Abstract: This specification relates to a packaging substrate and a manufacturing method for the packaging substrate. The packaging substrate according to this specification includes a core layer comprising a glass core having a first surface and a second surface facing each other, as well as a cavity portion penetrating through the glass core. An element module is arranged in the cavity portion, which includes a cavity element and a distribution layer formed on upper side of the cavity element. The cavity distribution layer includes a redistribution circuit layer and a cavity heat dissipation pattern, where the redistribution circuit layer includes i) a cavity bump layer; or ii) vias and circuit layers. The cavity heat dissipation pattern facilitates the movement of heat generated by the cavity element.

Abstract: This specification relates to a packaging substrate and a manufacturing method for the packaging substrate. The packaging substrate according to this specification includes a core layer comprising a glass core having a first surface and a second surface facing each other, as well as a cavity portion penetrating through the glass core. An element module is disposed of the cavity portion. The element module comprises one or more cavity elements and a cavity distribution layer that are modularized into a capsule layer, wherein the cavity distribution layer is disposed above the cavity element, and the cavity distribution layer comprises a redistribution distribution circuit layer. A manufacturing method of a packaging substrate comprises preparing operation of a glass core with a cavity portion and an element module; and arranging operation of the element module in the cavity portion.

Abstract: An embodiment relates to a packaging substrate and a manufacturing method of the same. The packaging substrate according to an embodiment includes a glass core including a first surface and a second surface facing each other; and an upper layer stacked on the first surface or a lower layer stacked on the second surface, and the corners of the packaging substrate may be treated as curved surfaces or chamfered. Through this, it is possible to protect the glass core from external impact and minimize damage and damage to the glass core.

Abstract: The present disclosure relates to a manufacturing method for a packaging substrate and a packaging substrate utilizing the method. The packaging substrate according to the present disclosure includes; a core layer including a glass substrate having first and second surfaces facing each other and a cavity portion; an insulating layer formed on the first surface; and a light transmitting portion formed on an upper surface of the insulating layer, wherein a light receiving portion is disposed in the cavity portion, the insulating layer includes a via penetrating in a thickness direction, and a portion of a lower surface of the light transmitting portion may abut on the via. Though it, the packaging substrate may be compactly manufactured by reducing the space for the configuration of electrically connecting the conventional photoelectric elements, and the effect of improving the sensing efficiency and performance of the photoelectric sensor relative to the space may occur.

Abstract: Embodiments relate to packaging substrates and methods of manufacturing the same. A substrate with embedded elements according to the embodiments comprises a glass substrate comprising a first surface and a second surface facing each other; and an upper layer stacked on the first surface, or a lower layer stacked on the second surface; wherein the glass substrate may have an edge region that protrudes from the upper layer or the lower layer. A manufacturing method of a packaging substrate, comprises a forming operation of an upper layer on a first surface of a glass substrate comprising the first surface and a second surface facing each other; a removing operation of the upper layer by a predetermined width along a predetermined cutting line; a forming operation of a filamentation along the cutting line on the glass substrate from which the upper layer has been removed; and a cutting operation of the glass substrate using the filamentation.

Abstract: The present disclosure relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The method of manufacturing a packaging substrate according to the present disclosure includes: generating a glass structure that is a core via, a cavity portion, or both on a glass core including a first surface and a second surface facing each other; forming an insulating layer on the first surface or second surface using an insulating film; and forming an upper layer including an upper distribution layer and an upper surface connection layer on the insulating layer. The forming of the insulating layer May include a primary curing operation of laminating a first insulating film on the first surface and primarily curing the first insulating film, and a secondary curing operation of laminating a second insulating film on the primarily cured first insulating film and secondarily curing the second insulating film.

Abstract: A cathode active material includes a lithium manganese (Mn) iron (Fe) phosphate, wherein a mol ratio of Mn:Fe is from about 3:7 to about 9:1, the lithium manganese iron phosphate is an olivine structure, and the Mn and Fe in the olivine are present in an partially ordered or partially disordered sublattice.

