Abstract: Provided is a light detection device capable of accurately measuring a signal voltage from a diode that detects light. A light detection device according to the present disclosure includes: first diodes that receive light and output a signal voltage; a digital-to-analog converter that outputs a reference voltage in synchronization with a clock signal; a comparison circuit that compares the signal voltage with the reference voltage; a trigger circuit that outputs a trigger signal in response to the signal voltage; a flip-flop that takes an output signal from the comparison circuit in response to the trigger signal; and a first counter that outputs a digital value that changes in accordance with an average voltage at feature points of the signal voltage by counting a value of an output signal from the flip-flop in synchronization with the clock signal.

Abstract: A calculator system connected to a public network efficiently avoids congestion. The calculator system is connected to a network including a network switch, includes a plurality of calculators, and recovers, when a data packet is lost on the network, a transfer operation of the lost data packet by a retransmission operation. The calculator system includes the calculators; software running on the calculators; timing adjusting mechanism present between the calculators and the network. The timing adjusting mechanism is configured to calculate a delay time for delaying transmission of a data packet transmitted from the software based on characteristics of the data packet, and delay the transmission of the data packet by the calculated delay time.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: A magnetic head suspension assembly includes a support plate coupled to a magnetic head, and a flexible wiring member disposed on the support plate. The flexible wiring member includes a metal plate fixed to the support plate, an insulating layer disposed on the metal plate, a conductive layer disposed on the insulating layer and forming a plurality of conductive lines and connection terminals, and a cover layer on the conductive layer. The connection end portion includes a plurality of the connection terminals, and each of the connection terminals includes a center hole, a first terminal surface that is a surface of the conductive layer and is covered with the cover layer so that the first terminal surface is not exposed during a solder-joining process performed on the connection terminals, and a second terminal surface that is a surface of the conductive layer and faces away from the first terminal surface.

Abstract: A magnetic head suspension assembly includes a support plate coupled to a magnetic head, and a flexible wiring member disposed on the support plate. The flexible wiring member includes a metal plate fixed to the support plate, an insulating layer disposed on the metal plate, a conductive layer disposed on the insulating layer and forming a plurality of conductive lines and connection terminals, and a cover layer on the conductive layer. The connection end portion includes a plurality of the connection terminals, and each of the connection terminals includes a center hole, a first terminal surface that is a surface of the conductive layer and is covered with the cover layer so that the first terminal surface is not exposed during a solder-joining process performed on the connection terminals, and a second terminal surface that is a surface of the conductive layer and faces away from the first terminal surface.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes.

Abstract: A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes.

Abstract: According to one embodiment, a suspension assembly includes a support plate including a distal end portion, a trace member attached to the support plate, an elastic supporting member made from a distal end portion of the trace member and configured to support a head, and an actuation element expandable/contractible in the longitudinal direction of the trace member, at least a part of a bottom of which is adhered to a seating surface formed from a cover insulating layer of the trace member.