Abstract: An implantable lead having adjustable electrode locations and a system for controlling the same. The implantable lead may include a plurality of first electrodes exposed and formed at an upper part of a main body at given intervals, a plurality of second electrodes coupled to a stepped lower part of the main body and configured to deliver a stimulus signal to a core area into which the lead is inserted, and a plurality of signal lines embedded in the main body and configured to connect the first electrodes and the second electrodes in a one-to-one manner. In this case, a slot for coupling and up and down movement of the second electrodes may be formed in the lower part. As the second electrodes are individually moved along the slot by an external force acting on the signal lines, locations of the second electrodes in the lower part may be adjusted.

Abstract: Provided are a method for administering a recombinant human growth hormone GX-H9 for treating growth hormone deficiency and a pharmaceutical composition containing a recombinant human growth hormone GX-H9 and a pharmaceutically acceptable carrier. The method includes administering recombinant human growth hormone GX-H9 once a week with a dosage of 0.1 to 0.3 mg per weight kg of a patient or twice-monthly with a dosage of 0.1 to 0.4 mg per weight kg of the patient.

Abstract: A semiconductor nanoparticle including a first semiconductor nanocrystal including silver, indium, gallium, and sulfur, and a semiconductor nanoparticle including a second semiconductor nanocrystal including zinc, gallium, and sulfur, a method of manufacturing the same, and an electronic device including the same. The semiconductor nanoparticle is configured to emit a green light. The green light has a peak emission wavelength of about 500 nanometers to about 580 nanometers. In the semiconductor nanoparticle, a molar ratio of zinc to indium is about 0.1:1 to about 10:1.

Abstract: A display device includes light emitting pixels that emit light, photosensors each controlling a sensed current according to an incident light, and a read-out circuit that senses the sensed current of each of the photosensors and converts the sensed current into digital sensed data. In a sensing mode including a first frame period and a second frame period, the light emitting pixels include first sensing pixels that emit the light during the first frame period and second sensing pixels that do not emit the light during the first frame period, the photosensors include first photosensors and second photosensors, and a first distance between any one of the first sensing pixels and a first photosensor adjacent to the first sensing pixel among the first photosensors is greater than a second distance between the first sensing pixel and a second photosensor adjacent to the first sensing pixel among the second photosensors.

Abstract: A hot melt adhesive composition is provided that includes: a diblock copolymer including a styrene-based monomer-derived unit and a conjugated diene-based monomer-derived unit; a triblock copolymer which is a coupled polymer of the diblock copolymer; and a crosslinked block copolymer including a crosslinking agent-derived crosslinked part crosslinked with two or more of the diblock copolymer and the triblock copolymer. The conjugated diene-based monomer-derived unit includes an isoprene-derived unit and an epoxidized isoprene rubber.

Abstract: A method of detecting a heart rate using a photoplethysmography (PPG) signal with a removed motion artifact includes receiving, by a heart rate measurement device, a PPG signal and an acceleration signal; converting, by the heart rate measurement device, the PPG signal and the acceleration signal into signals in a frequency domain; calculating, by the heart rate measurement device, a difference between the PPG signal and the acceleration signal in the frequency domain and obtaining a PPG signal with a removed motion artifact; and estimating, by the heart rate measurement device, a heart rate based on the PPG signal with the removed motion artifact.

Abstract: An apparatus for and a method for estimating blood pressure are provided. The apparatus for estimating blood pressure includes: a sensor configured to measure a pulse wave signal from an object; and a processor configured to obtain a mean arterial pressure (MAP) based on the pulse wave signal, configured to classify a phase of the obtained MAP according to at least one classification criterion, and to obtain a systolic blood pressure (SBP) by using an estimation model corresponding to the classified phase of the MAP among estimation models corresponding to respective phases of the MAP.

Abstract: The present disclosure relates to an isolated anti-FcRN antibody, which is an antibody binding to FcRN (stands for neonatal Fc receptor, also called FcRP, FcRB or Brambell receptor) that is a receptor with a high affinity for IgG or a fragment thereof, a method of preparing thereof, a composition for treating autoimmune disease, which comprises the antibody, and a method of treating and diagnosing autoimmunre diseases using the antibody. The FcRn-specific antibody according to the present disclosure binds to FcRn non-competitively with IgG to reduce serum pathogenic auto-antibody levels, and thus can be used for the treatment of autoimmune diseases.

