Patents by Inventor Tae-kyung Lee

Tae-kyung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230022852
    Abstract: A lens includes a lens unit, an uneven layer formed on at least a portion of a surface of the lens unit, a buffer layer covering the uneven layer and having a shape conforming to an uneven surface of the uneven layer, and a water-repellent layer covering the buffer layer.
    Type: Application
    Filed: May 23, 2022
    Publication date: January 26, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Ji Hye NAM, Hye Lee KIM, Jong Hyouk KIM, Jong Won YUN, Seong Ho EOM, Seong Chan PARK, Yong Joo JO
  • Publication number: 20230016858
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 ?m/m° C. to 90 ?m/m° C., an elastomer, and an inorganic filler.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kwan Suk Ryu, Tae Kyung Lee
  • Publication number: 20230015405
    Abstract: A bulk acoustic resonator package is provided. The bulk acoustic resonator package includes a substrate; a cap; a resonance portion including a first electrode, a piezoelectric layer, and a second electrode, stacked in a first direction in which the substrate and the cap face each other, and disposed between the substrate and the cap; and a cap melting member disposed to surround the resonance portion, and disposed to be in contact with a portion of a surface of the cap facing the substrate, when viewed in the first direction, and including a material or a structure that is based on a melting of the portion of the surface of the cap.
    Type: Application
    Filed: February 24, 2022
    Publication date: January 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Sung Joon PARK, Kwang Su KIM, Jae Goon AUM, Sung HAN
  • Patent number: 11558026
    Abstract: A bulk-acoustic wave resonator may include: a substrate; a resonator unit including a first electrode disposed on the substrate, a piezoelectric layer disposed on the first electrode, and a second electrode disposed on the piezoelectric layer; and a protective layer disposed on a surface of the resonator unit. The protective layer is formed of a diamond film, and a grain size of the diamond film is 50 nm or more.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: January 17, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Sang Heon Han, Ran Hee Shin, Jin Suk Son
  • Patent number: 11558031
    Abstract: A film bulk acoustic resonator includes: a first electrode disposed on a substrate; a piezoelectric body disposed on the first electrode and including AlN to which a dopant is added; and a second electrode disposed on the piezoelectric body and facing the first electrode such that the piezoelectric body is interposed between the second electrode and the first electrode, wherein the dopant includes either one of 0.1 to 24 at % of Ta and 0.1 to 23 at % of Nb.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: January 17, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Jin Suk Son, Sung Sun Kim, Je Hong Kyoung, Hwa Sun Lee, Ran Hee Shin
  • Patent number: 11558030
    Abstract: A bulk-acoustic wave resonator may include: a substrate; a resonance portion; a first electrode disposed on the substrate; a piezoelectric layer disposed on the first electrode in the resonance portion; a second electrode disposed on the piezoelectric portion in the resonance portion; and a seed layer disposed in a lower portion of the first electrode. The seed layer may be formed of titanium (Ti) having a hexagonal close packed (HCP) structure, or an alloy of Ti having the HCP structure. The seed layer may have a thickness greater than or equal to 300 ? and less than or equal to 1000 ?, or may be thinner than the first electrode.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: January 17, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Ran Hee Shin, Jin Suk Son, Je Hong Kyoung
  • Patent number: 11558034
    Abstract: An acoustic resonator filter is provided. The acoustic resonator filter includes a rear filter electrically connected between a front port and a rear port, through which a radio frequency (RF) signal passes, the rear filter including at least one film bulk acoustic resonator (FBAR); and a front filter electrically connected between the front port and the rear filter and including at least one solidly mounted resonator (SMR).
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: January 17, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Han, Yoon Sok Park, Tae Kyung Lee, Hwa Sun Lee
  • Publication number: 20230008635
    Abstract: An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other. The cap includes a central portion accommodating the acoustic resonator, and an outer portion disposed outside of the central portion and having a bonding surface. The outer portion includes protrusions in contact with the bonding portion, and at least one trench disposed between the protrusions. The acoustic resonator package further includes a first protective layer and a second protective layer, the first protective layer and the second protective layer being disposed on a region of the bonding surface formed on each of the protrusions.
    Type: Application
    Filed: December 17, 2021
    Publication date: January 12, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Sung HAN, Jae Goon AUM
  • Patent number: 11533041
    Abstract: A bulk acoustic wave resonator includes: a first electrode; a piezoelectric layer disposed on at least a portion of the first electrode; and a second electrode disposed on the piezoelectric layer. The piezoelectric layer contains a dopant, and a value of [a thickness (nm) of the piezoelectric layer×a concentration (at %) of the dopant]/100 is less than or equal to 80.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: December 20, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Ran Hee Shin, Jin Suk Son, Je Hong Kyoung
  • Publication number: 20220399874
    Abstract: An acoustic wave resonator package is provided. The acoustic wave resonator package includes an acoustic wave resonator including an acoustic wave generator on a first surface of a substrate; a cover disposed to face the first surface of the substrate; a bonding member disposed between the substrate and the cover, and configured to bond a bonding surface of the acoustic wave generator and the cover to each other, wherein the bonding member includes glass frit, and the bonding surface of the acoustic wave resonator which is bonded to the bonding member may be formed of a dielectric material.
    Type: Application
    Filed: October 27, 2021
    Publication date: December 15, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Sang Heon HAN, Hwa Sun LEE, Jae Goon AUM, Sung HAN
  • Publication number: 20220380446
    Abstract: The present disclosure provides isolated binding proteins such as humanized antibodies and antigen-binding fragments thereof that target alpha-synuclein, including multispecific isolated binding proteins that target both alpha-synuclein and insulin-like growth factor 1 receptor. Also provided are methods of using the binding proteins to treat alpha-synucleinopathies.
