Patents by Inventor Tae Seung Kim
Tae Seung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240106415Abstract: Provided is a surface acoustic wave filter with improved attenuation characteristics.Type: ApplicationFiled: September 21, 2023Publication date: March 28, 2024Inventors: Hyung Gon KIM, Tae Hyeong KWON, Jae Seung CHOI
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Patent number: 11921456Abstract: An example image forming apparatus includes a frame, a first shaft supported by the frame, and a first coupler. The first coupler includes a body coupled to one end of the first shaft and a first protrusion protruding from the body in an axial direction of the first shaft, the first protrusion having a first surface and a second protrusion protruding from the first surface. The second protrusion is to lock with a groove to mount a cartridge on the frame, the first shaft is to provide a rotational force in a first rotational direction to rotate the second protrusion of the first coupler and to insert the second protrusion into the groove to lock with the cartridge, and the first surface of the first protrusion of the first coupler is to contact a second surface to transmit the rotational force to the second coupler in the first rotational direction.Type: GrantFiled: February 22, 2023Date of Patent: March 5, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Pil-Seung Oh, Taeil Jung, Tae-Hee Kim, Chang-Woo Lee
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Patent number: 11915911Abstract: An apparatus for distributing plasma products includes first and second electrodes that each include planar surfaces. The first electrode forms first apertures from a first planar surface to a second planar surface; the second electrode forms second apertures from the third planar surface to the fourth planar surface. The electrodes couple through one or more adjustable couplers such that the third planar surface is disposed adjacent to the second planar surface with a gap therebetween, the gap having a gap distance. Each of the adjustable couplers has a range of adjustment. The first and second apertures are arranged such that for at least one position within the ranges of adjustment, none of the first apertures aligns with any of the second apertures to form an open straight-line path extending through both the first and second electrodes.Type: GrantFiled: June 29, 2020Date of Patent: February 27, 2024Assignee: Applied Materials, Inc.Inventors: Tien Fak Tan, Saravjeet Singh, Dmitry Lubomirsky, Tae Wan Kim, Kenneth D. Schatz, Tae Seung Cho, Lok Kee Loh
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Patent number: 11522043Abstract: A method of fabricating an integrated circuit (IC) includes forming a dielectric layer on a substrate having a plurality of the IC. A thin-film resistor (TFR) layer is deposited on the dielectric layer, and an underlayer (UL) including carbon is formed on the TFR layer. A hard mask layer including silicon is formed on the UL. Masked etching of the hard mask layer transfers a pattern of a photoresist layer onto the hard mask layer to form a hard mask layer pattern. Masked etching of the UL transfers the hard mask layer pattern onto the UL to form a UL pattern. Masked etching of the TFR layer transfers the UL pattern onto the TFR layer to form a TFR layer pattern including a matched pair of TFRs. The matched pair of TFRs are generally included in circuitry configured together for implementing at least one function.Type: GrantFiled: October 30, 2020Date of Patent: December 6, 2022Assignee: Texas Instruments IncorporatedInventors: Scott William Jessen, Tae Seung Kim, Steven Lee Prins, Can Duan, Abbas Ali, Erich Wesley Kinder
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Publication number: 20210134939Abstract: A method of fabricating an integrated circuit (IC) includes forming a dielectric layer on a substrate having a plurality of the IC. A thin-film resistor (TFR) layer is deposited on the dielectric layer, and an underlayer (UL) including carbon is formed on the TFR layer. A hard mask layer including silicon is formed on the UL. Masked etching of the hard mask layer transfers a pattern of a photoresist layer onto the hard mask layer to form a hard mask layer pattern. Masked etching of the UL transfers the hard mask layer pattern onto the UL to form a UL pattern. Masked etching of the TFR layer transfers the UL pattern onto the TFR layer to form a TFR layer pattern including a matched pair of TFRs. The matched pair of TFRs are generally included in circuitry configured together for implementing at least one function.Type: ApplicationFiled: October 30, 2020Publication date: May 6, 2021Inventors: Scott William Jessen, Tae Seung Kim, Steven Lee Prins, Can Duan, Abbas Ali, Erich Wesley Kinder
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Patent number: 10759811Abstract: The present invention provides a method for preparing anhydrosugar alcohol, in which the reaction temperature in a vacuum reaction that converts sugar alcohol into anhydrosugar alcohol is controlled to two steps of temperature that is, a first-step low reaction temperature of 100 to 150° C. and a second-step high reaction temperature of 151 to 240° C., so that the selectivity for the intermediate product 1,4-sorbitan can be increased, thereby increasing the yield of anhydrosugar alcohol.Type: GrantFiled: August 25, 2016Date of Patent: September 1, 2020Assignee: SK Innovation Co., Ltd.Inventors: In Hyoup Song, Tae Seung Kim, Sung Real Son, Yoon Jae Yim, Suk Joon Hong
