Abstract: The present invention addresses the problem that, when applying pressure and heat to laminate substrates, to maintain the flatness of the substrates so as not to have the load concentrated in one part, and to prevent the occurrence of resistance value abnormalities by making the electrically conductive layers between terminal parts uniform over the entire substrate.

Abstract: An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).

Abstract: An issue is directed to suppressing light interference occurring between a plurality of waveguides and providing waveguides at high densities. Means for solving the issue includes a plurality of cores (104) each configured to allow light to be transmitted therethrough, a clad (106) surrounding the plurality of cores (104) and smaller in refractive index for light than each of the cores (104), and a transmission suppression member (108) located between mutually adjacent two cores out of the plurality of cores (104) and configured to suppress transmission of light leaking from each of the cores.

Abstract: In a header plate structure of heat exchangers having a core divided in plurality, a flat tube is inserted into each of the tube insertion holes having a burring, which is formed in a header plate; the flat tube is joined at an inner surface in the vicinity of a top portion of the burring; a burring with height H1 is formed to a long side portion of a dummy tube insertion hole; and a burring with height H2 is formed to a long side portion of an end portion tube insertion hole adjacent to the dummy tube insertion hole, in which height H2 of the burring of the end portion tube insertion hole has been formed higher than the height H1 of the burring of the dummy tube insertion hole.

Abstract: To mitigate thermal stress concentration in the vicinity of a flow-volume limiting portion in a stacked plate heat exchanger to thereby prevent fatigue breaking due to the same. The flow-volume limiting portion is also provided with opening portions that are similar to those in flow paths to reduce rigidity difference from flow path portions.

Abstract: A circuit board includes a plurality of first insulating base materials and a plurality of second insulating base materials that are alternately laminated, a first metal layer being formed into a pattern shape on a first surface of the first insulating base material, and a second metal layer being formed into a pattern shape on a second surface of the first insulating base material. The first metal layer is formed into a trapezoidal shape that is large in diameter on a first surface side of the first insulating base material. The second metal layer is formed into a trapezoidal shape that is large in diameter on a second surface side of the first insulating base material. The first metal layers and the second metal layers are laminated in such a manner that the trapezoidal shapes are alternately oriented.

Abstract: The present invention reduces and mitigates thermal stress generated at joint portions between a header plate and a flat tube of a heat exchanger. In a direction of a vertical center axis passing the center of the inside of a flat tube, positions of first brazing parts are set to be closer to the center of the flat tube in the direction of the vertical center axis than positions of edge brazing parts. Accordingly, the thermal stress concentrated at the joint portions between short sides of the flat tube and the header plate is dispersed to other portions.

Abstract: To mitigate thermal stress concentration in the vicinity of a flow-volume limiting portion in a stacked plate heat exchanger to thereby prevent fatigue breaking due to the same. The flow-volume limiting portion is also provided with opening portions that are similar to those in flow paths to reduce rigidity difference from flow path portions.

Abstract: An issue is directed to suppressing light interference occurring between a plurality of waveguides and providing waveguides at high densities. Means for solving the issue includes a plurality of cores (104) each configured to allow light to be transmitted therethrough, a clad (106) surrounding the plurality of cores (104) and smaller in refractive index for light than each of the cores (104), and a transmission suppression member (108) located between mutually adjacent two cores out of the plurality of cores (104) and configured to suppress transmission of light leaking from each of the cores.

Abstract: A multilayer substrate includes a plurality of plates laminated in a thickness direction of the multilayer substrate, a resin layer provided between the plurality of plates adjacent in the thickness direction, an internal conductive layer provided between the plurality of plates adjacent in the thickness direction, and an external conductive layer provided over an outer surface of each plate of the plurality of plates located at both ends in the thickness direction, wherein a total thickness of the internal conductive layer and the external conductive layer is equal to or less than 25% of a total thickness of the plurality of plates.

Abstract: An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.

Abstract: A structure of a drawn cup-type heat exchanger of improved pressure tightness is provided. A drawn cup-type heat exchanger is configured by stacking in plural number a long and thin tube element containing an inner fin inside a pair of cup plates. The cup plates have a flat containing portion containing the inner fin and a pair of cup portions communicating with both end portions of the containing portion; a circulation hole for communicating fluid into each of tube elements to be stacked is formed in the cup portions; and, to position both end portions in a longitudinal direction of the inner fin to be contained in front of the circulation hole of the cup portions, a corner portion is formed at at least one end portion in a width direction at both extremities in a longitudinal direction of the containing portion.

Abstract: A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.

Abstract: To provide a plate laminate type heat exchanger that is capable to be temporarily fixed easily and surely before brazing assembly and can be fabricated with good accuracy. In a plate laminate type heat exchanger using a cladding material cladded with a brazing material, in each of laminated plates, a round hole penetrating in a laminate direction is formed; a thin and long fixing pin is inserted into the round hole so as to communicate each of plates; the fixing pin is fixed to the round hole by expansion of the outer diameter only at one end part in the longitudinal direction of the fixing pin; and each of plates is temporarily fixed integrally.

Abstract: In a laminated core type heat sink in which a plate is formed by arranging a plurality of slits in parallel to a metal flat plate and by laminating the plate in large numbers, the thickness of a second plate positioned second in the lamination direction from an end lid to which a semiconductor is attached is made greater than thickness of a first plate other than the second plate.

Abstract: Conditions are found for a heat sink having the highest heat exchange performance on the basis of mutual relationship among thickness of each plate, slit pitch, and horizontal rib, in a laminated heat sink core in which numerous parallel slits are punched in a plate, slender vertical ribs are disposed therebetween and the plate is laminated.

Abstract: A packing is held between a tank body and a header plate to secure sealing. Therewith, the width in a longer axis direction of an opening of a flat tube is wider and the width of the tank body is relatively narrow, resulting in a compact tank structure. A number of tooth parts protrude from the tank body at regular intervals, a tube end release part is formed between the tooth parts, and a side edge in a longitudinal axis direction of an opening of the flat tube is positioned therein. The tooth part, a flange part, a seal face of the header plate and a peripheral wall form a packing accommodation part, and a tip edge of the tooth part is seated on an edge of a convex part. The packing is arranged between the packing accommodation part and the seal face.

Abstract: A substrate includes: a glass layer having a first surface, a second surface opposite to the first surface, and a through hole penetrating between the first surface and the second surface; a metal layer provided in a first portion of the through hole, the first portion extending from the first surface and not reaching the second surface; and a conductive layer provided in a second portion of the through hole, coupled to the metal layer, and containing a resin and a conductive filler mixed with the resin, the second portion extending from the second surface and not reaching the first surface.

Abstract: A heat sink made from laminated plates and formed with spaced apart ribs and slits positioned so as to control circulation of refrigerant over the heat sink during cooling of an object by the heat sink.

Abstract: A multilayer substrate includes a plurality of plates laminated in a thickness direction of the multilayer substrate, a resin layer provided between the plurality of plates adjacent in the thickness direction, an internal conductive layer provided between the plurality of plates adjacent in the thickness direction, and an external conductive layer provided over an outer surface of each plate of the plurality of plates located at both ends in the thickness direction, wherein a total thickness of the internal conductive layer and the external conductive layer is equal to or less than 25% of a total thickness of the plurality of plates.