    Type: Application
    Filed: May 12, 2022
    Publication date: December 1, 2022
    Applicant: ABL BIO INCORPORATED
    Inventors: Jinhyung AHN, Sungwon AN, Dongin KIM, Eunsil SUNG, Jaehyun EOM, Sang Hoon LEE, Seung-Jae LEE, Tae Kyung KIM, Min Sun CHOI, Weonkyoo YOU, Jaeho JUNG, Juhee KIM, Jinwon JUNG, Yeunju KIM, Yonggyu SON, Byungje SUNG
  • Patent number: 11515357
    Abstract: A magnetic junction memory device is provided. The magnetic junction memory device including a sensing circuit including a sensing node, the sensing node being connected to a first end of a transistor and configured to change a voltage of the sensing node in accordance with a resistance of a magnetic junction memory cell, a gating voltage generator circuit configured to generate a gating voltage of the transistor using a reference resistor and a reference voltage, and a read circuit configured to read data from the magnetic junction memory cell using the reference voltage and the voltage of the sensing node.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: November 29, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan Kyung Kim, Eun Ji Lee, Ji Yean Kim, Tae Seong Kim, Jae Wook Joo
  • Patent number: 11496068
    Abstract: The present invention relates to an energy harvesting apparatus using triboelectrification. The energy harvesting apparatus of the present invention may include: a housing formed in an accommodation space in the energy harvesting apparatus; an electrification sheet accommodated to be rolled into the housing; an elastic body provided in the housing and providing elastic force so that the electrification sheet is rolled into the housing; and an electrode unit provided on the electrification sheet or on the periphery of the electrification sheet and electrificating the electrification sheet through friction while the electrification sheet is pulled or rolled.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 8, 2022
    Assignee: CHUNGANG UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Sang Min Lee, Ji Hoon Chung, Su Kyung Lee, Hak Seong Moon, Hyung Seok Yong, Tae Hun Kim, Ban Seok Kim
  • Publication number: 20220349942
    Abstract: A processor-implemented battery management method includes: estimating state information of a plurality of battery cells in a battery pack using a first battery state estimation model; determining whether state information of at least one of the plurality of battery cells is to be estimated using a second battery state estimation model; and estimating the state information of the at least one battery cell using the second model, in response to a result of the determining being that the state information of the at least one battery cell is to be estimated using the second model.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Sangdo PARK, Young Hun SUNG, Tae Won SONG, Tae Kyung LEE
  • Patent number: 11471701
    Abstract: A body-insertable device having an adjustable radiation emission direction and radiation emission range, which includes a first outer body extending to be long and an accommodation space having a first accommodation space and a second accommodation space having different distances to the first outer body.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: October 18, 2022
    Assignee: NATIONAL CANCER CENTER
    Inventors: Young Kyung Lim, Ui Jung Hwang, Young Moon Goh, Hak Soo Kim, Dong Ho Shin, Se Byeong Lee, Jong Hwi Jeong, Joo Young Kim, Tae Hyun Kim
  • Patent number: 11476833
    Abstract: An acoustic resonator includes a substrate, an insulation layer disposed on the substrate, a resonating portion disposed on the insulation layer and having a first electrode, a piezoelectric layer, and a second electrode, stacked thereon, a cavity disposed between the insulation layer and the resonating portion, a protruded portion having a plurality of protrusions disposed on a lower surface of the cavity, and a hydrophobic layer disposed on an upper surface of the cavity and a surface of the protruded portion.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: October 18, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Yoon Kim, Tae Kyung Lee, Sang Kee Yoon, Sung Jun Lee, Chang Hyun Lim, Nam Jung Lee, Tae Hun Lee, Moon Chul Lee
  • Patent number: 11476832
    Abstract: A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: October 18, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Wook Park, Tae Kyung Lee, Seong Hun Na, Jae Chang Lee, Jae Hyun Jung
  • Patent number: 11437561
    Abstract: An acoustic resonator comprises a substrate, a resonant portion disposed on the substrate and in which a first electrode, a piezoelectric layer, and a second electrode are stacked, a protective layer disposed on an upper portion of the resonant portion, and a hydrophobic layer formed on the protective layer, and the protective layer comprises a first protective layer stacked on the second electrode and a second protective layer stacked on the first protective layer, wherein a density of the second protective layer is higher than a density of the first protective layer.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: September 6, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyung Lee, Jong Beom Kim, Min Jae Ahn, Jin Suk Son
  • Patent number: 11422192
    Abstract: A method of estimating a state of health of a battery, the method being performed by a computing apparatus, the method including: preparing a trained artificial neural network; generating input data by measuring at least one parameter of a battery; acquiring a plurality of output values each corresponding to a plurality of classes by inputting the input data into the trained artificial neural network; and generating a state of health estimation value of the battery using a plurality of preset health state sections each corresponding to the plurality of classes and the plurality of output values each corresponding to the plurality of classes.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: August 23, 2022
    Assignees: Samsung SDI Co., Ltd., POSTECH Research and Business Development Foundation
    Inventors: Jang-Woo Lee, Jungsoo Kim, Huiyong Chun, Soohee Han, Tae-Kyung Lee
  • Patent number: 11422191
    Abstract: A processor-implemented battery management method includes: estimating state information of a plurality of battery cells in a battery pack using a first battery state estimation model; determining whether state information of at least one of the plurality of battery cells is to be estimated using a second battery state estimation model; and estimating the state information of the at least one battery cell using the second model, in response to a result of the determining being that the state information of the at least one battery cell is to be estimated using the second model.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: August 23, 2022
    Assignees: Samsung Electronics Co., Ltd., SAMSUNG SDI CO., LTD.
    Inventors: Sangdo Park, Young Hun Sung, Tae Won Song, Tae Kyung Lee