non-white ink composition including a non-white coloring material to the recording medium, in which attachment of the white ink composition and attachment of the non-white ink composition are performed by relative scanning of a recording head and the recording medium, and attachment of the white ink composition and attachment of the non-white ink composition are performed on a scanning region of the recording medium by a relative scanning.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 30, 2022
    Inventors: Tadashi Watanabe, Ippei Okuda
  • Publication number: 20220190458
    Abstract: Provided is a waveguide connecting structure of connecting a first waveguide to a second waveguide, or to a transmitting and receiving device. The waveguide connecting structure included: an elastic body configured to cause an external conductor to closely contact a dielectric body, the external conductor and the dielectric body being included in the first waveguide, the external conductor covering an outer periphery of the dielectric body; and a three-dimensional body configured to hold the dielectric body, and the second waveguide or the transmitting and receiving device, the three-dimensional body having electric conductivity inside an insertion hole holding the first waveguide, and the external conductor of the first waveguide including a radially spread portion that has been radially spread, the radially spread portion being where the first waveguide and the three-dimensional body are connected to each other.
    Type: Application
    Filed: March 1, 2022
    Publication date: June 16, 2022
    Applicant: OLYMPUS CORPORATION
    Inventor: Tadashi WATANABE
  • Publication number: 20220126592
    Abstract: An ink refilling container includes a bottle and a cap. The bottle includes an ink outlet forming portion including an ink outlet and a valve. The valve has valve segments segmented by slits. The cap includes a top portion, which faces the ink outlet when the cap is put on the bottle. A protruding portion extending in the central axis direction is provided at the center of the top portion. An annular-shaped sealing portion is provided on the top portion radially outside the protruding portion. The radius of the protruding portion is less than the length of the slit. In a sealed state wherein the cap is in thread engagement with the bottle and wherein the sealing portion seals the ink outlet, the tip end of the protruding portion is inserted in the inside of the bottle through the slits at the center region of the ink outlet.
    Type: Application
    Filed: October 22, 2021
    Publication date: April 28, 2022
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Noriyuki FUKASAWA, Seigo MIYAZAWA, Tadashi WATANABE
  • Publication number: 20220055369
    Abstract: Convenience of an ink bottle and a bottle set is improved. An ink bottle includes: a container portion that contains ink; a guiding portion that is formed in one end portion of the container portion, and includes an outflow port from which the ink in the container portion flow out; and a cover that covers at least an end portion of the container portion on the opposite side of the guiding portion.
    Type: Application
    Filed: November 2, 2021
    Publication date: February 24, 2022
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Taku ISHIZAWA, Tadahiro MIZUTANI, Ryoichi TANAKA, Manabu AKAHANE, Koichi TOBA, Takumi NAGASHIMA, Yoshiaki SHIMIZU, Tadashi WATANABE, Noriyuki FUKASAWA
  • Publication number: 20220046205
    Abstract: An image pickup apparatus includes, between a first unit including an image pickup device and a second unit including a video processing circuit, a waveguide path through which a millimeter wave or a submillimeter wave is transmitted, the second unit includes a millimeter-wave carrier-wave generation circuit and a demodulator configured to regenerate, from a millimeter-wave modulated wave generated by the first unit and received through the waveguide path, a video signal generated by the image pickup device, and the first unit includes a processing-transmission circuit configured to receive a millimeter-wave carrier wave through the waveguide path, generate a millimeter-wave modulated wave by superimposing the video signal generated by the image pickup device on the millimeter-wave carrier wave, and transmit the millimeter-wave modulated wave toward the waveguide path.
