Abstract: An organic light-emitting display apparatus includes: a plurality of thin film transistors (TFTs); a planarization layer covering the plurality of TFTs; a plurality of pixel electrodes formed on the planarization layer, each of the pixel electrodes being connected to a corresponding one of the plurality of TFTs using a via-hole passing through the planarization layer and having a light-emitting portion and a non-emitting portion, and each of the via-holes being located at a point farthest from each of the light-emitting portions surrounding the via-hole; a pixel defining layer formed on the planarization layer to respectively cover each of the via-holes and the non-emitting portions; organic layers, each organic layer including an emission layer and being disposed in a corresponding one of the light-emitting portions; and a counter electrode disposed on each of the organic layers.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: An organic light-emitting display apparatus is disclosed.

Abstract: A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

Abstract: The invention is directed to an organic electroluminescent (EL) display device having an improved light extracting efficiency due to a photonic crystal layer formed proximate one side of a stack. Among other elements, the stack may include a first electrode formed on a substrate, an organic light emitting layer formed above the first electrode, and a second electrode formed above the organic light emitting layer. Additionally, the photonic crystal layer may be configured to correspond to a wavelength of colored light. An organic EL display device having an improved light extracting efficiency may be manufactured using a thermal transfer donor film to adhere the photonic crystal layer to the stack.

Abstract: A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.

Abstract: Provided are a laser irradiation apparatus and method of fabricating an organic light emitting display using the same. The laser irradiation apparatus includes a mask positioned below the laser generator, and the mask is patterned such that lengths of an upper portion and a lower portion of a mask pattern are patterned longer than a length of a middle portion of the mask pattern with respect to the scanning direction. The method of fabricating an organic light emitting display includes scanning a laser beam on a predetermined region of the donor substrate using the laser irradiation apparatus to form an organic layer pattern on the substrate. When the organic layer pattern is formed using a laser induced thermal imaging (LITI) method, the transfer may be carried out using a laser beam having low energy, laser beam efficiency may be enhanced, the organic layer may be less damaged, and the quality of the organic layer pattern to be transferred may also be enhanced.

Abstract: A laser irradiation apparatus and method of fabricating an organic light emitting display using the same are provided. The laser irradiation apparatus includes: a laser generator; a mask having means for changing a propagation path of a laser beam; and a projection lens. The method of fabricating an organic light emitting display includes: irradiating a laser beam on an edge of an irradiated region of a donor substrate using the laser irradiation apparatus with high intensity to form an organic layer pattern on a substrate. The laser beam having low intensity can perform a transfer process to improve laser beam efficiency. In addition, it is possible to reduce damage on the organic layer, and improve quality of the transferred organic layer pattern.

Abstract: A substrate includes a substrate; a number of pad redistribution chips stacked on the substrate and on one another after being rotated 90° in a predetermined direction relative to one another, the pad redistribution chips having a number of center pads positioned at the center thereof, a number of (+) edge pads positioned on an end thereof while corresponding to those of the center pads lying in (+) direction from a middle center pad located in the middle of the center pads, a number of (?) edge pads positioned on the other end thereof while corresponding to those of the center pads lying in (?) direction with symmetry to those of the center pads lying in the (+) direction, and a number of traces for electrically connecting the center pads to the corresponding (±) edge pads, respectively; a flexible PCB for electrically connecting the substrate to the pad redistribution chips; and an anisotropic dielectric film for electrically connecting the pad redistribution chips to the flexible PCB and the substrate to t

Abstract: An organic layer of an organic light emitting diode (OLED) display device is formed by transferring a transfer layer of a donor film to aligned pixel openings in a pixel defining region of the OLED display device such that the organic layer is formed in the pixel openings. Each aligned pixel opening has a pair of long sides and a pair of short sides, and the transferring of the transfer layer is performed by applying tensile force to the donor film in a direction perpendicular to the short sides of the pixel openings.

