Abstract: A NAND-structured flash memory comprises a memory cell array wherein plural memory strings are arranged in matrix form, each of the memory cell strings including plural nonvolatile memory cells, the first conducting paths of the memory cells being connected in series, at least one of the memory cells having a function other than an external data storing function, plural first selection transistors having second conducting paths, and one end of the second conducting paths being connected to one end of the series of the first conducting paths, respectively, plural bit lines connected to the other end of the second conducting paths, plural second selection transistors having third conducting paths, and one end of the third conducting paths being connected to one end of the series of the first conducting paths, respectively, and a source line connected to the other end of the third conducting paths.

Abstract: A nonvolatile semiconductor memory according to the present invention includes memory cell units, which include data select lines formed in parallel to each other, data transfer lines crossing the data select lines and aligned in parallel to each other, and electrically rewritable memory cell transistors disposed at intersections of the data transfer lines and the data select lines. It further includes: a memory cell array block in which the memory cell units are disposed along the data select lines; first source lines, connected to one end of the memory cell units, and aligned along the data select lines; and second source lines electrically connected to the first source lines, and disposed along the data select lines.

Abstract: A non-volatile semiconductor memory device includes a cell array in which electrically rewritable and non-volatile memory cells are arranged, and a sense amplifier circuit configured to read and write data in association with the cell array, wherein the sense amplifier circuit includes: differential amplifier having first and second input nodes and configured to amplify a difference voltage between the first and second input nodes; a data transfer circuit configured to selectively connect the first input node to a bit line in the cell array; a reference voltage setting circuit configured to apply a reference voltage to the second input node of the differential amplifier; and a data storing circuit configured to temporarily hold a loaded write data at the first input node of the differential amplifier, and control the reference voltage at the second input node of the differential amplifier in correspondence with the write data held therein.

Abstract: A semiconductor integrated circuit is composed of a memory array, sense amplifiers, a first and second drive circuits, and a sense amplifier control circuit. The memory cell array has memory cells arranged in matrix form. The sense amplifiers amplify a signal read from the memory cells. The sense amplifiers include N channel sense amplifiers each composed of an N channel MOS transistor and P channel sense amplifiers each composed of a P channel MOS transistor. The first and second drive circuits each include an N channel MOS transistor that drives the N channel sense amplifiers or the P channel sense amplifiers, respectively. The first and second drive circuits are arranged adjacent to the sense amplifiers. The sense amplifier control circuit supplies a common control signal to both gate electrodes of the N channel MOS transistors included in the first and second drive circuits.

Abstract: A novel CC chemokine which is from a mammal, reagents related thereto including purified proteins, specific antibodies, and nucleic acids encoding said chemokine. A chemokine receptor is also provided. Methods of using said reagents and diagnostic kits are also provided.

Abstract: A semiconductor integrated circuit includes a control data storage circuit (6) having nonvolatile storage devices with programmed control data and a latch circuit for holding data read out from the storage devices, and a read control circuit (7) for controlling read operations of the control data, which are built in a semiconductor chip. The control data storage circuit (6) is divided into groups (1, 2), and the read control circuit (7) generates read control signals for the groups (1, 2) at different timings, using an output of an internal potential detecting circuit 41 as the timing reference, thereby preventing the peak of power consumption from unacceptably rising during reading operations.

Abstract: A novel CC chemokine which is from a mammal, reagents related thereto including purified proteins, specific antibodies, and nucleic acids encoding said chemokine. A chemokine receptor is also provided. Methods of using said reagents and diagnostic kits are also provided.

Abstract: A semiconductor memory device is provided which ensures the symmetry of memory data transmission time and a high-speed operation and has large write/read operation margin with no need of increasing the chip area. By placing a horizontally long peripheral circuit section in the middle in the vertical direction of a semiconductor chip, placing a vertically long shift register section above and below and perpendicularly to the peripheral circuit section, and making the memory core and shift register arrangement symmetrical in the horizontal direction, the data/signal lines between the memory core and the shift register section can be made short and the symmetry of the interconnections can be maintained, which allows the implementation of a high-speed and large-margin semiconductor memory device.

Abstract: A DRAM, including a plurality of banks each having a plurality of sub-arrays, and sense amplifier circuits commonly shared by sub-arrays in different banks, has a row access mode for activating a sub-array selected from each bank for reading or writing data, and a refresh mode for activating a plurality of sub-arrays in each bank and refreshing memory cell data therein at substantially the same timing. Sub-arrays in each bank activated at substantially the same timing in the refresh mode are more than sub-arrays in each bank activated in the row access model. Thereby, occurrence of operation constrains is minimized to ensure high-speed operation and improve the system performance of DRAMs employing the non-independent bank system.

Abstract: A semiconductor memory circuit capable of conducting an efficient test by using a memory tester is provided. A semiconductor memory circuit includes a memory cell array; a plurality of main data lines for conducting reading and writing every plural bits in parallel; and a shift register for converting parallel data read from memory cell array to the main data lines into serial data and supplying the converted data to data input/output terminals, and for converting write data supplied from the data input/output terminals in series into parallel data and supplying the converted data to the main data lines, and at least a portion of a plurality of the main data lines are arranged so as to be across each other between the memory cell array and the shift register. As a result, data compression is enabled during a test by a memory tester.

