Abstract: A method of manufacturing a display device includes preparing a cover substrate assembly including a cover substrate, a protective film attached to a lower surface of the cover substrate, and an inspection pattern disposed between the cover substrate and the protective film, obtaining a first image by imaging the inspection pattern through an upper surface of the cover substrate, obtaining noise data by comparing a reference image of the inspection pattern with the first image, obtaining a second image by imaging the cover substrate assembly, obtaining a corrected image of the second image by reflecting the noise data in the second image, and detecting a defect of the cover substrate based on the corrected image of the second image.

Abstract: Disclosed are inspection apparatuses and methods. The inspection apparatus includes a light source configured to irradiate a beam to an inspection object including a first part and a second part different from the first part; an inspection module spaced apart from the inspection object and onto which a beam, whose path is changed after being irradiated to the inspection object, is incident; and a separator between the inspection object and the inspection module and through which at least a portion of the beam, whose path is changed, passes. The separator includes: a frame in which an opening is defined, and a separation member in the opening and configured to change a path of a beam, which passes through the separator.

Abstract: Provided are a system for business process automation and a method thereof. The system according to some embodiments may include a connect manager configured to register and manage application programming interface (API) information for services, a process execution engine configured to execute a target business process comprising a particular service task, which is a task using a particular service provided by a service module, and a connect broker configured to acquire API information for the particular service, registered through the connect manager, during execution of the target business process in response to a request from the process execution engine, and process the particular service task by sending a request for the particular service to the service module using the acquired API information.

Abstract: An adhesion defect detection apparatus includes an inspection window having a first dummy area, a second dummy area, and an inspection area disposed between the first dummy area and the second dummy area. A first shape changer is disposed on the inspection window. The first shape changer is configured to change a shape of the inspection window in a first direction. A second shape changer is disposed outside of both the first dummy area and the second dummy area. The second shape changer is configured to change a shape of the inspection window in a second direction that is perpendicular to the first direction.

Abstract: A method of manufacturing a display device includes preparing a cover substrate assembly including a cover substrate, a protective film attached to a lower surface of the cover substrate, and an inspection pattern disposed between the cover substrate and the protective film, obtaining a first image by imaging the inspection pattern through an upper surface of the cover substrate, obtaining noise data by comparing a reference image of the inspection pattern with the first image, obtaining a second image by imaging the cover substrate assembly, obtaining a corrected image of the second image by reflecting the noise data in the second image, and detecting a defect of the cover substrate based on the corrected image of the second image.

Abstract: A buffer circuit configured to receive first and second input signals through first and second input transistors coupled to a first power voltage node, output a first output signal through a first output node and a second output signal through a second output node based on the first and second input signals. A load circuit is coupled among the first output node, the second output node, and a second power voltage node and a resistance value is adjusted based on at least one of the first and second output signals.

Abstract: A buffer circuit configured to receive first and second input signals through first and second input transistors coupled to a first power voltage node, output a first output signal through a first output node and a second output signal through a second output node based on the first and second input signals. A load circuit is coupled among the first output node, the second output node, and a second power voltage node and a resistance value is adjusted based on at least one of the first and second output signals.

Abstract: An adhesion defect detection apparatus includes an inspection window having a first dummy area, a second dummy area, and an inspection area disposed between the first dummy area and the second dummy area. A first shape changer is disposed on the inspection window. The first shape changer is configured to change a shape of the inspection window in a first direction. A second shape changer is disposed outside of both the first dummy area and the second dummy area. The second shape changer is configured to change a shape of the inspection window in a second direction that is perpendicular to the first direction.

Abstract: An adhesion defect detection apparatus includes an inspection window having a first dummy area, a second dummy area, and an inspection area disposed between the first dummy area and the second dummy area. A first shape changer is disposed on the inspection window. The first shape changer is configured to change a shape of the inspection window in a first direction. A second shape changer is disposed outside of both the first dummy area and the second dummy area. The second shape changer is configured to change a shape of the inspection window in a second direction that is perpendicular to the first direction.

Abstract: A voltage generator includes a bias voltage generation circuit and a compensation circuit. The bias voltage generation circuit generates a first bias voltage based on a reference current and generates a second bias voltage based on the first bias voltage. The compensation circuit changes a voltage level of the first bias voltage based on the second bias voltage.

