Patents by Inventor Tadashi Watanabe

Tadashi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10418164
    Abstract: Disclosed herein is a coil component that includes first and second magnetic members; a coil layer arranged between the first and second magnetic members, the coil layer including a plurality of conductor layers and a plurality of non-magnetic insulating layers, the conductor layers and the non-magnetic insulating layers being alternately laminated, the conductor layers being connected to each other via through holes formed in the non-magnetic insulating layers to form a coil pattern; a first external terminal covering one end of the coil pattern exposed to at least one of side surfaces of the coil layer without covering the first and second magnetic members; and a second external terminal covering other end of the coil pattern exposed to at least one of the side surfaces of the coil layer without covering the first and second magnetic members.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: September 17, 2019
    Assignee: TDK CORPORATION
    Inventors: Tomonaga Nishikawa, Tomokazu Ito, Takeshi Okumura, Kouji Kawamura, Tadashi Watanabe, Hidenori Tsutsui
  • Patent number: 10377910
    Abstract: An aqueous ink composition contains an organic solvent, a surfactant, and resin fine particles. The resin of the resin fine particles takes 500 minutes or more to melt at 40° C. with the surfactant, which is a temperature relatively close to the temperature the ink jet head is heated to by the platen or the like during recording. Such an aqueous ink composition exhibits a good filling property and can be continuously ejected stably.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: August 13, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Kenichi Seguchi, Takayoshi Kagata, Tsuyoshi Sano, Akira Mizutani, Tadashi Watanabe
  • Patent number: 10370551
    Abstract: Provided is an ink composition that includes a color material, water, an organic solvent, and polymer particles, the organic solvent including an organic solvent with a standard boiling point of equal to or greater than 150° C. and equal to or less than 250° C., the content of the organic solvent that is an alkyl polyol with a standard boiling point of equal to or greater than 280° C. being equal to or less than 2.0% by mass with respect to a total amount of the ink composition, the polymer particles having a core-shell structure including core polymer and shell polymer, and a glass transition temperature of the shell polymer being higher than that of the core polymer, and that is used for a recording method using the ink composition and an aggregating liquid containing an aggregating agent capable of aggregating components of the ink composition and increasing viscosity of the components.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: August 6, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Tadashi Watanabe, Takayoshi Kagata, Akira Mizutani, Kenichi Seguchi, Akiko Matsuzaki
  • Patent number: 10350901
    Abstract: An ink bottle comprises a container main body configured to contain ink that is to be supplied to an ink tank, an ink outlet forming portion provided on an end of the container main body and configured to include an ink outlet that causes the ink to be flowed out from the container main body, and a valve provided in the ink outlet forming portion and configured to seal the ink outlet in an openable and closable manner. The ink outlet is formed in an end face of the ink outlet forming portion. The end face is arranged to face an opposite side of the ink outlet forming portion that is opposite to a container main body side thereof. A first recess is formed in an outer side portion of the ink outlet on the end face to be recessed toward the container main body side.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: July 16, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tadahiro Mizutani, Koichi Toba, Ryoichi Tanaka, Taku Ishizawa, Manabu Akahane, Tadashi Watanabe, Noriyuki Fukasawa
  • Publication number: 20190186410
    Abstract: An aluminum alloy having excellent high temperature strength and thermal conductivity; and an internal combustion engine piston including the alloy. The aluminum alloy includes 11.0-13.0% Si, ?0.3% Fe, 0.3-2.0% Mg, 2.0-5.0% Cu, 3.0-4.0% Ni, 0.2-1.0% Mn, 0.05-0.4% Cr, and 0.05-0.4% V, with the remainder including aluminum and unavoidable impurities.
    Type: Application
    Filed: August 29, 2016
    Publication date: June 20, 2019
    Applicants: NIPPON LIGHT METAL COMPANY, LTD., ART METAL MFG. CO., LTD.
    Inventors: Izumi YAMAMOTO, Kazuhiro ODA, Hiroshi HORIKAWA, Katsumi FUKAYA, Takashi SEKI, Tadashi WATANABE
  • Publication number: 20190098755
    Abstract: A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.
    Type: Application
    Filed: March 23, 2017
    Publication date: March 28, 2019
    Applicant: KYOCERA Corporation
    Inventors: Tadashi WATANABE, Masakazu NAKAMURA, Hiroshi OMODERA, Tomoko OYAMA
  • Publication number: 20190081154
    Abstract: A process of forming a field effect transistor (FET) of a type of high electron mobility transistor (HEMT) reducing damages caused in a semiconductor layer is disclosed. The process carries out steps of: (a) depositing an insulating film on a semiconductor stack; (b) deposing a conductive film on the insulating film; (c) forming an opening in the conductive film and the insulating film by a dry-etching using ions of reactive gas to exposes a surface of the semiconductor stack; and (d) forming a gate electrode to be in contact with the surface of the semiconductor stack through the opening, the gate electrode filling the opening in the conductive film and the insulating film.