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Patent number: 9926331Abstract: The present invention relates to a method for producing anhydrosugar alcohol using an organic additive having one hydroxyl group. The present invention makes it possible to prevent oligomers and polymers from being produced by polymerization of isosorbide during dehydration of sorbitol molecules, and thus solves problems, including a reduction in fluidity in a dehydration reactor, interference with the flow of fluids in the reactor and pipelines, and interference with stirrer operation, which occur due to the oligomers and polymers.Type: GrantFiled: January 13, 2017Date of Patent: March 27, 2018Assignee: SK Innovation Co., Ltd.Inventors: Sung Real Son, Sang Hye Shin, In Hyoup Song, Suk Joon Hong, Tae Seung Kim, Yoon Jae Yim
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Publication number: 20170204115Abstract: The present invention relates to a method for producing anhydrosugar alcohol using an organic additive having one hydroxyl group. The present invention makes it possible to prevent oligomers and polymers from being produced by polymerization of isosorbide during dehydration of sorbitol molecules, and thus solves problems, including a reduction in fluidity in a dehydration reactor, interference with the flow of fluids in the reactor and pipelines, and interference with stirrer operation, which occur due to the oligomers and polymers.Type: ApplicationFiled: January 13, 2017Publication date: July 20, 2017Inventors: Sung Real Son, Sang Hye Shin, In Hyoup Song, Suk Joon Hong, Tae Seung Kim, Yoon Jae Yim
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Publication number: 20170057974Abstract: The present invention provides a method for preparing anhydrosugar alcohol, in which the reaction temperature in a vacuum reaction that converts sugar alcohol into anhydrosugar alcohol is controlled to two steps of temperature that is, a first-step low reaction temperature of 100 to 150° C. and a second-step high reaction temperature of 151 to 240° C., so that the selectivity for the intermediate product 1,4-sorbitan can be increased, thereby increasing the yield of anhydrosugar alcohol.Type: ApplicationFiled: August 25, 2016Publication date: March 2, 2017Inventors: In Hyoup Song, Tae Seung Kim, Sung Real Son, Yoon Jae Yim, Suk Joon Hong
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Patent number: 9490162Abstract: An integrated circuit may include dual damascene interconnects formed using a via-first dual damascene process or a trench-first dual damascene process. The via-first process may be a partial-via-first process or a full-via-first process. A trench mask for a wide interconnect line which is at least twice as wide as a dual damascene via in the wide interconnect line may have a dielectric slot adjacent to the dual damascene via. The dual damascene via is laterally separated from the dielectric slot by no more than half a width of the dual damascene via.Type: GrantFiled: June 16, 2015Date of Patent: November 8, 2016Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Tae Seung Kim
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Publication number: 20150287631Abstract: An integrated circuit may include dual damascene interconnects formed using a via-first dual damascene process or a trench-first dual damascene process. The via-first process may be a partial-via-first process or a full-via-first process. A trench mask for a wide interconnect line which is at least twice as wide as a dual damascene via in the wide interconnect line may have a dielectric slot adjacent to the dual damascene via. The dual damascene via is laterally separated from the dielectric slot by no more than half a width of the dual damascene via.Type: ApplicationFiled: June 16, 2015Publication date: October 8, 2015Inventor: Tae Seung KIM
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Patent number: 9087824Abstract: An integrated circuit may include dual damascene interconnects formed using a via-first dual damascene process or a trench-first dual damascene process. The via-first process may be a partial-via-first process or a full-via-first process. A trench mask for a wide interconnect line which is at least twice as wide as a dual damascene via in the wide interconnect line may have a dielectric slot adjacent to the dual damascene via. The dual damascene via is laterally separated from the dielectric slot by no more than half a width of the dual damascene via.Type: GrantFiled: September 30, 2014Date of Patent: July 21, 2015Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Tae Seung Kim