Abstract: A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

Abstract: The present invention relates to a cured product having excellent stain resistance and low gloss, a method of manufacturing the same, and an interior material including the cured product. The cured product according to the present invention includes, along with an acrylic oligomer, an oligomer having a functional group containing silicon (Si) and an oligomer having a functional group containing fluorine (F), and thus, has excellent stain resistance and can implement a micro-folded structure on a surface thereof through extreme ultraviolet rays to be used during curing, thereby being capable of realizing low gloss without a matting agent.

Abstract: Provided are a composite separator including a coating layer including inorganic particles and a binder formed on a porous substrate, which has improved coatability and improved thermal shrinkage, and a lithium secondary battery using the same.

Abstract: A semiconductor device including a substrate; a lower structure including a sealing layer on the substrate and a support layer on the sealing layer, the sealing layer and the support layer both including a semiconductor material; a mold structure on the lower structure and having an interlayer insulating film and a conductive film alternately stacked therein; a channel hole penetrating the mold structure; a channel structure extending along sidewalls of the channel hole; an isolation trench penetrating the mold structure and extending into the lower structure; and a poly liner extending along sidewalls of the isolation trench, the poly liner being connected to the lower structure and including the semiconductor material.

Abstract: An encapsulation film including an adhesive layer and an oxygen barrier layer on the adhesive layer is provided. The oxygen barrier layer includes binder resin and oxygen collecting particles dispersed in the binder resin. The oxygen collecting particles includes a first metal oxide that includes a crystal structure consisting of first metal sites and oxygen sites, where the crystal structure is in an oxygen deficiency state. A display apparatus including the encapsulation film is disclosed herein.

Abstract: The disclosure discloses anti ?-Syn antibodies preferentially recognizing ?-Syn aggregates. The antibodies of the present invention bind to ?-Syn aggregates with high affinity and specificity and inhibit accumulation or intercellular transfer of ?-Syn aggregates, and thus can be used for detection, diagnosis and/or treatment or prevention of various diseases caused by the accumulation of ?-Syn aggregates.

Abstract: A display apparatus with an integrated touch screen is provided. The display apparatus includes: a light-emitting device layer on a first substrate, a first encapsulation layer on the light-emitting device layer, a touch sensing layer on the light-emitting device layer, and a second encapsulation layer on the touch sensing layer, the second encapsulation layer including at least one inorganic layer.

Abstract: A method of manufacturing a semiconductor memory device includes processing a first substrate including a first align mark and a first structure, processing a second substrate including a second align mark and a second structure, orientating the first substrate and the second substrate such that the first structure and the second structure face each other, and controlling alignment between the first structure and the second structure by using the first align mark and the second align mark to couple the first structure with the second structure.

Abstract: A display panel comprises a first substrate including a display area and a non-display area surrounding the display area, a light emitting diode disposed in the display area on the first substrate, an adhesive layer covering the display area and the non-display area on the first substrate, and a second substrate bonded to the first substrate by the adhesive layer, wherein the second substrate includes a barrier structure portion for defining a plurality of open spaces on one surface of the second substrate that adjoins the adhesive layer.

Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of interlayer insulating layers and a plurality of gate conductive layers, which are stacked in an alternating manner; at least one support structure penetrating the stack structure in a substantially vertical manner, the at least one support structure being formed in a contact region; and a contact plug penetrating the stack structure in a substantially vertical manner, the contact plug being formed in the contact region, the contact plug being connected to a contact pad that is disposed on the bottom of the stack structure. The at least one support structure is formed of an oxide layer.

Abstract: Disclosed are systems and methods for mufti-point destination arrival time analysis. In one aspect, the system may include a memory storing instructions and at least one processor configured to execute the instructions to. The processor performs operations including receiving a request for an order, receiving an acceptance of an order associated with the first external system, determining, upon receiving the acceptance, a first arrival estimate, determining, upon assigning a delivery worker to fulfill the order, a second arrival estimate, and determining, upon receiving confirmation that the delivery worker has retrieved the order from the merchant, a third arrival estimate. Additionally, the operations may include and forwarding, upon their determination, the first, second, and third arrival estimates to the customer.

Abstract: There are provided a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a stack structure including a plurality of interlayer insulating layers and a plurality of gate conductive layers, which are stacked in an alternating manner; at least one support structure penetrating the stack structure in a substantially vertical manner, the at least one support structure being formed in a contact region; and a contact plug penetrating the stack structure in a substantially vertical manner, the contact plug being formed in the contact region, the contact plug being connected to a contact pad that is disposed on the bottom of the stack structure. The at least one support structure is formed of an oxide layer.