    Type: Application
    Filed: September 11, 2018
    Publication date: March 14, 2019
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi WATANABE, Hajime MATSUDA
  • Publication number: 20180350700
    Abstract: A process of forming an epitaxial substrate is disclosed, where the epitaxial substrate includes a nucleus forming layer made of aluminum nitride (AlN) grown on a substrate made of silicon carbide (SiC). The process includes steps of: (1) first measuring the first reflectivity R0 of a surface of the SiC substrate, (2) growing the nucleus forming layer made of AlN as measuring second reflectivity R1 of a grown surface of the AlN nucleus forming layer, and (3) ending the growth of the AlN nucleus forming layer when a ratio R1/R0 of the reflectivity enters a preset range.
    Type: Application
    Filed: May 17, 2018
    Publication date: December 6, 2018
    Applicant: Sumitomo Electric Device Innovations, Inc.
    Inventor: Tadashi WATANABE
  • Patent number: 10147605
    Abstract: A process of forming an epitaxial substrate that includes nitride semiconductor layers is disclosed. The process includes steps of; (a) growing a nucleus forming layer on the substrate, and (b) growing a nitride semiconductor layer on the nucleus forming layer. The step (a) sets first and second growth temperatures in an upstream side and a downstream side, respectively, of the substrate for the flow of the source gases, where the first temperature of the upstream side is at least 5° C. but at most 10° C. lower than the second temperature of the downstream side, and the second temperature is higher than 1100° C.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: December 4, 2018
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi Watanabe, Hajime Matsuda
  • Patent number: 10109482
    Abstract: A surface treatment method for a semiconductor layer includes growing a first layer on a substrate in a growth reactor, the first layer consisting of one of gallium nitride, aluminum gallium nitride and indium aluminum nitride; growing a second layer of gallium nitride on a surface of the first layer, the gallium nitride of the second GaN layer having a composition ratio of gallium to nitrogen larger than 2; taking the substrate out of the growth reactor after growing the second layer; and removing the second layer after taking the substrate out of the growth reactor.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: October 23, 2018
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Tadashi Watanabe
  • Publication number: 20180272723
    Abstract: At least one of making an ink replenishing operation easy and making it possible to select one out of a plurality of types of ink replenishment containers in order to perform ink replenishment is achieved. An ink replenishment assist apparatus includes a plug detachably mounted to the ink inlet of an ink tank and a conduit. The conduit has a first opening open to the inside of the ink tank in an in-use state of the ink replenishment assist apparatus, a second opening positioned on an opposite side to the first opening, and open to the outside of the ink tank, and a channel that brings the first opening and the second opening into communication with each other.
    Type: Application
    Filed: March 16, 2018
    Publication date: September 27, 2018
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Satoshi SHINADA, Tadahiro MIZUTANI, Taku ISHIZAWA, Noriyuki FUKASAWA, Tadashi WATANABE
  • Publication number: 20180250943
    Abstract: A printer comprises a main body cover configured to change over a state between a closed state and an open state; a tank including an ink container portion configured to contain ink and an ink inlet configured to inject the ink; a tank cover configured to change over a state between a closed state and an open state; and an ink bottle including a container portion and a delivery portion. In the open state of both the main body cover and the tank cover, the ink bottle is self-supported and configured to deliver the ink from the delivery portion of the ink bottle to the ink inlet. A space is formed between the main body cover and the ink bottle when the ink bottle is self-supported. At least part of the ink bottle is located in a locus drawn by the main body cover during rotation.
    Type: Application
    Filed: February 26, 2018
    Publication date: September 6, 2018
    Applicant: Seiko Epson Corporation
    Inventors: Noriyuki FUKASAWA, Taku ISHIZAWA, Tadahiro MIZUTANI, Naomi KIMURA, Shoma KUDO, Ryoichi TANAKA, Tadashi WATANABE
  • Patent number: 10056252
    Abstract: A process of forming a semiconductor device by use of a MOCVD technique is disclosed. The semiconductor device, which is made of primarily nitride semiconductor materials, includes a GaN channel layer, an AlGaN barrier layer, and a GaN cap layer on a substrate. The barrier layer and the cap layer are grown under a gradient temperature condition where the upstream side of the substrate with respect to the flow of the MOCVD source gases is at a higher temperature as compared with the temperature at the downstream side of the substrate with respect to the flow of the source gases.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: August 21, 2018
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi Watanabe, Hajime Matsuda
  • Publication number: 20180207939
    Abstract: Convenience of an ink bottle and a bottle set is improved. An ink bottle includes: a container portion that contains ink; a guiding portion that is formed in one end portion of the container portion, and includes an outflow port from which the ink in the container portion flow out; and a cover that covers at least an end portion of the container portion on the opposite side of the guiding portion.
