Abstract: A camera module includes a first lens barrel configured to receive one or more lens groups, a second lens barrel coupled to the first lens barrel and configured to support a front lens disposed on an object side of the one or more lens groups, an energy generating unit configured to contact the second lens barrel and configured to supply thermal energy to the second lens barrel, and a barrel holder coupled to the first lens barrel and configured to accommodate the energy generating unit.

Abstract: A semiconductor memory device and a method of manufacturing the semiconductor memory device are provided. The semiconductor memory device includes a plurality of insulating layers spaced apart from each other in a stacking direction, a slit insulating layer passing through the plurality of insulating layers, a plurality of first variable resistance layers alternately disposed with the plurality of insulating layers in the stacking direction, a plurality of conductive lines interposed between the slit insulating layer and the plurality of first variable resistance layers and alternately disposed with the plurality of insulating layers in the stacking direction, a conductive pillar passing through the plurality of insulating layers and the plurality of first variable resistance layers, and a second variable resistance layer surrounding a sidewall of the conductive pillar.

Abstract: The present disclosure relates to a thermoplastic resin composition, a method of preparing the same, and a molded article including the same. For example, the present disclosure relates to a thermoplastic resin composition including 35 to 85% by weight of an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A) containing alkyl acrylate rubber having an average particle diameter of 50 to 120 nm and 15 to 65% by weight of a polymethacrylate resin (B). The thermoplastic resin composition has an alkyl acrylate coverage value (X) of 70% or more as calculated by Equation 1. The thermoplastic resin composition may have beneficial mechanical properties, such as impact strength, tensile strength, and flexural strength, surface hardness, transparency, and colorability and may be capable of preventing occurrence of whitening during bending due to beneficial non-whitening properties.

Abstract: An optical composite sheet is disclosed. In the optical composite sheet, optical functional elements such as a prism sheet and a light diffusion layer are combined, and a light absorbing layer that selectively absorbs light of a specific wavelength band is inserted, so that the optical performance and color gamut can be enhanced as compared with the prior art. In particular, the color transmittance of the optical composite sheet with respect to wavelength measured for each viewing angle satisfies a specific relationship, whereby it is possible to effectively reduce the color deviation with respect to the viewing angle.

Abstract: The present disclosure relates to a pixel displaying an image. A pixel includes an organic light emitting diode, a first transistor controlling an amount of current flowing from a first driving power supply to a second driving power supply via the organic light emitting diode in response to a voltage of a first node; a storage capacitor connected between the first node and the first driving power supply; a second transistor connected between a data line and the first node and turned on when a scan signal is supplied to a first scan line, and an auxiliary transistor connected between the second transistor and the data line and turned on when a scan signal is supplied to a second scan line. The second transistor and the auxiliary transistor have an overlapping turn-on period, and the second transistor is turned off before the auxiliary transistor is turned off.

Abstract: A light emitting display device includes a lower substrate, a thin film transistor on the lower substrate, a passivation layer disposed on the thin film transistor and including hydrogen, an overcoating layer disposed on the passivation layer and planarizing the passivation layer, a light emitting element disposed on the overcoating layer and including an anode, a light emitting layer on the anode, and a cathode on the light emitting layer, a bank disposed on the overcoating layer and defining a light emitting area, an adhesive layer on the light emitting element and the bank, and a hydrogen absorbing layer disposed on the adhesive layer and including a hydrogen absorbing filler, wherein a side end of the bank is disposed more inwardly than side ends of the adhesive layer and the hydrogen absorbing layer, wherein the side ends of the adhesive layer and the hydrogen absorbing layer are disposed more inwardly than a side end of the overcoating layer.

Abstract: Disclosed herein are a method and apparatus for migrating a virtual machine in a memory-disaggregated environment. The method for migrating a virtual machine in a memory-disaggregated environment includes determining whether to migrate a virtual machine based on a number of accesses to a remote memory, establishing a migration policy for the virtual machine based on a remote memory access pattern, and determining a migration destination node based on the migration policy, wherein the migration policy includes a first migration policy corresponding to a case where the remote memory access pattern is sequential, and a second migration policy corresponding to a case where the remote memory access pattern is non-sequential.

