Abstract: A display device includes a substrate and a plurality of unit pixels disposed on the substrate. Each unit pixel includes a plurality of sub-pixels, a plurality of light sensing pixels, and a plurality of partition wall members. Each of the sub-pixels includes a light emitting element that emits light and a light emitting area from which the light is emitted. Each of the light sensing pixels includes a light receiving element that outputs a sensing signal corresponding to the light and a light receiving area that receives the light. In a plan view, each of the partition wall members surrounds the corresponding light receiving area and overlaps at least some of the sub-pixels.

Abstract: A vehicle configured for container-swapping, includes: a main frame including a pair of drive modules spaced in a forward/backward direction of the vehicle, and a connecting portion extending in the forward/backward direction of the vehicle to connect the pair of drive modules so that a coupling space is formed therebetween; a container module selectively inserted into the coupling space of the main frame; and a coupling portion configured to couple the main frame and the container to each other while the container module is inserted into the coupling space of the main frame, wherein a driving portion operates and moves the main frame so that the container module is inserted into the coupling space of the main frame.

Abstract: The present disclosure relates to an isolated anti-FcRN antibody, which is an antibody binding to FcRN (stands for neonatal Fc receptor, also called FcRP, FcRB or Brambell receptor) that is a receptor with a high affinity for IgG or a fragment thereof, a method of preparing thereof, a composition for treating autoimmune disease, which comprises the antibody, and a method of treating and diagnosing autoimmunre diseases using the antibody. The FcRn-specific antibody according to the present disclosure binds to FcRn non-competitively with IgG to reduce serum pathogenic auto-antibody levels, and thus can be used for the treatment of autoimmune diseases.

Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of interlayer insulating layers and a plurality of gate conductive layers, which are stacked in an alternating manner; at least one support structure penetrating the stack structure in a substantially vertical manner, the at least one support structure being formed in a contact region; and a contact plug penetrating the stack structure in a substantially vertical manner, the contact plug being formed in the contact region, the contact plug being connected to a contact pad that is disposed on the bottom of the stack structure. The at least one support structure is formed of an oxide layer.

Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 ? to 500 ?. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.

Abstract: A lens includes a lens unit; an intermediate layer configured to cover a surface portion of the lens unit; and a water-repellent layer, configured to cover a surface portion of the intermediate layer, including a base layer and an ultraviolet (UV) absorber disposed in the base layer.

Abstract: Disclosed are systems and methods for mufti-point destination arrival time analysis. In one aspect, the system may include a memory storing instructions and at least one processor configured to execute the instructions to. The processor performs operations including receiving a request for an order, receiving an acceptance of an order associated with the first external system, determining, upon receiving the acceptance, a first arrival estimate, determining, upon assigning a delivery worker to fulfill the order, a second arrival estimate, and determining, upon receiving confirmation that the delivery worker has retrieved the order from the merchant, a third arrival estimate. Additionally, the operations may include and forwarding, upon their determination, the first, second, and third arrival estimates to the customer.

Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of interlayer insulating layers and a plurality of gate conductive layers, which are stacked in an alternating manner; at least one support structure penetrating the stack structure in a substantially vertical manner, the at least one support structure being formed in a contact region; and a contact plug penetrating the stack structure in a substantially vertical manner, the contact plug being formed in the contact region, the contact plug being connected to a contact pad that is disposed on the bottom of the stack structure. The at least one support structure is formed of an oxide layer.

Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of interlayer insulating layers and a plurality of gate conductive layers, which are stacked in an alternating manner; at least one support structure penetrating the stack structure in a substantially vertical manner, the at least one support structure being formed in a contact region; and a contact plug penetrating the stack structure in a substantially vertical manner, the contact plug being formed in the contact region, the contact plug being connected to a contact pad that is disposed on the bottom of the stack structure. The at least one support structure is formed of an oxide layer.

Abstract: A camera module includes a circuit board on which an image sensor is disposed, a lens unit disposed in front of a sensor surface of the image sensor, a housing accommodating the lens unit and the image sensor, disposed on the circuit board and a gyro sensor sensing the motion. The circuit board includes a first circuit board on which the image sensor is disposed, and a second circuit board on which the gyro sensor is disposed. The first circuit board may be disposed extending in a first axis direction, and the second circuit board may be disposed extending in a direction parallel to the optical axis direction while perpendicular to the first axis. The central axis of the gyro sensor may be parallel to the first axis direction but perpendicular to the optical axis direction.

