Abstract: The present invention relates to an evaporation source used in a vacuum deposition apparatus for forming an organic film or a metal film. The present invention provides an evaporation source including: a crucible accommodating a deposition material and having an opening portion through which the deposition material passes; a mesh member installed in the opening portion of the crucible and having a plurality of holes; and thermally conductive balls coated on the mesh member. Here, the thermally conductive balls are provided to cover the deposition material having a predetermined interval with the deposition material, not being mixed with the deposition material filling the crucible.

Abstract: A thin film deposition apparatus to remove static electricity generated between a substrate and a mask, and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus.

Abstract: A thin film deposition apparatus to remove static electricity generated between a substrate and a mask, and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus.

Abstract: A thin film deposition apparatus to remove static electricity generated between a substrate and a mask, and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus.

Abstract: An organic light emitting display device includes a first substrate, an array of organic light emitting pixels formed on the substrate, a second substrate opposing the first substrate. A frit seal interconnects the first and second substrates and surrounds the array of organic light emitting pixels. A film structure interposed between the second substrate and the array of organic light emitting pixels and contacts both the second substrate and the array.

Abstract: Disclosed are an organic light emitting display and a fabricating method of the same, which improve impact resistance and sealing property of a device using a reinforcing member besides a sealant. A first substrate includes a pixel region and a non-pixel region, at least one organic light emitting diode is formed at the pixel region and has a first electrode, an organic layer, and a second electrode, and the non-pixel region is formed at a peripheral portion of the pixel region. A second substrate is bonded to one region of the first substrate having the pixel region. A frit is disposed between the non-pixel region of the first substrate and the second substrate for adhering the first and second substrates to each other. An adhesive being coated to be spaced along a peripheral region of the frit, and including at least two discontinuous portions. A reinforcing member is disposed between the frit and the adhesive.

Abstract: A deposition source capable of uniformly producing a deposition film. The deposition source includes a furnace, a first heating unit surrounding the furnace to heat the furnace and a second heating unit spaced-apart from the first heating unit by an interval and surrounding the furnace to heat the furnace, wherein the second heating unit comprises a plurality of separate sub-heating units that surround the furnace.

Abstract: An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.

Abstract: A method of fabricating an interconnect structure, comprising exposing an empty deposition chamber to a process that includes generating reactive species produced from a source gas in the presence of a plasma. The method further comprises terminating the plasma and then introducing a semiconductor substrate with a metal layer thereon into the chamber while the reactive species are present in the chamber.

Abstract: The present invention relates to an evaporation source used in a vacuum deposition apparatus for forming an organic film or a metal film. The present invention provides an evaporation source including: a crucible accommodating a deposition material and having an opening portion through which the deposition material passes; a mesh member installed in the opening portion of the crucible and having a plurality of holes; and thermally conductive balls coated on the mesh member. Here, the thermally conductive balls are provided to cover the deposition material having a predetermined interval with the deposition material, not being mixed with the deposition material filling the crucible.

Abstract: A device to fix a substrate for a thin film sputter, includes a mask, a mask pressing plate, a magnetic body, and a driving unit. The mask having patterns is positioned under the substrate so as to form the patterns on the substrate. The mask pressing plate is positioned over the substrate and moves toward and contacts a back surface of the substrate at a predetermined pressure. The magnetic body is placed over the mask pressing plate and moves toward the mask pressing plate so as to have the mask adhere closely to the substrate by a magnetic force of the magnetic body. The driving unit applies a driving force to move the magnetic body. Where the mask pressing plate descends, the mask pressing plate adheres closely to the substrate. Thereafter, the magnetic body descends toward the back surface of the substrate which is supported by the mask pressing plate. The mask underneath the substrate adheres closely to a front surface of the substrate by the magnetic force of the magnetic body.

Abstract: A deposition mask for manufacturing an organic light emitting display (OLED) using the same are provided. The deposition mask is intended for preventing an organic film from being damaged due to touching of a blocked-off portion of the mask to an emission layer (EML), or chemical transition from being generated at the organic film. For that purpose, the deposition mask stuck to a substrate of the OLED to deposit an organic EML includes an opening and an indentation. The opening is opened so as to deposit the organic EML. The indentation is indented a predetermined depth from a plane facing the substrate.

Abstract: A deposition mask and a method for manufacturing an organic light emitting display (OLED) using the same are provided. The deposition mask is intended for preventing an organic film from being damaged due to touching of a blocked-off portion of the mask to an emission layer (EML), or chemical transition from being generated at the organic film. For that purpose, the deposition mask stuck to a substrate of the OLED to deposit an organic EML includes an opening and an indentation. The opening is opened so as to deposit the organic EML. The indentation is indented a predetermined depth from a plane facing the substrate.

Abstract: An organic light emitting display device includes a first substrate, an array of organic light emitting pixels formed on the substrate, a second substrate opposing the first substrate. A frit seal interconnects the first and second substrates and surrounds the array of organic light emitting pixels. A film structure interposed between the second substrate and the array of organic light emitting pixels and contacts both the second substrate and the array.

Abstract: An organic light emitting display device includes a first substrate, an array of organic light emitting pixels formed on the substrate, a second substrate opposing the first substrate. A frit seal interconnects the first and second substrates and surrounds the array of organic light emitting pixels. A film structure interposed between the second substrate and the array of organic light emitting pixels and contacts both the second substrate and the array.

Abstract: A method of fabricating an interconnect structure, comprising exposing an empty deposition chamber to a process that includes generating reactive species produced from a source gas in the presence of a plasma. The method further comprises terminating the plasma and then introducing a semiconductor substrate with a metal layer thereon into the chamber while the reactive species are present in the chamber.

Abstract: A sealing device including a mask for partially irradiating light and a method of manufacturing a display device using the sealing device is disclosed. The sealing device used to bond first and second substrates by interposing a sealing material at edges of the first and second substrates and by irradiating light to the sealing material comprises: a mask disposed on one side of the stage, in which a transmission portion is formed in correspondence to the formation position of the sealing member so that light can be irradiated to the sealing material; and an optical head irradiating the light to the sealing material through the transmission portion of the mask. A pattern for regulating the amount of the light irradiated to the sealing material is formed in the transmission portion of the mask.

Abstract: A mask and a deposition apparatus using the same are disclosed. One embodiment of the mask is used for depositing a thin film on the substrate having a plurality of sub-pixel regions. The mask includes a first region having a plurality of the first openings, each of which corresponds to one of the plurality of sub-pixel regions. The mask also includes second regions having a plurality of the second openings, each of which corresponds to at least two of the plurality of the sub-pixel regions. The second regions are positioned on both sides of the first region.

Abstract: Disclosed are an organic light emitting display and a fabricating method of the same, which improve impact resistance and sealing property of a device using a reinforcing member besides a sealant. A first substrate includes a pixel region and a non-pixel region, at least one organic light emitting diode is formed at the pixel region and has a first electrode, an organic layer, and a second electrode, and the non-pixel region is formed at a peripheral portion of the pixel region. A second substrate is bonded to one region of the first substrate having the pixel region. A frit is disposed between the non-pixel region of the first substrate and the second substrate for adhering the first and second substrates to each other. An adhesive being coated to be spaced along a peripheral region of the frit, and including at least two discontinuous portions. A reinforcing member is disposed between the frit and the adhesive.

Abstract: An organic light emitting display device includes a first substrate, an array of organic light emitting pixels formed on the substrate, a second substrate opposing the first substrate. A frit seal interconnects the first and second substrates and surrounds the array of organic light emitting pixels. A film structure interposed between the second substrate and the array of organic light emitting pixels and contacts both the second substrate and the array.