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Publication number: 20150170998Abstract: An integrated circuit may include dual damascene interconnects formed using a via-first dual damascene process or a trench-first dual damascene process. The via-first process may be a partial-via-first process or a full-via-first process. A trench mask for a wide interconnect line which is at least twice as wide as a dual damascene via in the wide interconnect line may have a dielectric slot adjacent to the dual damascene via. The dual damascene via is laterally separated from the dielectric slot by no more than half a width of the dual damascene via.Type: ApplicationFiled: September 30, 2014Publication date: June 18, 2015Inventor: Tae Seung KIM
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Patent number: 8974858Abstract: An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.Type: GrantFiled: July 17, 2013Date of Patent: March 10, 2015Assignee: Samsung Display Co., Ltd.Inventors: Jae-Wan Park, You-Min Cha, Won-Seok Cho, Jae-Mork Park, Jae-Hong Ahn, Min-Jeong Hwang, Tae-Wook Kim, Jong-Woo Lee, Tae-Seung Kim
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Patent number: 8968477Abstract: A deposition mask for manufacturing an organic light emitting display (OLED) using the same are provided. The deposition mask is intended for preventing an organic film from being damaged due to touching of a blocked-off portion of the mask to an emission layer (EML), or chemical transition from being generated at the organic film. For that purpose, the deposition mask stuck to a substrate of the OLED to deposit an organic EML includes an opening and an indentation. The opening is opened so as to deposit the organic EML. The indentation is indented a predetermined depth from a plane facing the substrate.Type: GrantFiled: October 7, 2009Date of Patent: March 3, 2015Assignee: Samsung Display Co., Ltd.Inventors: Chang-Ho Kang, Tae-Seung Kim, Jae-Min Hong
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Publication number: 20130309403Abstract: An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.Type: ApplicationFiled: July 17, 2013Publication date: November 21, 2013Inventors: Jae-Wan PARK, You-Min CHA, Won-Seok CHO, Jae-Mork PARK, Jae-Hong AHN, Min-Jeong HWANG, Tae-Wook KIM, Jong-Woo LEE, Tae-Seung KIM
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Patent number: 8557046Abstract: A deposition source capable of uniformly producing a deposition film. The deposition source includes a furnace, a first heating unit surrounding the furnace to heat the furnace and a second heating unit spaced-apart from the first heating unit by an interval and surrounding the furnace to heat the furnace, wherein the second heating unit comprises a plurality of separate sub-heating units that surround the furnace.Type: GrantFiled: April 29, 2010Date of Patent: October 15, 2013Assignee: Samsung Display Co., Ltd.Inventors: Jong-Woo Lee, Tae-Seung Kim, Chang-Soon Ji, Won-Seok Cho, Hey-Yeon Shim, Yong-Hun Jo, Sang-Jin Han
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Patent number: 8512503Abstract: A sealing device including a mask for partially irradiating light and a method of manufacturing a display device using the sealing device is disclosed. The sealing device used to bond first and second substrates by interposing a sealing material at edges of the first and second substrates and by irradiating light to the sealing material comprises: a mask disposed on one side of the stage, in which a transmission portion is formed in correspondence to the formation position of the sealing member so that light can be irradiated to the sealing material; and an optical head irradiating the light to the sealing material through the transmission portion of the mask. A pattern for regulating the amount of the light irradiated to the sealing material is formed in the transmission portion of the mask.Type: GrantFiled: February 11, 2013Date of Patent: August 20, 2013Assignee: Samsung Display Co., Ltd.Inventors: Jong-woo Lee, Tae-seung Kim, Joon-young Park, Won-kyu Kwak
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Patent number: 8482422Abstract: A thin film deposition apparatus to remove static electricity generated between a substrate and a mask, and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus.Type: GrantFiled: April 2, 2012Date of Patent: July 9, 2013Assignee: Samsung Display Co., Ltd.Inventors: Chang-Soon Ji, Tae-Seung Kim, Jong-Woo Lee, Chengguo An
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Patent number: 8371353Abstract: A sealing device including a mask for partially irradiating light and a method of manufacturing a display device using the sealing device is disclosed. The sealing device used to bond first and second substrates by interposing a sealing material at edges of the first and second substrates and by irradiating light to the sealing material comprises: a mask disposed on one side of the stage, in which a transmission portion is formed in correspondence to the formation position of the sealing member so that light can be irradiated to the sealing material; and an optical head irradiating the light to the sealing material through the transmission portion of the mask. A pattern for regulating the amount of the light irradiated to the sealing material is formed in the transmission portion of the mask.Type: GrantFiled: March 16, 2007Date of Patent: February 12, 2013Assignee: Samsung Display Co., Ltd.Inventors: Jong-woo Lee, Tae-seung Kim, Joon-young Park, Won-kyu Kwak