Abstract: The present disclosure relates to a method for preparing a fermented composition, and more specifically, to a method for preparing a fermented composition with improved odor, which comprises preparing grain flour; performing primary fermentation of the grain flour using yeast; performing secondary fermentation of the primary fermented product using a strain of the genus Bacillus; and obtaining the secondary fermented product. The fermented composition of the present disclosure has a high content of a peptide with a low molecular weight, and thus enables the increase of digestibility and absorption rate of proteins during ingestion while also improving the peculiar odor of a fermented product to enhance its palatability.

Abstract: The present disclosure relates to a method for preparing a transglucosylated steviol glycoside using a crude enzyme liquid of a Lactobacillus mali strain.

Abstract: The present invention relates to a method for inhibiting myeloid-derived suppressor cells or treating cancer comprising administering a pharmaceutical composition containing decitabine or its pharmaceutically acceptable salt as an active ingredient. The decitabine suppresses creation of a cell population of myeloid-derived suppressor cells (MDSC) created in spleen and bone marrow in tumorigenic mice and induces apoptosis of the MDSC cell population. Therefore, the decitabine may be useful as agents for treating MDSC-related diseases and anticancer immunotherapy, or an anticancer supplement.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: Provided is a multi-copter, including: a fuselage; three or more intermediate supporting bars which have one ends fixed to the fuselage and radially extend from the fuselage; two mounting rods which are divided into two branches at the other ends of the intermediate supporting bars; and a propeller set configured by two propellers which are mounted to two mounting rods and rotate at the same rotational speed (RPM) in opposite directions. When an angle formed by any one propeller between two propellers which form the propeller set and the mounting rod is a first angle and an angle formed by the other one propeller and the mounting rod is a second angle, a difference between the first angle and the second angle is 360/2n degrees and n is a number of blades for every propeller.

Abstract: Provided herein is a magnetic sheet. The magnetic sheet according to one embodiment of the present invention includes a magnetic layer formed of crushed pieces of a magnetic body to improve flexibility of the magnetic sheet, and a thin film coating layer formed on at least one surface of the magnetic layer to maintain the magnetic layer in a sheet shape and buffer an external force applied to the crushed pieces of the magnetic body.

Abstract: The present disclosure relates to a method for preparing a transfructosylated steviol glycoside using Arthrobacter-derived microorganisms, a culture thereof, a supernatant of the culture, an extract of the culture, and a lysate of the microorganisms.

Abstract: A method for manufacturing a transition metal-dichalcogenide thin film is provided. The method for manufacturing a transition metal-dichalcogenide thin film can comprise the steps of: preparing a base substrate within a chamber; preparing a precursor comprising a transition metal; repeatedly carrying out, multiple times, a step of providing the precursor on the base substrate and a step of purging the chamber, thereby forming, on the base substrate, a preliminary thin film in which the precursor is adsorbed; and manufacturing a transition metal-dichalcogenide thin film by heat treating the preliminary thin film in a gas atmosphere comprising a chalcogen element.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: A semiconductor package includes: a memory sub-package including a first connecting layer and a plurality of memory chips disposed on the first connecting layer; a logic sub-package including a second connecting layer, a controller chip disposed on the second connecting layer, and a buffer chip connected to the controller chip and the plurality of memory chips; and a plurality of inter-package connecting members each of which connects the memory sub-package and the logic sub-package, wherein the buffer chip is connected to the plurality of memory chips via a plurality of first data transfer lines each having a first data transfer rate, the buffer chip is connected to the controller chip via a plurality of second data transfer lines each having a second data transfer rate, and the first data transfer rate is less than the second data transfer rate.

Abstract: A semiconductor package includes: a memory sub-package including a first connecting layer and a plurality of memory chips disposed on the first connecting layer; a logic sub-package including a second connecting layer, a controller chip disposed on the second connecting layer, and a buffer chip connected to the controller chip and the plurality of memory chips; and a plurality of inter-package connecting members each of which connects the memory sub-package and the logic sub-package, wherein the buffer chip is connected to the plurality of memory chips via a plurality of first data transfer lines each having a first data transfer rate, the buffer chip is connected to the controller chip via a plurality of second data transfer lines each having a second data transfer rate, and the first data transfer rate is less than the second data transfer rate.

