Patents by Inventor Tae Joo

Tae Joo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160104811
    Abstract: A solar cell is provided. The solar cell includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type disposed on the first semiconductor layer, an anti-reflection layer on the second semiconductor layer, and a negative charge layer between the anti-reflection layer and the second semiconductor layer.
    Type: Application
    Filed: October 13, 2015
    Publication date: April 14, 2016
    Inventors: Park TAE JOO, Kim DAE WOONG
  • Patent number: 9286165
    Abstract: In a method for recovering a partition using backup boot record information, an unallocated area is separated from a disk or an evidence image. The unallocated area is searched for a location of a backup boot record. Whether is backup boot record of a file system to be detected is present in found sectors is analyzed. If the backup boot record is found to be the backup boot record of the file system desired to be detected as a result of the analysis, it is verified whether the backup boot record is a boot record of a valid partition. If it is verified that the backup boot record is the boot record of the valid partition, a file system of a deleted partition is parsed using the backup boot record and a deleted directory or file is recovered.
    Type: Grant
    Filed: August 3, 2013
    Date of Patent: March 15, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun-Uk Hwang, Ki-Bom Kim, Seung-Yong Lee, Young-Chan Shin, Tae-Joo Chang
  • Publication number: 20160064357
    Abstract: A semiconductor device includes at least first and second semiconductor chips stacked on each other along a first direction, at least one silicon-through-via (TSV) through at least the first semiconductor chip of the first and second semiconductor chips, a contact pad on the at least one TSV of the first semiconductor chip, the contact pad electrically connecting the TSV of the first semiconductor chip to the second semiconductor chip, and a plurality of dummy pads on the first semiconductor chip, the plurality of dummy pads being spaced apart from each other and from the contact pad along a second direction, and the dummy pads having same heights as the contact pads as measured between respective top and bottom surfaces along the first direction.
    Type: Application
    Filed: August 13, 2015
    Publication date: March 3, 2016
    Inventors: Yeong-Hwan CHOE, Tae-Joo HWANG, Tae-Hong MIN, Young-Kun JEE, Sang-Uk HAN
  • Publication number: 20160001612
    Abstract: The present disclosure relates to a low noise tire, and more specifically, to a low noise tire that includes: a sealant layer adhered to an inside surface of an inner liner of the tire; and a sound-absorbing material layer adhered to the sealant layer, in which the sound-absorbing material layer includes 50 to 90 wt % of a polypropylene melt-blown fiber and 10 to 50 wt % of a polymer fiber.
    Type: Application
    Filed: December 12, 2014
    Publication date: January 7, 2016
    Inventors: Yong Tae JOO, Hyun Chul CHO
  • Patent number: 9164845
    Abstract: Provided is a technology which searches an unallocated area to quickly extract information on a deleted partition when checking a disk and an evidence image in digital forensic, and adds a recovered partition to a forensic tool as a new partition. For this, the technology has direct access to the sector of a disk or an evidence image which is obtained, limits information search on an unallocated area only to an area satisfying the minimum size in which a partition may be created, changes an LBA-based sector access scheme into a CHS-based sector access scheme, and reads only the sector of a location having the possibility that a boot record exists to search information of a deleted partition, recovering a partition at high speed.
    Type: Grant
    Filed: November 27, 2009
    Date of Patent: October 20, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun Uk Hwang, Ki Bom Kim, Tae Joo Chang, Cheol Won Lee
  • Patent number: 9139113
    Abstract: A round recliner for vehicle seat is disclosed having a holder; a sector gear coupled to the holder to be rotatable with respect to the holder; N lock gears respectively having outer teeth and moving between a locking position where the outer teeth interlock with the inner teeth and an unlocking position where the outer teeth retreat from the inner teeth; and an operating means for moving the N lock gears to the locking or unlocking positions. The holder has N lock gear guides which guide each lock gear to slide between the locking and unlocking positions, an N?1 lock gear guides to make its outer teeth fully interlock with the inner teeth of the sector gear, and the remaining 1 lock gear guide has its guide round surface to make only one side tooth surfaces of its outer teeth interlock with the inner teeth of the sector gear.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: September 22, 2015
    Assignee: Austem Co., Ltd.
