Abstract: A wiring substrate includes: a first plate member including a first surface and a second surface opposite to the first surface; a first through wiring configured to extend in a tubular shape from the first surface to the second surface along an inner peripheral surface of a first through hole; a conductive member provided at an end of the first through wiring on a first surface side of the first plate member; a second plate member including a third surface and a fourth surface opposite to the third surface, the fourth surface facing the first surface of the first plate member; and a second through wiring configured to extend from the third surface to the fourth surface along an inner peripheral surface of a second through hole and be in contact with the conductive member.

Abstract: A structure of a drawn cup-type heat exchanger of improved pressure tightness is provided. A drawn cup-type heat exchanger is configured by stacking in plural number a long and thin tube element containing an inner fin inside a pair of cup plates. The cup plates have a flat containing portion containing the inner fin and a pair of cup portions communicating with both end portions of the containing portion; a circulation hole for communicating fluid into each of tube elements to be stacked is formed in the cup portions; and, to position both end portions in a longitudinal direction of the inner fin to be contained in front of the circulation hole of the cup portions, a corner portion is formed at at least one end portion in a width direction at both extremities in a longitudinal direction of the containing portion.

Abstract: A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.

Abstract: An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.

Abstract: Conditions are found for a heat sink having the highest heat exchange performance on the basis of mutual relationship among thickness of each plate, slit pitch, and horizontal rib, in a laminated heat sink core in which numerous parallel slits are punched in a plate, slender vertical ribs are disposed therebetween and the plate is laminated.

Abstract: A circuit board includes a first substrate of a fragile material, a first through-hole formed in the first substrate for allowing a screw for fixing the first substrate to a supporting body to be inserted through the first through-hole, a first step formed at an outer edge of a first region surrounding the first through-hole in the first substrate, and a second step formed along a direction from the first through-hole to the first step in the first region of the first substrate.

Abstract: An electronic apparatus includes a first circuit board, a stacked circuit that is provided on the first circuit board through first coupling terminals and has a structure in which arithmetic elements and memory elements are stacked through inter-element coupling terminals and to which a signal is inputted from the first circuit board, and a second circuit board that is provided on the stacked circuit through second coupling terminals and to which a result of processing is outputted from the stacked circuit, wherein a number of the first coupling terminals and a number of the second coupling terminals are smaller than that of the inter-element coupling terminals.

Abstract: An electronic device includes: a polymer film that is to melt at a predetermined temperature higher than a body temperature; at least one electronic component provided in the polymer film; and a first hydrophobic film provided on an opposite surface of the polymer film to a side of the polymer film to be attached to skin.

Abstract: A corrugated fin heat exchanger is provided in which the direction in which louvers are cut and raised is inclined in one direction only, and in which heat transfer performance is improved above that of conventional fins. To accomplish this, the relationship H>Qup/(Qup?1)×?H is satisfied. H represents the core height of the heat exchanger, Qup represents the ratio of the amount of heat exchanged per corrugation between one-directional louver fins and multi-directional louver fins in an airflow part, and ?H represents the amount of increase in a heat transfer reduction region of a heat exchanger core as a result of changing from multi-directional louver fins to one-directional louver fins.

Abstract: An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.

Abstract: In order to prevent deformation of a side member due to thermal stress in a heat exchanger in which water for cooling a high-temperature body circulates, a side member is formed in the shape of a groove, the cross section of which has side wall parts and a base part along the entire length in the lengthwise direction of a main body part, and both ends of the side member in the lengthwise direction are provided with a stepped part, which is formed as a step toward the outside of a core, and one or more brace-like ribs, which integrally connect the tip end and the base part of the stepped part in a slanting manner.

Abstract: To provide a plate laminate type heat exchanger that is capable to be temporarily fixed easily and surely before brazing assembly and can be fabricated with good accuracy. In a plate laminate type heat exchanger using a cladding material cladded with a brazing material, in each of laminated plates, a round hole penetrating in a laminate direction is formed; a thin and long fixing pin is inserted into the round hole so as to communicate each of plates; the fixing pin is fixed to the round hole by expansion of the outer diameter only at one end part in the longitudinal direction of the fixing pin; and each of plates is temporarily fixed integrally.

Abstract: A stacked plate heat exchanger having a structure that can be temporarily fixed by a simple structure in brazing, without using additional expensive parts includes a top plate, a bottom plate and a plurality of inner plates, wherein an upwardly bent tab part is formed on at least one of the plates, a cutout part is formed in plates other than the plate on which the tab part is formed, and each plate is stacked and fixed to one another with the tab part and the cutout part in a fitted state.

Abstract: A packing is held between a tank body and a header plate to secure sealing. Therewith, the width in a longer axis direction of an opening of a flat tube is wider and the width of the tank body is relatively narrow, resulting in a compact tank structure. A number of tooth parts protrude from the tank body at regular intervals, a tube end release part is formed between the tooth parts, and a side edge in a longitudinal axis direction of an opening of the flat tube is positioned therein. The tooth part, a flange part, a seal face of the header plate and a peripheral wall form a packing accommodation part, and a tip edge of the tooth part is seated on an edge of a convex part. The packing is arranged between the packing accommodation part and the seal face.

Abstract: To further improve heat exchange performance in a laminated core type heat sink in which a plate is formed by arranging a plurality of slits in parallel to a metal flat plate and laminating the plate in large numbers. Thickness T2 of a second plate 4b positioned on the second in the lamination direction from an end lid 9 to which a semiconductor is attached is made greater than thickness T1 of a first plate 4a other than the second plate 4b.

Abstract: An electronic apparatus includes a first circuit board, a stacked circuit that is provided on the first circuit board through first coupling terminals and has a structure in which arithmetic elements and memory elements are stacked through inter-element coupling terminals and to which a signal is inputted from the first circuit board, and a second circuit board that is provided on the stacked circuit through second coupling terminals and to which a result of processing is outputted from the stacked circuit, wherein a number of the first coupling terminals and a number of the second coupling terminals are smaller than that of the inter-element coupling terminals.

Abstract: To accelerate heat exchange in a heat sink formed by laminating plates a circulation blocking means for a refrigerant is provided so that refrigerant circulation resistance in a fin part of a plate at a position sufficiently apart in a lamination direction from an object to be cooled is greater than circulation resistance in each plate lying close to the object to be cooled.

Abstract: In order to improve sealing performance when the open end of a tank is swaged and thereby secured inside an annular groove the surface of which is formed in a substantially rectangular shape with a seal material between the groove an the tank, flange parts protrude in a fan shape at the four corners of the seal material, and those flange parts are pressed by the corner sections of the annular groove, thereby preventing the seal material from moving in the corner sections.

Abstract: Corrugated fins that have high heat transfer performance and do not cause clogging even in a gaseous environment in which particulate matter such as dust is present have wall surfaces on which are formed alternating parallel ridges and furrows with an angle of inclination of 10-60°. Defining Wh as the height of the ridges and furrows, Wp as the period of the ridges and furrows, Pf as the period of the corrugated fins, and Tf as the thickness of the plate forming the fins, the following conditions hold. Wh?0.3674·Wp+1.893·Tf?0.1584, 0.088<(Wh?Tf)/Pf<0.342, and a·Wp2+b·Wp+c<Wh, where a=0.004·Pf2?0.0696·Pf+0.3642 b=?0.0036·Pf2+0.0625·Pf?0.5752, and c=0.0007·Pf2+0.1041·Pf+0.2333.

Abstract: According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.