Patents by Inventor Taiqing Qiu

Taiqing Qiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot wall rapid thermal processor
    Patent number: 6462310
    Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is. configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: October 8, 2002
    Assignee: ASML US, INC
    Inventors: Christopher T. Ratliff, Jeffrey M. Kowalski, Taiqing Qiu
  • Hot wall rapid thermal processor
    Publication number: 20020011478
    Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
    Type: Application
    Filed: August 21, 2001
    Publication date: January 31, 2002
    Applicant: Silicon Valley Group, Inc.
    Inventors: Christopher Ratliff, Taiqing Qiu, Jeff Kowalski, Morteza Yadollahi, Saeed Sedehi
  • Hot wall rapid thermal processor
    Patent number: 6300600
    Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: October 9, 2001
    Assignee: Silicon Valley Group, Inc.
    Inventors: Christopher Ratliff, Taiqing Qiu, Jeff Kowalski, Morteza Yadollahi, Saeed Sedehi