Abstract: Disclosed herein are a method and apparatus for accelerating network transmission in a memory-disaggregated environment. The method for accelerating network transmission in a memory-disaggregated environment includes copying transmission data to a transmission buffer of the computing node, when a page fault occurs during copy of the transmission data, identifying a location at which the transmission data is stored, setting a node in which a largest amount of transmission data is stored as a transmission node, and sending a transmission command to the transmission node.

Abstract: The present disclosure relates to a thermoplastic resin composition and an exterior material including the same. The thermoplastic resin composition has low gloss and has mechanical properties and processability equal or superior to those of conventional ASA resins. The thermoplastic resin composition also has improved viscoelastic properties that can lead to excellent processability during the manufacture of a co-extruded product and excellent adhesion within the co-extruded product. The thermoplastic resin composition is also capable of reducing surface defects.

Abstract: A stack package is disclosed. A first semiconductor die and a supporter are disposed on a package substrate. The supporter may include a second side facing a first side of the first semiconductor die having a substantially inclined surface. A second semiconductor die is stacked on the first semiconductor die and on the supporter. An encapsulant layer is formed to fill a portion between the supporter and the first semiconductor die.

Abstract: Provided is a thermoplastic resin composition which includes: a first copolymer including an acrylic graft copolymer; a second copolymer including an alkyl-substituted styrene-based monomer unit, a vinyl cyanide-based monomer unit, and a (meth)acrylate-based monomer unit; and a third copolymer including an alkyl-unsubstituted styrene-based monomer unit, a vinyl cyanide-based monomer unit, and a (meth)acrylate-based monomer unit. According to the present invention, a thermoplastic resin composition and a thermoplastic resin molded article, which are excellent in heat resistance, colorability, and scratch resistance, can be provided.

Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

Abstract: A thermoplastic resin composition can include 25 to 75% by weight of an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A) containing alkyl acrylate rubber having an average particle diameter of 50 to 120 nm; and 25 to 75% by weight of a (meth)acrylic acid alkyl ester compound-aromatic vinyl compound-vinyl cyanide compound non-graft copolymer (B). The thermoplastic resin composition has an alkyl acrylate coverage value (X) of 67% or more as calculated by Equation 1. A method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition are also disclosed.

Abstract: A memory system includes a controller configured to transfer first data for a program operation, and a memory device configured to perform an error check operation for determining whether second data received from the controller are equal to the first data and the program operation for storing the first data.

Abstract: The present disclosure relates to a thermoplastic resin composition including 25 to 75% by weight of an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A) containing alkyl acrylate rubber having an average particle diameter of 50 to 120 nm; 18 to 47% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (B) having a weight average molecular weight of 70,000 to 150,000 g/mol; and 3 to 28% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (C) having a weight average molecular weight of greater than 150,000 g/mol and less than or equal to 250,000 g/mol, wherein the thermoplastic resin composition has an alkyl acrylate coverage value (X) of 67% or more as calculated by Equation 1. A method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition are also disclosed.

Abstract: A color conversion substrate and a display device including the same are provided, the color conversion substrate including a substrate, color filter layers on the substrate, and arranged in a first direction, and in a second direction intersecting the first direction, a bank layer defining openings overlapping the color filter layers, and including a first bank part extending in the second direction, and second bank parts extending in the first direction from a side of the first bank part, and wavelength conversion layers in the openings of the bank layer, wherein the first bank part includes a recess recessed inwardly from a part of a second side opposite a first side on which the second bank parts are located.

Abstract: A stack package is disclosed. A first semiconductor die and a supporter are disposed on a package substrate. The supporter may include a second side facing a first side of the first semiconductor die having a substantially inclined surface. A second semiconductor die is stacked on the first semiconductor die and on the supporter. An encapsulant layer is formed to fill a portion between the supporter and the first semiconductor die.

Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.

Abstract: Disclosed is an interaction system between a controller and a VR application. The interaction system includes a controller including a first actuator configured to move a mass and a first processor configured to control an operation of the first actuator; and a content execution device configured to execute an application according to a control signal received from the controller and generate a feedback signal to transmit the generated feedback signal to a controller when a virtual object change event occurs during the application execution, wherein the first processor of the controller controls the first actuator when the feedback signal is received to move the mass and move a center of gravity.