Patents by Inventor Taiji Sakai

Taiji Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220333873
    Abstract: The present invention reduces and mitigates thermal stress generated at joint portions between a header plate and a flat tube of a heat exchanger. In a direction of a vertical center axis passing the center of the inside of a flat tube, positions of first brazing parts are set to be closer to the center of the flat tube in the direction of the vertical center axis than positions of edge brazing parts. Accordingly, the thermal stress concentrated at the joint portions between short sides of the flat tube and the header plate is dispersed to other portions.
    Type: Application
    Filed: September 18, 2020
    Publication date: October 20, 2022
    Inventors: Akira KOMURO, Taiji SAKAI, Atsushi OKUBO
  • Publication number: 20220155020
    Abstract: To mitigate thermal stress concentration in the vicinity of a flow-volume limiting portion in a stacked plate heat exchanger to thereby prevent fatigue breaking due to the same. The flow-volume limiting portion is also provided with opening portions that are similar to those in flow paths to reduce rigidity difference from flow path portions.
    Type: Application
    Filed: December 25, 2019
    Publication date: May 19, 2022
    Inventors: Takuya BUNGO, Atsushi OKUBO, Taiji SAKAI
  • Publication number: 20220066098
    Abstract: An issue is directed to suppressing light interference occurring between a plurality of waveguides and providing waveguides at high densities. Means for solving the issue includes a plurality of cores (104) each configured to allow light to be transmitted therethrough, a clad (106) surrounding the plurality of cores (104) and smaller in refractive index for light than each of the cores (104), and a transmission suppression member (108) located between mutually adjacent two cores out of the plurality of cores (104) and configured to suppress transmission of light leaking from each of the cores.
    Type: Application
    Filed: May 1, 2020
    Publication date: March 3, 2022
    Applicant: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Inventors: Toshiki Iwai, Taiji Sakai
  • Patent number: 11152291
    Abstract: A multilayer substrate includes a plurality of plates laminated in a thickness direction of the multilayer substrate, a resin layer provided between the plurality of plates adjacent in the thickness direction, an internal conductive layer provided between the plurality of plates adjacent in the thickness direction, and an external conductive layer provided over an outer surface of each plate of the plurality of plates located at both ends in the thickness direction, wherein a total thickness of the internal conductive layer and the external conductive layer is equal to or less than 25% of a total thickness of the plurality of plates.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: October 19, 2021
    Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Inventors: Toshiki Iwai, Taiji Sakai
  • Patent number: 11114418
    Abstract: An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 7, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Taiji Sakai, Seiki Sakuyama
  • Patent number: 11105559
    Abstract: A structure of a drawn cup-type heat exchanger of improved pressure tightness is provided. A drawn cup-type heat exchanger is configured by stacking in plural number a long and thin tube element containing an inner fin inside a pair of cup plates. The cup plates have a flat containing portion containing the inner fin and a pair of cup portions communicating with both end portions of the containing portion; a circulation hole for communicating fluid into each of tube elements to be stacked is formed in the cup portions; and, to position both end portions in a longitudinal direction of the inner fin to be contained in front of the circulation hole of the cup portions, a corner portion is formed at at least one end portion in a width direction at both extremities in a longitudinal direction of the containing portion.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: August 31, 2021
    Assignee: T.RAD CO., LTD.
    Inventors: Atsushi Okubo, Taiji Sakai
  • Patent number: 11057996
    Abstract: A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: July 6, 2021
    Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Inventors: Toshiki Iwai, Daisuke Mizutani, Seiki Sakuyama, Taiji Sakai
  • Patent number: 10976110
    Abstract: To provide a plate laminate type heat exchanger that is capable to be temporarily fixed easily and surely before brazing assembly and can be fabricated with good accuracy. In a plate laminate type heat exchanger using a cladding material cladded with a brazing material, in each of laminated plates, a round hole penetrating in a laminate direction is formed; a thin and long fixing pin is inserted into the round hole so as to communicate each of plates; the fixing pin is fixed to the round hole by expansion of the outer diameter only at one end part in the longitudinal direction of the fixing pin; and each of plates is temporarily fixed integrally.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: April 13, 2021
    Assignee: T.Rad Co., Ltd.
    Inventors: Takuya Bungo, Atsushi Okubo, Taiji Sakai
  • Patent number: 10837718
    Abstract: In a laminated core type heat sink in which a plate is formed by arranging a plurality of slits in parallel to a metal flat plate and by laminating the plate in large numbers, the thickness of a second plate positioned second in the lamination direction from an end lid to which a semiconductor is attached is made greater than thickness of a first plate other than the second plate.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: November 17, 2020
    Assignee: T.RAD Co., Ltd.
    Inventors: Takuya Bungo, Atsushi Okubo, Taiji Sakai
  • Patent number: 10739085
    Abstract: Conditions are found for a heat sink having the highest heat exchange performance on the basis of mutual relationship among thickness of each plate, slit pitch, and horizontal rib, in a laminated heat sink core in which numerous parallel slits are punched in a plate, slender vertical ribs are disposed therebetween and the plate is laminated.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 11, 2020
    Assignee: T.RAD Co., Ltd.