Abstract: A method of controlling an implanted electrode includes receiving information from an external device; calculating a first region in a body in which the electrode is to be implanted and a second region in which electrode implantation is prohibited, based on the received information; and calculating a plurality of predicted paths through which an electrode is moved based on the first region or the second region, and outputting the plurality of predicted paths.

Abstract: A camera module includes a circuit board on which an image sensor is disposed, a lens unit disposed in front of a sensor surface of the image sensor, a housing accommodating the lens unit and the image sensor, disposed on the circuit board and a gyro sensor sensing the motion. The circuit board includes a first circuit board on which the image sensor is disposed, and a second circuit board on which the gyro sensor is disposed. The first circuit board may be disposed extending in a first axis direction, and the second circuit board may be disposed extending in a direction parallel to the optical axis direction while perpendicular to the first axis. The central axis of the gyro sensor may be parallel to the first axis direction but perpendicular to the optical axis direction.

Abstract: A display apparatus with an integrated touch screen is provided. The display apparatus includes: a light-emitting device layer on a first substrate, a first encapsulation layer on the light-emitting device layer, a touch sensing layer on the light-emitting device layer, and a second encapsulation layer on the touch sensing layer, the second encapsulation layer including at least one inorganic layer.

Abstract: A method of manufacturing a semiconductor memory device includes processing a first substrate including a first align mark and a first structure, processing a second substrate including a second align mark and a second structure, orientating the first substrate and the second substrate such that the first structure and the second structure face each other, and controlling alignment between the first structure and the second structure by using the first align mark and the second align mark to couple the first structure with the second structure.

Abstract: A display panel comprises a first substrate including a display area and a non-display area surrounding the display area, a light emitting diode disposed in the display area on the first substrate, an adhesive layer covering the display area and the non-display area on the first substrate, and a second substrate bonded to the first substrate by the adhesive layer, wherein the second substrate includes a barrier structure portion for defining a plurality of open spaces on one surface of the second substrate that adjoins the adhesive layer.

Abstract: The disclosure discloses anti ?-Syn antibodies preferentially recognizing ?-Syn aggregates. The antibodies of the present invention bind to ?-Syn aggregates with high affinity and specificity and inhibit accumulation or intercellular transfer of ?-Syn aggregates, and thus can be used for detection, diagnosis and/or treatment or prevention of various diseases caused by the accumulation of ?-Syn aggregates.

Abstract: A method of manufacturing a semiconductor memory device includes processing a first substrate including a first align mark and a first structure, processing a second substrate including a second align mark and a second structure, orientating the first substrate and the second substrate such that the first structure and the second structure face each other, and controlling alignment between the first structure and the second structure by using the first align mark and the second align mark to couple the first structure with the second structure.

Abstract: A display device includes a sacrificial layer positioned between an encapsulation layer and a light-emitting element that includes a first compound that is the same as a first compound of a light-emitting layer of the light-emitting element, thereby protecting the light-emitting element from an outgas of the encapsulation layer to prevent the generation of dark spots.

Abstract: A lead implanted in a body to apply electrical stimulation to body organs includes an electrode wire having one end provided as an insertion portion to be inserted into a body and another end provided as an interface portion for connection with an external device; a first electrode in the insertion portion to transmit electrical stimulation to body organs; a second electrode on the interface portion to receive electrical stimulation applied from outside; a signal line that interconnects the first electrode and second electrode to transmit electrical stimulation received by the second electrode to the first electrode; and a ring member that covers the first electrode and has an opening for exposing the first electrode in a portion of a circumferential direction, and is mounted to be movable in a longitudinal or circumferential direction with respect to the electrode wire by an external force to adjust an exposure position of the first electrode.

Abstract: A lead structure includes a lead having an electrode wire having one end provided as an insertion portion to be inserted into a body and the other end provided as an interface portion for connection with an external device, a first electrode in the insertion portion to transmit electrical stimulation to body organs, a second electrode on the interface portion to receive electrical stimulation applied from outside, and a signal line configured to interconnect the first electrode and the second electrode and transmit the electrical stimulation received by the second electrode to the first electrode; and a lead case configured to surround the lead, and a conductive plate configured to apply electrical stimulation to body organs and a support plate configured to provide electrical stimulation from the first electrode to the conductive plate by contacting the first electrode.