Abstract: A substrate with an embedded element includes a core substrate having one surface and a cavity recessed from the one surface in a thickness direction; an element package disposed in the cavity, the element package comprising one or more elements; and a substrate insulating material surrounding at least part of the element package. When observed from a side surface of the substrate with the embedded element, the substrate with the embedded element includes a cavity area in which the cavity is disposed and a substrate area outside of the cavity area. An absolute value of difference between an average thickness of the substrate area and an average thickness of the cavity area is 50 ?m or less.

Abstract: Provided herein is a cathode. The cathode can include a cathode active material. The cathode can include a coating disposed on the cathode active material. The coating can include LixM1-y1My2AFz(OH)u, where M1 is a first metal, M2 is a second metal, A is an anionic species, 1?x?2, 0?y?1, 0?z?1, and 0?u?1.

Abstract: Provided are lithium-ion batteries comprising a positive electrode comprising a first conducting agent comprising one or more oxide-containing functional groups.

Abstract: A wireless charging apparatus of the present invention includes a heat radiation module, a circuit board disposed in the heat radiation module, and a power module disposed in the heat radiation module and having a coil for wireless charging, wherein the heat radiation module includes a case body in which the circuit board and the power module are housed, and a partition part formed inside the case body to form a separation space between the circuit board and the power module.

Abstract: An electric vehicle of the present invention includes a footrest, an extension part which comprises a housing frame extending from the footrest, and a steering tube rotatably coupled to the housing frame, a handlebar coupled to the steering tube to control a driving direction and a power reception apparatus which surrounds at least a portion of an outer surface of the extension part.

Abstract: Provided herein is a battery cell. The battery cell can include a cation-selective ion-exchange membrane. The cation-selective ion-exchange membrane can allow lithium ions to pass through the membrane. The cation-selective ion-exchange membrane can impede manganese ions from passing through the membrane.

Abstract: Provided herein is a cathode. The cathode can include a cathode active material. The cathode can include a coating disposed on the cathode active material. The coating can include LixM1?y1My2AFz(OH)u, where M1 is a first metal, M2 is a second metal, A is an anionic species, 1?x?2, 0?y?1, 0?z?1, and 0?u?1.

Abstract: An apparatus can include a layered electrode. The layered electrode can include a current collector material including a first side. The layered electrode can include a first electrode layer applied to the first side of the current collector material, the first electrode layer including a first applied viscosity of a first slurry. The layered electrode can include a second electrode layer applied to the first electrode layer, the second electrode layer including a second applied viscosity of a second slurry. The first applied viscosity of the first slurry can be greater than the second applied viscosity of the second slurry.

Abstract: An embodiment relates to a substrate and a semiconductor module. A substrate capable of manufacturing a substrate for packaging, which is an individual product, with excellent yield despite cracks that may occur at edges or side surfaces of a core is provided.

Abstract: Provided herein is a battery cell and electrode. The battery cell can include a component. The battery cell can include MxFy disposed in the component, where M is a metal element different from Mn, and 1?x?3 and 1?y?3. The electrode can include an anode active material. The electrode can include a solid electrolyte interphase on the anode active material. The solid electrolyte interphase can include MxMn(O1-yFy)z, where M is a metal element different from Mn, and x?1, 0?y?1, and z?3.

Abstract: Provided herein is an electrode. The electrode can include a current collector. The electrode can include a first layer on a first surface of the current collector. The first layer can include a first electrode active material and an electrically conductive material. The electrode can include a second layer on the first layer. The second layer can include a second electrode active material. An amount of the second electrode active material in the second layer can be greater than an amount of the first electrode active material in the first layer.

Abstract: Provided herein is a battery cell. The battery cell can include a cathode. The cathode can include a cathode active material. The battery cell can include an anode. The anode can include an anode active material. The battery cell can include an electrolyte. The electrolyte can include a ring-opening compound. The ring-opening compound can include a fluorocarbonate. The electrolyte can include a heterocyclic compound. The electrolyte can include dimethyl carbonate. The ring-opening compound can increase decomposition of the heterocyclic compound in the electrolyte compared to the same electrolyte without the ring-opening compound.

Abstract: Particular embodiments may provide a lithium-ion battery comprising a MAX compound to prevent and/or decrease Manganese dissolution. In some embodiments, the MAX compound comprises the formula Mn+1AXn, wherein M is an early transition metal atom, n is an integer from 1 to 3, A is a group 13 or group 14 element, and X is C or N.