Abstract: An input/output circuit includes a data buffer group configured to buffer data received through data lines, a data strobe buffer configured to buffer a data strobe signal to output a buffered data strobe clock, a digitally controlled delay line configured to output delay data by controlling skew of the buffered data according to a delay code, a data strobe clock output circuit configured to generate a delay data strobe clock in response to the buffered data strobe clock, a sampler configured to sample the delay data according to the delay data strobe clock to output sampled data, and a de-skew circuit configured to update the delay code according to the sampled data.

Abstract: A voltage generator includes a bias voltage generation circuit and a compensation circuit. The bias voltage generation circuit generates a first bias voltage based on a reference current and generates a second bias voltage based on the first bias voltage. The compensation circuit changes a voltage level of the first bias voltage based on the second bias voltage.

Abstract: An adhesion defect detection apparatus includes an inspection window having a first dummy area, a second dummy area, and an inspection area disposed between the first dummy area and the second dummy area. A first shape changer is disposed on the inspection window. The first shape changer is configured to change a shape of the inspection window in a first direction. A second shape changer is disposed outside of both the first dummy area and the second dummy area. The second shape changer is configured to change a shape of the inspection window in a second direction that is perpendicular to the first direction.

Abstract: An input/output circuit includes a data buffer group configured to buffer data received through data lines, a data strobe buffer configured to buffer a data strobe signal to output a buffered data strobe clock, a digitally controlled delay line configured to output delay data by controlling skew of the buffered data according to a delay code, a data strobe clock output circuit configured to generate a delay data strobe clock in response to the buffered data strobe clock, a sampler configured to sample the delay data according to the delay data strobe clock to output sampled data, and a de-skew circuit configured to update the delay code according to the sampled data.

Abstract: An amplifier may include a differential pair circuit configured to generate an output signal according to a first input signal and a second input signal, a plurality of current sinks coupled between a ground terminal and the differential pair circuit, and a feedback circuit configured to sense a level of the output signal and generate a feedback signal. At least one of the plurality of current sinks is controlled according to the feedback signal.

Abstract: Disclosed is a cab locking device of a truck. The cab locking device includes a latch and a striker. The latch is mounted on a frame that is close to a vehicle body of the truck. The striker is mounted on a cab that is hinge-coupled to the frame to be tilted. The striker includes a body mounted on the cab, a locking pin mounted on the body to be selectively locked or unlocked by the latch according to whether the cab is tilted, and an impact absorbing cushion disposed between the latch and the body to maintain an interval between the body and the latch.

Abstract: An amplifier may include a differential pair circuit configured to generate an output signal according to a first input signal and a second input signal, a plurality of current sinks coupled between a ground terminal and the differential pair circuit, and a feedback circuit configured to sense a level of the output signal and generate a feedback signal. At least one of the plurality of current sinks is controlled according to the feedback signal.

Abstract: The present invention relates to an exclusive alloy substrate material for CIGS solar cells. Particularly, the present invention provides a substrate material having a thermal expansion coefficient similar to that of a CIGS layer. The substrate material according to the present invention may prevent damage such as interlayer separation due to differing thermal expansion coefficients from occurring because the substrate material has a thermal expansion coefficient similar to that of the CIGS layer.

Abstract: A semiconductor memory device includes a semiconductor circuit substrate having a chip pad forming region. A pair of data lines are formed on the semiconductor circuit substrate at one side of the chip pad region. The pair of data lines extend along a direction that the chip pad region of the semiconductor circuit substrate extends. The pair of data lines are arranged to be adjacent to each other and receive a pair of differential data signals. A power supply line is formed on the semiconductor circuit substrate at the other side of the chip pad region. The power supply line extends along the direction that the chip pad region of the semiconductor circuit substrate extends, and the power supply line receives power.

Abstract: A buffer circuit includes an amplification unit suitable for sensing and amplifying an input signal and a reference voltage, a buffer enable unit suitable for enabling the amplification unit based on a buffer enable signal, and a buffer enable signal generation unit suitable for generating the buffer enable signal based on a first or second operation control signal, selected according to a high voltage detection signal.