Abstract: Proposed is a 3D over-printing device for over-printing a 3D shape on an existing structure, the device including: a vat containing a light-curable material; a driving part configured to fix the existing structure and move the existing structure vertically, layer by layer, within the vat; and an optical part comprising a projector and a mirror structure, and configured to photocure an area to be cured on a surface of the light-curable material by projecting UV light in several directions simultaneously from above the surface of the light-curable material toward the surface of the light-curable material that is upward exposed and in contact with the existing structure.

Abstract: An apparatus for forming an optical pattern includes a vacuum chamber, a mount on which a substrate to be prepared using a mask is to be supported, a diffusion unit adjacent the mask, spaced apart from the mask by a preset interval, and facing the mask, the diffusion unit to diffuse light incident thereon as uniform surface light and transmit the uniform surface light to the mask, and a light source unit spaced in a lateral direction from the diffusion unit, the light source unit to generate light to be incident on the diffusion unit.

Abstract: An apparatus for measuring a deposition rate includes a light source unit in a deposition region between a deposition source and a substrate in a vacuum chamber, the light source unit emits a monochromatic light toward a deposition material released from the deposition source, a photosensor unit that measures at least one of light absorption, scattering, and emission in the deposition region when light emitted from the light source unit passes through the deposition region, and a multi-pass forming unit defining a multi-pass path between the light source unit and the photosensor unit.

Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.

Abstract: Provided are a laminating apparatus and a laminating method using the same. In an aspect, the laminating apparatus includes a stage, a heating bar, and a press part. In an aspect, the laminating may be performed in a state where the donor film is closely attached to the substrate to prevent defects of the donor film from occurring during the laminating, thereby improving reliability of the laminating apparatus.

Abstract: A method of manufacturing a mask includes aligning a mask substrate comprising a thin film at a processing position, forming a coating layer comprising a cleaning solution material on a first surface of the mask substrate, forming a deposition pattern on a second surface of the mask substrate, and removing the coating layer from the mask substrate comprising the deposition pattern.

Abstract: A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.

Abstract: A method of manufacturing a mask includes aligning a mask substrate comprising a thin film at a processing position, forming a coating layer comprising a cleaning solution material on a first surface of the mask substrate, forming a deposition pattern on a second surface of the mask substrate, and removing the coating layer from the mask substrate comprising the deposition pattern.

Abstract: An apparatus for measuring a deposition rate includes a light source unit in a deposition region between a deposition source and a substrate in a vacuum chamber, the light source unit emits a monochromatic light toward a deposition material released from the deposition source, a photosensor unit that measures at least one of light absorption, scattering, and emission in the deposition region when light emitted from the light source unit passes through the deposition region, and a multi-pass forming unit defining a multi-pass path between the light source unit and the photosensor unit.

Abstract: An apparatus for forming an optical pattern includes a vacuum chamber, a mount on which a substrate to be prepared using a mask is to be supported, a diffusion unit adjacent the mask, spaced apart from the mask by a preset interval, and facing the mask, the diffusion unit to diffuse light incident thereon as uniform surface light and transmit the uniform surface light to the mask, and a light source unit spaced in a lateral direction from the diffusion unit, the light source unit to generate light to be incident on the diffusion unit.

Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.

Abstract: A laser irradiation device includes a laser generator for patterning and a laser generator for preheating. A laser induced thermal imaging (LITI) method, includes preparing an acceptor substrate, laminating a donor substrate on the acceptor substrate, and irradiating a laser beam onto a predetermined region of the donor substrate and carrying out transfer using a laser irradiation device having a laser generator for patterning and a laser generator for preheating. Advantageously, a laser beam having high intensity generated by the laser generator for patterning is used to prevent the transfer layer from being degraded, and a laser beam generated by the laser generator for preheating is simultaneously used for preheating so that an edge open failure does not occur and the transfer can be readily carried out even in a portion having a step of the acceptor substrate.

Abstract: A method of manufacturing a mask includes: providing a base substrate including light-absorbing layer patterns on a first surface thereof; providing a reflective layer on the light-absorbing layer patterns and the first surface of the base substrate; and providing reflective patterns by partially removing the reflective layer. The providing the reflective patterns includes removing the light-absorbing layer patterns and a portion of the reflective layer, by irradiating the light-absorbing layer patterns with laser light.

Abstract: A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.

Abstract: An organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device has a structure including an organic layer between a pixel electrode and an opposite electrode, the organic layer including a emissive layer and an insulating layer defining a light emission area. Accordingly, the insulating layer included in the organic layer functions as a pixel-defining layer, and thus, “edge open”, which is generated when forming an emissive layer on a thick pixel-defining layer according to the comparable art, may be reduced or prevented.

Abstract: Provided are a laser induced thermal imaging (LITI) mask, a laser irradiation apparatus including the LITI mask, and a method of manufacturing an organic light emitting device by using the LITI mask. The LITI mask including an opening corresponding to a pixel region and an opening corresponding to an edge of a pixel is used to form an organic layer in an upper portion of a substrate of an organic light emitting device, thereby transferring the organic layer to an edge of the pixel region.

Abstract: In a flat panel display and a method of fabricating the same, the flat panel display includes a substrate having a pixel region and alignment mark regions. The alignment mark regions are disposed at opposite sides of the pixel region and along the pixel region. A unit pixel array is arranged on the pixel region in a matrix manner. The alignment mark regions have at least one pair of alignment marks disposed thereon in an opposing manner. The alignment mark pairs are located in correspondence with respective columns of the unit pixel array.

Abstract: In a laser irradiation device, a patterning method and a method of fabricating an Organic Light Emitting Display (OLED) using the same. The laser irradiation device includes a light source, a mask, a projection lens, and a Fresnel lens formed at a predetermined portion of the mask to change an optical path. When an organic layer pattern is formed using the laser irradiation device, laser radiation is irradiated onto a region of an organic layer, which is to be cut, and the laser radiation is appropriately irradiated onto a region of the organic layer, which is to be separated from a donor substrate. The laser radiation irradiated onto an edge of the organic layer pattern has a laser energy density greater than that of the laser radiation irradiated onto other portions of the organic layer pattern. As a result, it is possible to form a uniform organic layer pattern and reduce damage of the organic layer.

Abstract: An organic light-emitting display apparatus includes: a plurality of thin film transistors (TFTs); a planarization layer covering the plurality of TFTs; a plurality of pixel electrodes formed on the planarization layer, each of the pixel electrodes being connected to a corresponding one of the plurality of TFTs using a via-hole passing through the planarization layer and having a light-emitting portion and a non-emitting portion, and each of the via-holes being located at a point farthest from each of the light-emitting portions surrounding the via-hole; a pixel defining layer formed on the planarization layer to respectively cover each of the via-holes and the non-emitting portions; organic layers, each organic layer including an emission layer and being disposed in a corresponding one of the light-emitting portions; and a counter electrode disposed on each of the organic layers.

Abstract: An organic electro luminescent display with auxiliary layers on a cathode contact and an encapsulating junction region to easily remove polymer organic layers of the junction and a method for fabricating the same. The organic electro luminescent display has the first electrode formed on a lower insulating substrate, a pixel defining layer formed to make some portions of the first electrode opened over the entire surface of the lower insulating substrate, an organic emission layer formed on an opening of the first electrode, the second electrode formed on the organic emission layer, an upper substrate for encapsulating the first electrode, the organic emission layer and the second electrode, and auxiliary layers formed on the cathode contact and the encapsulating junction region of the lower insulating substrate.