Abstract: A DRAM, including a plurality of banks each having a plurality of sub-arrays, and sense amplifier circuits commonly shared by sub-arrays in different banks, has a row access mode for activating a sub-array selected from each bank for reading or writing data, and a refresh mode for activating a plurality of sub-arrays in each bank and refreshing memory cell data therein at substantially the same timing. Sub-arrays in each bank activated at substantially the same timing in the refresh mode are more than sub-arrays in each bank activated in the row access model. Thereby, occurrence of operation constrains is minimized to ensure high-speed operation and improve the system performance of DRAMs employing the non-independent bank system.

Abstract: A semiconductor integrated circuit includes a control data storage circuit (6) having nonvolatile storage devices with programmed control data and a latch circuit for holding data read out from the storage devices, and a read control circuit (7) for controlling read operations of the control data, which are built in a semiconductor chip. The control data storage circuit (6) is divided into groups (1, 2), and the read control circuit (7) generates read control signals for the groups (1, 2) at different timings, using an output o an internal potential detecting circuit 41 as the timing reference, thereby preventing the peak of power consumption from unacceptably rising during reading operations.

Abstract: A semiconductor memory circuit capable of conducting an efficient test by using a memory tester is provided.

Abstract: A DRAM, including a plurality of banks each having a plurality of sub-arrays, and sense amplifier circuits commonly shared by sub-arrays in different banks, has a row access mode for activating a sub-array selected from each bank for reading or writing data, and a refresh mode for activating a plurality of sub-arrays in each bank and refreshing memory cell data therein at substantially the same timing. Sub-arrays in each bank activated at substantially the same timing in the refresh mode are more than sub-arrays in each bank activated in the row access model. Thereby, occurrence of operation constrains is minimized to ensure high-speed operation and improve the system performance of DRAMs employing the non-independent bank system.

Abstract: A semiconductor memory device capable of relieving a defect after assembly has a memory cell array; a plurality of redundant elements for relieving a defective memory cell of the memory element; decoders for decoding an address to select a memory cell of the memory cell array; first address comparator circuits capable of carrying out a programming in a wafer state, for outputting a substitute signal for selecting one of the plurality of redundant elements with respect to a defective address detected in the wafer state; and second address comparator circuits capable of carrying out a programming after assembly, for outputting a substitute signal for selecting another of the plurality of redundant elements with respect to a defective address detected after a chip is assembled.

Abstract: A semiconductor memory device is provided which ensures the symmetry of memory data transmission time and a high-speed operation and has large write/read operation margin with no need of increasing the chip area. By placing a horizontally long peripheral circuit section in the middle in the vertical direction of a semiconductor chip, placing a vertically long shift register section above and below and perpendicularly to the peripheral circuit section, and making the memory core and shift register arrangement symmetrical in the horizontal direction, the data/signal lines between the memory core and the shift register section can be made short and the symmetry of the interconnections can be maintained, which allows the implementation of a high-speed and large-margin semiconductor memory device.

Abstract: A semiconductor memory device is provided which ensures the symmetry of memory data transmission time and a high-speed operation and has large write/read operation margin with no need of increasing the chip area. By placing a horizontally long peripheral circuit section in the middle in the vertical direction of a semiconductor chip, placing a vertically long shift register section above and below and perpendicularly to the peripheral circuit section, and making the memory core and shift register arrangement symmetrical in the horizontal direction, the data/signal lines between the memory core and the shift register section can be made short and the symmetry of the interconnections can be maintained, which allows the implementation of a high-speed and large-margin semiconductor memory device.

Abstract: According to the preferred embodiment of the present invention, an ATD pulse generating mechanism is provided that overcomes the limitations of the prior art by compensating for process and power supply voltage variations that would normally effect the pulse width. In particular, the delays used to create the pulse width are adjusted to compensate for the effects of process and environmental variations, thereby providing a pulse width that is relatively constant over these variations.

Abstract: In a CMOS-DRAM, an n-type silicon substrate has a p-type well formed therein, and a DRAM cell array is formed in the p-type well. In a period immediately after an external power supply is turned on, the p-type well is in a substantially floated condition. A predetermined time after the external power supply is turned on, the p-type well is applied with a predetermined DC voltage generated by a well voltage generating circuit. The CMOS-DRAM has a selective grounding circuit. When the external power supply is turned on, the selective grounding circuit forcibly grounds the plate electrode of the DRAM cell array for a predetermined period of time. Therefore, an increase in the well voltage at the cell array region, which increase may occur due to the capacitive coupling, is prevented when the power supply is turned on. Accordingly, adverse effects arising from the increase in the well voltage are prevented.

Abstract: In a MOS-type charging circuit in a semiconductor chip using a supply voltage-lowering circuit, a driver MOS transistor is connected not to an output of the supply voltage-lowering circuit but directly to an external power supply. A comparison is made between the voltage at the terminal of the driver MOS transistor connected to a large-capacity capacity load and an output of the supply voltage-lowering circuit, i.e., an internal supply voltage of the chip. On the basis of the result of comparison, the gate potential of the driver MOS transistor is controlled, and the large-capacity load is charged to the level of the internal supply voltage of the chip. Hence, only one driver transistor can be used as conventionally required two driver transistors connecting the external power supply and the large-capacity load, so that the chip area can be reduced.