Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: A head gimbal assembly includes a base plate, a load beam, a first end of which is supported by the base plate, a magnetic head supported at a second end of the load beam, a flexure including a plurality of wirings electrically connected to the magnetic head, the flexure extending from a surface of the base plate to an edge of the base plate, an adhesive applied in a space formed between the surface of the base plate and a surface of the flexure facing the surface of the base plate to bond the flexure to the base plate and to the edge of the base plate.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: A head gimbal assembly includes a base plate, a load beam, a first end of which is supported by the base plate, a magnetic head supported at a second end of the load beam, a flexure including a plurality of wirings electrically connected to the magnetic head, the flexure extending from a surface of the base plate to an edge of the base plate, an adhesive applied in a space formed between the surface of the base plate and a surface of the flexure facing the surface of the base plate to bond the flexure to the base plate and to the edge of the base plate.

Abstract: A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: According to one embodiment, a head gimbal assembly includes a suspension, a head, and a conductor trace on the suspension, including one end portion electrically connected to the head and the other end portion includes a terminal area. The conductor trace includes a thin metal plate, a base insulating layer on the thin metal plate, a trace pattern on the base insulating layer, including a plurality of conductors and a plurality of first and second connection terminals continuous with the conductors, and a cover insulating layer on the base insulating layer, configured to cover the trace pattern. The terminal area includes an opening including two opposite side edges, the first connection terminals extend into the opening from one of the side edges thereof, and the second connection terminals extend into the opening from the other side edge thereof.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: According to one embodiment, a head gimbal assembly includes a load beam, a metal plate mounted on the load beam and constituting a gimbal includes a limiter portion, a flexure includes a plurality of conductors formed over the metal plate with an insulating layer therebetween, a slider includes a head and mounted on the gimbal, and a positioning reference mark formed on the limiter portion by parts of the conductors and configured to position the slider. The plurality of conductors includes conductors which conduct to the positioning reference mark through the metal plate and constitute an interleaved structure.

Abstract: According to one embodiment, a head gimbal assembly includes a suspension, a head, and a conductor trace on the suspension, including one end portion electrically connected to the head and the other end portion includes a terminal area. The conductor trace includes a thin metal plate, a base insulating layer on the thin metal plate, a trace pattern on the base insulating layer, including a plurality of conductors and a plurality of first and second connection terminals continuous with the conductors, and a cover insulating layer on the base insulating layer, configured to cover the trace pattern. The terminal area includes an opening including two opposite side edges, the first connection terminals extend into the opening from one of the side edges thereof, and the second connection terminals extend into the opening from the other side edge thereof.

Abstract: According to one embodiment, a head gimbal assembly includes a load beam, a metal plate mounted on the load beam and constituting a gimbal includes a limiter portion, a flexure includes a plurality of conductors formed over the metal plate with an insulating layer therebetween, a slider includes a head and mounted on the gimbal, and a positioning reference mark formed on the limiter portion by parts of the conductors and configured to position the slider. The plurality of conductors includes conductors which conduct to the positioning reference mark through the metal plate and constitute an interleaved structure.

Abstract: According to one embodiment, a head gimbal assembly of a disk drive includes an arm and a suspension extending from the arm, a head supported by the suspension, and a flexure on the arm and the suspension. One end portion of the flexure is electrically connected to the head, and the other end portion thereof includes a terminal area. The flexure includes a base insulating layer, a conductor pattern formed on the base insulating layer and having a plurality of connection terminals, and a cover insulating layer formed on the base insulating layer so as to cover the conductor pattern. The connection terminals are exposed to the inside of an opening in the base and cover insulating layers with a protective insulating layer and a thin metal plate overlaid on one surface of each of the connection terminals.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: A semiconductor wafer comprising: a tubular trench formed at a position to form a through-hole electrode of a wafer; an insulating member buried inside the trench and on an upper surface of the trench; a gate electrode film and a metal film formed on an upper surface of the insulating member; a multilevel columnar wiring via formed on an upper surface of the metal film; and an external connection electrode formed electrically connected to the metal film via the multilevel columnar wiring via. In this manner, it is unnecessary to have a new process of dry etching to form a through-hole electrode after thinning the wafer and equipment development. Moreover, introduction of a specific design enables formation of through-hole electrodes with significantly reduced difficulties of respective processes.

Abstract: A semiconductor wafer comprising: a tubular trench formed at a position to form a through-hole electrode of a wafer; an insulating member buried inside the trench and on an upper surface of the trench; a gate electrode film and a metal film formed on an upper surface of the insulating member; a multilevel columnar wiring via formed on an upper surface of the metal film; and an external connection electrode formed electrically connected to the metal film via the multilevel columnar wiring via. In this manner, it is unnecessary to have a new process of dry etching to form a through-hole electrode after thinning the wafer and equipment development. Moreover, introduction of a specific design enables formation of through-hole electrodes with significantly reduced difficulties of respective processes.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: According to one embodiment, a head gimbal assembly of a disk drive includes an arm and a suspension extending from the arm, a head supported by the suspension, and a flexure on the arm and the suspension. One end portion of the flexure is electrically connected to the head, and the other end portion thereof includes a terminal area. The flexure includes a base insulating layer, a conductor pattern formed on the base insulating layer and having a plurality of connection terminals, and a cover insulating layer formed on the base insulating layer so as to cover the conductor pattern. The connection terminals are exposed to the inside of an opening in the base and cover insulating layers with a protective insulating layer and a thin metal plate overlaid on one surface of each of the connection terminals.

Abstract: A semiconductor wafer comprising: a tubular trench formed at a position to form a through-hole electrode of a wafer; an insulating member buried inside the trench and on an upper surface of the trench; a gate electrode film and a metal film formed on an upper surface of the insulating member; a multilevel columnar wiring via formed on an upper surface of the metal film; and an external connection electrode formed electrically connected to the metal film via the multilevel columnar wiring via. In this manner, it is unnecessary to have a new process of dry etching to form a through-hole electrode after thinning the wafer and equipment development. Moreover, introduction of a specific design enables formation of through-hole electrodes with significantly reduced difficulties of respective processes.