Abstract: The present invention relates to a substrate polishing system comprising a polishing pad covered on the polishing platen; a plurality of substrate carriers including a first substrate carrier which moves in a state in which a substrate is mounted and performs a polishing process in a state in which the substrate is in contact with the polishing pad on the polishing pad; a monitoring unit of displaying the information including the identity, position of at least one of the substrate carriers; and a control unit of outputting a warning signal and/or changes the operation of operating devices when an error occurs in real time thereby improving the monitoring efficiency and operation reliability of the polishing process of the substrate.

Abstract: A semiconductor package includes: a memory sub-package including a first connecting layer and a plurality of memory chips disposed on the first connecting layer; a logic sub-package including a second connecting layer, a controller chip disposed on the second connecting layer, and a buffer chip connected to the controller chip and the plurality of memory chips; and a plurality of inter-package connecting members each of which connects the memory sub-package and the logic sub-package, wherein the buffer chip is connected to the plurality of memory chips via a plurality of first data transfer lines each having a first data transfer rate, the buffer chip is connected to the controller chip via a plurality of second data transfer lines each having a second data transfer rate, and the first data transfer rate is less than the second data transfer rate.

Abstract: A semiconductor package includes: a memory sub-package including a first connecting layer and a plurality of memory chips disposed on the first connecting layer; a logic sub-package including a second connecting layer, a controller chip disposed on the second connecting layer, and a buffer chip connected to the controller chip and the plurality of memory chips; and a plurality of inter-package connecting members each of which connects the memory sub-package and the logic sub-package, wherein the buffer chip is connected to the plurality of memory chips via a plurality of first data transfer lines each having a first data transfer rate, the buffer chip is connected to the controller chip via a plurality of second data transfer lines each having a second data transfer rate, and the first data transfer rate is less than the second data transfer rate.

Abstract: The present invention relates to a pharmaceutical composition for preventing, treating or delaying an Alzheimer's disease (AD) or dementia including a G protein-coupled receptor19 (GPCR19) agonist or its pharmaceutically acceptable salt as an active ingredient and a food composition for preventing, treating or delaying an Alzheimer's disease or dementia. The GPCR19 agonist according to the present invention has an effect of improving cognitive and behavioral disorders without harming the health of objects when administrated to the objects and has an effect of preventing the Alzheimer's disease or dementia or delaying or treating the progression of the disease in the objects with the disease by suppressing apoptosis of the brain tissue, enhancing immunity, and reducing formation of an amyloid ? (A?) plague.

Abstract: A pharmaceutical composition for preventing or treating cartilage diseases, and pharmaceutical preparation that includes the pharmaceutical composition as an active ingredient are provided.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: A semiconductor package may include a first redistribution layer (RDL); a first semiconductor chip on a top surface of the first RDL, the first semiconductor chip including a first circuit surface and a first bottom surface, the first circuit surface having first I/O pads thereon, the first I/O pads configured to electrically connect the first semiconductor chip to the first RDL via first wire bonds; a second semiconductor chip on the first semiconductor chip, the second semiconductor chip including a second circuit surface and a second bottom surface; and a second RDL on the second semiconductor chip, the second RDL facing both the first circuit surface and the second circuit surface.

Abstract: A semiconductor package can include a mold substrate having opposite first and second surfaces where a semiconductor chip can be embedded inside the mold substrate. The semiconductor chip can include chip pads where a redistribution layer can be on the first surface of the mold substrate, and the redistribution layer can include redistribution lines therein electrically connected to the chip pads and can include a capacitor redistribution line. A capacitor can include a first electrode including a plurality of conductive pillars connected to the capacitor redistribution line. A dielectric layer can be on the first electrode and a second electrode can be on the dielectric layer.

Abstract: Disclosed are a novel strain of Bacillus amyloliquefaciens, a method of producing fermented grains using the strain, fermented grains produced using the strain, and a composition for thrombolysis; digestion improvement; prophylaxis, amelioration or treatment of bowel inflammation, serous membrane weakening or intestinal injury; or antioxidation, comprising the fermented grains.