    Inventor: Tae-joo Jeong
  • Publication number: 20150179787
    Abstract: Provided are group III-V semiconductor transistors and methods of manufacturing the same. The method includes forming a group III-V semiconductor channel layer on a substrate, forming a gate insulating layer covering the group III-V semiconductor channel layer, and forming a protection layer including sulfur between the group III-V semiconductor channel layer and the gate insulating layer by annealing the substrate under a sulfur atmosphere.
    Type: Application
    Filed: December 19, 2014
    Publication date: June 25, 2015
    Applicant: Industry-University Cooperation Foundation Hanyang University ERICA Campus
    Inventors: Young-jin CHO, Tae-Joo PARK, Dong-Soo LEE, Myoung-Jae LEE, Seong-ho CHO
  • Patent number: 8925141
    Abstract: A suction nozzle for use in a vacuum cleaner includes a suction opening through which air is drawn in from a surface to be cleaned, a sterilization chamber having at least one inlet and at least one outlet, the sterilization chamber being in fluid communication with the suction opening through the at least one inlet, and a sterilization unit disposed in the sterilization chamber to sterilize the air drawn into the sterilization chamber. The air drawn into the sterilization chamber revolves while moving from the at least one inlet to the at least one outlet.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: January 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-ha Kim, Joung-soo Park, Sung-tae Joo, Hyun-ju Lee, Dong-houn Yang
  • Patent number: 8920549
    Abstract: A wet-type dust collector for a vacuum cleaner. The disclosed wet-type dust collector includes a first separating portion, the inside of which is filled with water for separating dust from air that is suctioned in from the outside; an exhaust pipe unit having an exhaust outlet and installed inside the first separating portion; and a passage-closing unit installed inside the exhaust pipe unit, wherein the passage-closing unit closes the exhaust outlet of the exhaust pipe unit by means of the combined forces of the suctioning force through the exhaust pipe unit and the buoyant force of the water, in order to prevent the water from leaking out from the first separating portion.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: December 30, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Ha Kim, Joung-Soo Park, Heung-Jun Park, Sung-Tae Joo, Dong-Houn Yang
  • Patent number: 8914941
    Abstract: A cyclone dust collecting apparatus for a vacuum cleaner includes a first chamber; an entering passage disposed above the first chamber, the entering passage guiding outer air to form a downwardly whirling air current in the first chamber; a second chamber formed at a position higher than that of an outlet of the entering passage above the first chamber, the second chamber in which the outer air entering from the first chamber whirls; a contaminants-blocking member disposed to be spaced apart from a bottom surface of the first chamber at a center of the first chamber, the contaminants-blocking member preventing contaminants and water separated in the first chamber from moving into the second chamber; and a grill disposed inside the second chamber to be in fluid communication with an air discharging port through which clean air is discharged.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: December 23, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-ha Kim, Joung-soo Park, Sung-tae Joo, Hyun-ju Lee, Dong-houn Yang
  • Publication number: 20140322387
    Abstract: The present invention relates to a method of preparation for fermented corn gluten to improve the quality of corn gluten, which is a vegetable protein source, to a fermented corn gluten prepared by the method, and to a feed additive including the same. The present invention provides high-quality fermented corn gluten whose characteristics are improvement as a protein feed by inoculation of corn gluten, which has a high protein content but is minimally used due to low digestibility, with a Bacillus sp. strain and solid-culturing the Bacillus sp. strain, and a method of preparation therefor.
    Type: Application
    Filed: November 8, 2012
    Publication date: October 30, 2014
    Inventors: Sang Hyun Seo, Seong Jun Cho, Kyung Il Kang, Min Ju Park, Tae Joo Yang, Seung Won Park
  • Publication number: 20140235017
    Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal.