    Type: Application
    Filed: August 23, 2021
    Publication date: February 10, 2022
    Applicant: OLYMPUS CORPORATION
    Inventor: Tadashi WATANABE
  • Patent number: 11241887
    Abstract: An ink jet printing method includes an application step of ejecting a coloring ink composition functioning to color a printing medium through an ejection opening of a first ink jet head to apply the coloring ink composition onto a printing medium, and an application step of ejecting a non-coloring composition different from the coloring ink composition through an ejection opening of a second ink jet head to apply the non-coloring composition onto the printing medium. The coloring ink composition is circulated through a circulation path connected to the first ink jet head after being fed into the first ink jet head and before being ejected through the ejection opening of the first ink jet head. The non-coloring composition is not circulated through a circulation path after being fed into the second ink jet head and before being ejected through the ejection opening of the second ink jet head.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: February 8, 2022
    Inventors: Tadashi Watanabe, Ippei Okuda
  • Patent number: 11192380
    Abstract: Convenience of an ink bottle and a bottle set is improved. An ink bottle includes: a container portion that contains ink; a guiding portion that is formed in one end portion of the container portion, and includes an outflow port from which the ink in the container portion flow out; and a cover that covers at least an end portion of the container portion on the opposite side of the guiding portion.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: December 7, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Taku Ishizawa, Tadahiro Mizutani, Ryoichi Tanaka, Manabu Akahane, Koichi Toba, Takumi Nagashima, Yoshiaki Shimizu, Tadashi Watanabe, Noriyuki Fukasawa
  • Publication number: 20210323196
    Abstract: A fiber-reinforced resin molding material [C] includes a chopped fiber bundle [A] and a matrix resin [B], the material being characterized in that, when divided into n layers along the thickness direction of the fiber-reinforced resin molding material [C], the number-average fiber length [Lk] of the chopped fiber bundle [Ak] constituting each layer Fk (1?k?n) gradually increases from one outermost layer F1 of the fiber-reinforced resin molding material [C] toward the other outermost layer Fn. Also provided is a molded article obtained by molding the fiber-reinforced resin molding material. This fiber-reinforced resin molding material exhibits excellent flowability, and can exhibit excellent mechanical properties when made into a molded article.
    Type: Application
    Filed: October 30, 2019
    Publication date: October 21, 2021
    Inventors: Yasukazu Ono, Takafumi Hashimoto, Tetsuya Motohashi, Tadashi Watanabe
  • Patent number: 11117379
    Abstract: An ink replenish container comprises a container main body that is able to store the ink; an ink outlet formation member, attached to a front end side of the container main body, to form an ink outlet; and a cap attachable to a front end side of the ink outlet formation member. The ink outlet includes an outer circumferential surface and an inner circumferential surface located inward of the outer circumferential surface, the inner circumferential surface surrounding an opening through which the ink passes. The cap includes a first protrusion that is configured to contact with the outer circumferential surface of the ink outlet to form a first exit seal portion, and a second protrusion that is configured to contact with the inner circumferential surface of the ink outlet to form a second exit seal portion.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: September 14, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Noriyuki Fukasawa, Taku Ishizawa, Tadashi Watanabe, Ryoichi Tanaka, Tadahiro Mizutani
  • Publication number: 20210249522
    Abstract: A method for manufacturing a semiconductor device includes steps of forming a protective film on a semiconductor substrate, forming a resist film on the protective film such that the resist film includes a region where the resist film becomes thicker from a drain electrode to a source electrode, forming a first opening in the resist film by irradiating the resist film in the region with an electron beam and developing the resist film, forming a second opening that exposes an upper surface of semiconductor substrate by removing the protective film using the resist film on which the first opening is formed as a mask, forming a third opening in the resist film by further developing the resist film after forming the second opening, the third opening being formed by expanding the first opening toward the drain electrode, and forming a gate electrode in the second and the third openings.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 12, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Tadashi WATANABE
  • Publication number: 20210216014
    Abstract: A method for manufacturing a semiconductor device includes steps of forming a first photoresist film on a semiconductor substrate, and forming a second photoresist film having a higher acidity than the first photoresist film on the first photoresist film, forming an opening for exposing a surface of the semiconductor substrate by patterning the first photoresist film and the second photoresist film, applying a shrink material to an upper surface of the second photoresist film and an inside of the opening, and reacting the shrink material and the second photoresist film in the inside of the opening by heat-treating the first photoresist film, the second photoresist film and the shrink material, and removing an unreacted shrink material that do not react with the second photoresist film from the upper surface of the second photoresist film and the inside of the opening.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 15, 2021
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tadashi WATANABE, Takahide HIRASAKI
  • Patent number: 11046025
    Abstract: A method of producing a resin-impregnated fiber bundle roll body includes unwinding a fiber bundle from a bobbin; winding the fiber bundle on a winding core rotating around a fixed axis through a movable winding head to prepare a product; and leading the fiber bundle taken off in the unwinding to the winding between the unwinding and winding, wherein the leading or winding includes a resin impregnating the fiber bundle, and the winding includes a fiber content calculation of a fiber content in a layer of the fiber bundle on the winding core of an intermediate product to control one according to the fiber content: a resin adhesion amount in the resin adhesion operation; a winding tension of the fiber bundle applied to the intermediate product; a removal amount of a surplus resin layer on an outer surface of the intermediate product; and a resin viscosity in the intermediate product.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: June 29, 2021
    Assignee: Toray Industries, Inc.
    Inventors: Jumpei Takahashi, Shigeru Kawashima, Daisuke Nagamatsu, Tadashi Watanabe