    Inventors: Takuya Bungo, Atsushi Okubo, Taiji Sakai
  • Patent number: 10724807
    Abstract: A packing is held between a tank body and a header plate to secure sealing. Therewith, the width in a longer axis direction of an opening of a flat tube is wider and the width of the tank body is relatively narrow, resulting in a compact tank structure. A number of tooth parts protrude from the tank body at regular intervals, a tube end release part is formed between the tooth parts, and a side edge in a longitudinal axis direction of an opening of the flat tube is positioned therein. The tooth part, a flange part, a seal face of the header plate and a peripheral wall form a packing accommodation part, and a tip edge of the tooth part is seated on an edge of a convex part. The packing is arranged between the packing accommodation part and the seal face.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: July 28, 2020
    Assignee: T.RAD Co., Ltd.
    Inventors: Atsushi Okubo, Taiji Sakai, Takuya Bungo
  • Publication number: 20200203266
    Abstract: A substrate includes: a glass layer having a first surface, a second surface opposite to the first surface, and a through hole penetrating between the first surface and the second surface; a metal layer provided in a first portion of the through hole, the first portion extending from the first surface and not reaching the second surface; and a conductive layer provided in a second portion of the through hole, coupled to the metal layer, and containing a resin and a conductive filler mixed with the resin, the second portion extending from the second surface and not reaching the first surface.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 25, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Toshiki Iwai, Taiji Sakai
  • Patent number: 10655922
    Abstract: A heat sink made from laminated plates and formed with spaced apart ribs and slits positioned so as to control circulation of refrigerant over the heat sink during cooling of an object by the heat sink.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: May 19, 2020
    Assignee: T.RAD Co., Ltd.
    Inventors: Takuya Bungo, Atsushi Okubo, Taiji Sakai
  • Publication number: 20200152562
    Abstract: A multilayer substrate includes a plurality of plates laminated in a thickness direction of the multilayer substrate, a resin layer provided between the plurality of plates adjacent in the thickness direction, an internal conductive layer provided between the plurality of plates adjacent in the thickness direction, and an external conductive layer provided over an outer surface of each plate of the plurality of plates located at both ends in the thickness direction, wherein a total thickness of the internal conductive layer and the external conductive layer is equal to or less than 25% of a total thickness of the plurality of plates.
    Type: Application
    Filed: October 24, 2019
    Publication date: May 14, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Toshiki Iwai, Taiji Sakai
  • Publication number: 20200154566
    Abstract: A wiring substrate includes: a first plate member including a first surface and a second surface opposite to the first surface; a first through wiring configured to extend in a tubular shape from the first surface to the second surface along an inner peripheral surface of a first through hole; a conductive member provided at an end of the first through wiring on a first surface side of the first plate member; a second plate member including a third surface and a fourth surface opposite to the third surface, the fourth surface facing the first surface of the first plate member; and a second through wiring configured to extend from the third surface to the fourth surface along an inner peripheral surface of a second through hole and be in contact with the conductive member.
    Type: Application
    Filed: October 25, 2019
    Publication date: May 14, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Toshiki IWAI, Taiji SAKAI
  • Publication number: 20200033065
    Abstract: A structure of a drawn cup-type heat exchanger of improved pressure tightness is provided. A drawn cup-type heat exchanger is configured by stacking in plural number a long and thin tube element containing an inner fin inside a pair of cup plates. The cup plates have a flat containing portion containing the inner fin and a pair of cup portions communicating with both end portions of the containing portion; a circulation hole for communicating fluid into each of tube elements to be stacked is formed in the cup portions; and, to position both end portions in a longitudinal direction of the inner fin to be contained in front of the circulation hole of the cup portions, a corner portion is formed at at least one end portion in a width direction at both extremities in a longitudinal direction of the containing portion.
    Type: Application
    Filed: February 28, 2018
    Publication date: January 30, 2020
    Inventors: Atsushi OKUBO, Taiji SAKAI
  • Publication number: 20190289715
    Abstract: A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.
    Type: Application
    Filed: June 4, 2019
    Publication date: September 19, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Toshiki Iwai, Daisuke Mizutani, Seiki Sakuyama, Taiji Sakai
  • Publication number: 20190249934
    Abstract: Conditions are found for a heat sink having the highest heat exchange performance on the basis of mutual relationship among thickness of each plate, slit pitch, and horizontal rib, in a laminated heat sink core in which numerous parallel slits are punched in a plate, slender vertical ribs are disposed therebetween and the plate is laminated.
    Type: Application
    Filed: July 5, 2017
    Publication date: August 15, 2019
    Inventors: Takuya BUNGO, Atsushi OKUBO, Taiji SAKAI
  • Publication number: 20190254164
    Abstract: A circuit board includes a first substrate of a fragile material, a first through-hole formed in the first substrate for allowing a screw for fixing the first substrate to a supporting body to be inserted through the first through-hole, a first step formed at an outer edge of a first region surrounding the first through-hole in the first substrate, and a second step formed along a direction from the first through-hole to the first step in the first region of the first substrate.
    Type: Application
    Filed: January 18, 2019
    Publication date: August 15, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Toshiki Iwai, Taiji Sakai
  • Publication number: 20190252357
    Abstract: An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Taiki Uemura, Taiji Sakai, Seiki Sakuyama