    Type: Application
    Filed: April 28, 2014
    Publication date: August 21, 2014
    Inventors: Tae-Joo HWANG, Tae-Gyeong CHUNG, Eun-Chul AHN
  • Publication number: 20140198098
    Abstract: Frames are transformed from a first set of frames to a second set of frames that yield enhanced perception.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 17, 2014
    Inventor: Tae Joo
  • Publication number: 20140164948
    Abstract: Disclosed are a messenger-based medical image sharing method and system. The messenger-based medical image sharing system includes a first viewer configured to include a messenger, and to transmit information about a link to a first medical image displayed on a screen via this messenger; a second viewer configured to include a messenger, and receive the information about a link from the first viewer via this messenger, thereby sharing the first medical image, and a medical image server configured to provide the first medical image corresponding to the information about a link to the second viewer.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 12, 2014
    Applicant: INFINITT HEALTHCARE CO. LTD.
    Inventors: Hyung Tae Joo, Kyo Bum Ku
  • Publication number: 20140160150
    Abstract: Disclosed are a server-based medical image sharing method and system. The system provides a first medical image requested by a first viewer to the first viewer and receives information about a second user with whom the first medical image will be shared by the first viewer; The system provides the first medical image to a second viewer based on the information about the second user; When a user input related to an operation of the first medical image is received from any one of the first and second viewers, the system processes the first medical image, and generate a second medical image related to the first medical image. The system provides the generated second medical image to the first and second viewers.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 12, 2014
    Inventors: Hyung Tae JOO, Kyo Bum KU
  • Patent number: 8745100
    Abstract: Method and apparatus for collecting evidence are provided. An exemplary embodiment enhances accuracy and efficiency of collecting evidence by analyzing link information in the target computer and collecting collection target file. And the exemplary embodiment can collect evidence from a target computer as well as from a remote computer through analyzing the link information in the target computer, identifying the path of collection target file and extracting the target file.
    Type: Grant
    Filed: November 27, 2009
    Date of Patent: June 3, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Ki Bom Kim, Hyun Uk Hwang, Young Chan Shin, Tae Joo Chang, Cheol Won Lee, Sung Jai Baik
  • Patent number: 8736035
    Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: May 27, 2014
    Assignee: Samsung Electronics Co. Ltd.
    Inventors: Tae-Joo Hwang, Tae-gyeong Chung, Eun-chul Ahn
  • Patent number: 8728222
    Abstract: A wet type dust collecting apparatus of a vacuum cleaner is provided. The wet type dust collecting apparatus of a vacuum cleaner includes a first separating unit configured to filter out and discharge dust by rotating air which is inlet via a first air inlet, and a plurality of a second centrifugal separating units configured to filter out dust from the air which is discharged from the first separating unit, and configured to eliminate dust from the inlet air via water which is filled inside of the second centrifugal separating units.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: May 20, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Ha Kim, Joung-Soo Park, Heung-Jun Park, Sung-Tae Joo, Dong-Houn Yang
  • Patent number: 8729921
    Abstract: A terminal discriminating apparatus and a terminal discriminating method using the same are provided. The terminal discriminating apparatus includes: a measurement unit for measuring a pull-up voltage and a pull-down voltage of each of candidate terminals to be discriminated; a discriminating unit for comparing the pull-up voltages, pull-down voltages, and the differences between the pull-up voltages and pull-down voltages for the candidate terminals to discriminate the types of the candidate terminals; and an output unit for outputting results of the discrimination of the candidate terminals transferred from the discriminating unit. The types of the candidate terminals can be discriminated by comparing the pull-up voltage, the pull-down voltage, and the differences between the pull-up voltages and the pull-down voltages for the candidate terminals.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: May 20, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seung Jei Yang, Myeong Ryeol Choi, Seung Yong Lee, Nam Deok Cho, Tae Joo Chang, Cheol Won Lee
  • Patent number: 8723315
    Abstract: A flip chip package may include a substrate, a semiconductor chip, main bump structures and auxiliary bump structures. The substrate has a circuit pattern. The semiconductor chip is arranged over the substrate. The semiconductor chip includes a body having semiconductor structures, main pads electrically connected to the semiconductor structures to mainly control the semiconductor structures, and auxiliary pads electrically connected to the semiconductor structures to provide auxiliary control of the semiconductor structures. The main bump structures are interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the main pads. The auxiliary bump structures can be interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the auxiliary pads.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: May 13, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Joo Lee, Tae-Joo Hwang, Cha-Jea Jo