    Type: Application
    Filed: January 24, 2018
    Publication date: July 26, 2018
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Taku Ishizawa, Tadahiro Mizutani, Ryoichi Tanaka, Manabu Akahane, Koichi Toba, Takumi Nagashima, Yoshiaki Shimizu, Tadashi Watanabe, Noriyuki Fukasawa
  • Publication number: 20180151349
    Abstract: A process of forming an epitaxial substrate that includes nitride semiconductor layers is disclosed. The process includes steps of, (a) growing a nucleus forming layer on the substrate, and (b) growing a nitride semiconductor layer on the nuclides forming layer. The step (a) sets first and second growth temperatures in an upstream side and a downstream side, respectively, of the substrate for the flow of the source gases, where the first temperature of the upstream side is at least 5° C. but at most 10° C. lower than the second temperature of the downstream side, and the second temperature is higher than 1100° C.
    Type: Application
    Filed: November 22, 2017
    Publication date: May 31, 2018
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi WATANABE, Hajime MATSUDA
  • Publication number: 20180136456
    Abstract: An endoscope system includes: an insertion portion in which an image pickup unit configured to pick up an image of an object to be examined and generate a video signal is disposed in a distal end; a video processor configured to process the video signal generated by the image pickup unit; and a signal transmission path connecting the image pickup unit and the video processor, and at least a part of the signal transmission path is a waveguide configured to allow propagation of a millimeter wave or a submillimeter wave, and signal transmission is performed by the waveguide.
    Type: Application
    Filed: November 2, 2017
    Publication date: May 17, 2018
    Applicant: OLYMPUS CORPORATION
    Inventors: Tadashi WATANABE, Naoki MATSUO, Mamoru SAKASHITA
  • Publication number: 20180061632
    Abstract: A process of forming a semiconductor device is disclosed. The semiconductor device, which is made of primarily nitride semiconductor materials, includes a GaN channel layer, an AlGaN barrier layer, and a GaN cap layer on a substrate. The barrier layer and the cap layer are grown under a gradient temperature condition where the upstream side of the substrate for the flow of the source gases of the MOCVD technique is set in a higher temperature compared with a temperature in the downstream side of the substrate for the flow of the source gases.
    Type: Application
    Filed: August 25, 2017
    Publication date: March 1, 2018
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Tadashi WATANABE, Hajime MATSUDA
  • Publication number: 20170368819
    Abstract: An ink jet recording method according to the present embodiment includes ejecting a water-based ink composition where a content of an organic solvent having a standard boiling point of 280° C. or more is 0.5% by mass or less from a head nozzle and attaching the water-based ink composition to a recording medium, in which a contact angle between at least a part of the surface of the member in contact with the water-based ink composition in the members in the head and the water-based ink composition is 30° or less, and the surface of the member in contact with the water-based ink composition is formed of a material having an SP value of 9 or less.
    Type: Application
    Filed: May 10, 2017
    Publication date: December 28, 2017
    Inventors: Takayoshi KAGATA, Akira MIZUTANI, Tadashi WATANABE, Kenichi SEGUCHI, Tsuyoshi SANO
  • Publication number: 20170355195
    Abstract: An ink replenish container comprises a container main body that is able to store the ink; and an ink outlet formation member, attached to a front end side of the container main body, to form an ink outlet. The container main body includes a screw formation portion having a screw for engaging with the ink outlet formation member, and a shoulder portion provided on a front end side of the screw formation portion. The ink outlet formation member includes an abutting portion that abuts the shoulder portion.
    Type: Application
    Filed: June 8, 2017
    Publication date: December 14, 2017
    Applicant: Seiko Epson Corporation
    Inventors: Noriyuki FUKASAWA, Taku ISHIZAWA, Tadashi WATANABE, Ryoichi TANAKA, Tadahiro MIZUTANI
  • Publication number: 20170355191
    Abstract: An ink bottle comprises a container main body configured to contain ink that is to be supplied to an ink tank, an ink outlet forming portion provided on an end of the container main body and configured to include an ink outlet that causes the ink to be flowed out from the container main body, and a valve provided in the ink outlet forming portion and configured to seal the ink outlet in an openable and closable manner. The ink outlet is formed in an end face of the ink outlet forming portion. The end face is arranged to face an opposite side of the ink outlet forming portion that is opposite to a container main body side thereof. A first recess is formed in an outer side portion of the ink outlet on the end face to be recessed toward the container main body side.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 14, 2017
    Applicant: Seiko Epson Corporation
    Inventors: Tadahiro MIZUTANI, Koichi TOBA, Ryoichi TANAKA, Taku ISHIZAWA, Manabu AKAHANE, Tadashi WATANABE, Noriyuki FUKASAWA