Abstract: A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first insulation member and have portions which are exposed on the engagement projections. Second conductive members are disposed in the second insulation member in such a way as to face the first conductive members and have portions which are exposed in the engagement grooves. A first semiconductor chip is disposed within the first insulation member and is electrically connected to the first conductive members. A second semiconductor chip is disposed in the second insulation member and is electrically connected to the second conductive members.

Abstract: A donor substrate for laser induced thermal imaging and a method of fabricating an organic light emitting diode (OLED) using the donor substrate are disclosed. In one embodiment, the donor substrate includes a base film, a light-to-heat conversion layer formed on the base film, a buffer layer formed on the light-to-heat conversion layer, and a transfer layer formed on the buffer layer. The buffer layer is formed of magnesium (Mg), an Mg alloy, or magnesium oxide. In the donor substrate for laser induced thermal imaging, the buffer layer is formed between the interlayer and the transfer layer or between the light-to-heat conversion layer and the transfer layer, so that surface characteristics between the donor substrate and the transfer layer can be improved.

Abstract: An organic electro luminescent display with auxiliary layers on a cathode contact and an encapsulating junction region to easily remove polymer organic layers of the junction. The organic electro luminescent display has the first electrode formed on a lower insulating substrate, a pixel defining layer formed to make some portions of the first electrode opened over the entire surface of the lower insulating substrate, an organic emission layer formed on an opening of the first electrode, the second electrode formed on the organic emission layer, an upper substrate for encapsulating the first electrode, the organic emission layer and the second electrode, and auxiliary layers formed on the cathode contact and the encapsulating junction region of the lower insulating substrate.

Abstract: An Organic Light Emitting Display (OLED) and its fabrication method has a pixel defining layer provided on a first electrode which is formed with a gas vent groove to allow gas to vent when the pixel defining layer is being formed, so that gas is not left in a pixel but vented when a donor film is laminated by a Laser-Induced Thermal Imaging (LITI) method, thereby decreasing edge open failures.

Abstract: A donor substrate for a laser induced thermal imaging method and an organic light emitting display manufactured using the same are provided. A laser induced thermal imaging apparatus includes a stage grounded by a grounding means, and a method of fabricating an organic light emitting display is capable of controlling static electricity which may be built up while an organic layer is formed using the apparatus.

Abstract: An Organic Light Emitting Display (OLED) and its fabrication method has a pixel defining layer provided on a first electrode which is formed with a gas vent groove to allow gas to vent when the pixel defining layer is being formed, so that gas is not left in a pixel but vented when a donor film is laminated by a Laser-Induced Thermal Imaging (LITI) method, thereby decreasing edge open failures.

Abstract: A Laser Induced Thermal Imaging (LITI) mask and an organic electroluminescent device fabrication method using the mask provides a LITI mask in which corner regions are reinforced to improve adhesive force between a receptor substrate and a transfer layer on corners of a pixel portion of the receptor substrate, and an organic electroluminescent device fabrication method using such a LITI mask.

Abstract: A laser patterning apparatus for handling a donor film and improving compression uniformity between the donor film and an acceptor substrate is provided. The laser patterning apparatus includes: a stage that supports an acceptor substrate; a shielding mask that is placed on the acceptor substrate to form a pattern and is attached to a donor film on one surface thereof; a laser gun that is disposed at an upper part of the stage to radiate laser light to a portion of the donor film through the pattern of the shielding mask; a pressing member that corresponds to a portion of the shielding mask; and an actuator that is connected to one side of the pressing member to press the pressing member.

Abstract: An Organic Light Emitting Display (OLED) and its fabrication method has a pixel defining layer provided on a first electrode which is formed with a gas vent groove to allow gas to vent when the pixel defining layer is being formed, so that gas is not left in a pixel but vented when a donor film is laminated by a Laser-Induced Thermal Imaging (LITI) method, thereby decreasing edge open failures.

Abstract: A circuit substrate includes a substrate body having a first terminal and a second terminal separated from the first terminal. A circuit wire includes a wiring unit for electrically connecting the first and second terminals by electrically connecting conductive polarization particles that include a first polarity and a second polarity that is opposite to the first polarity. The circuit wire also includes an insulation unit for insulating the wiring unit.