Patents by Inventor Takahiro Daikoku

Takahiro Daikoku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5774334
    Abstract: Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: June 30, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Keizo Kawamura, Noriyuki Ashiwake, Takahiro Daikoku, Akio Idei, Kenichi Kasai, Hideyuki Kimura, Atsuo Nishihara, Toshio Hatada, Shigeyuki Sasaki
  • Patent number: 5751062
    Abstract: A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
    Type: Grant
    Filed: December 13, 1995
    Date of Patent: May 12, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Fumiyuki Kobayashi, Noriyuki Ashiwake, Kenichi Kasai, Keizou Kawamura, Akio Idei
  • Patent number: 5705854
    Abstract: A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: January 6, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Takayuki Atarashi, Tetsuya Tanaka, Takahiro Daikoku
  • Patent number: 5705850
    Abstract: The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
    Type: Grant
    Filed: August 15, 1994
    Date of Patent: January 6, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Ashiwake, Takahiro Daikoku, Kenichi Kasai, Keizou Kawamura, Hideyuki Kimura, Atsuo Nishihara, Toshio Hatada, Toshiki Iino
  • Patent number: 5689572
    Abstract: In an active noise-reduction controlling apparatus, there are provided a reference sensor for outputting a reference signal corresponding to information about a noise source, a noise-reduction error sensor for detecting a noise-reduction condition, an adding acoustic wave source controlled to produce an acoustic wave having the same amplitude as that of an acoustic wave received at the noise-reduction error sensor and having a phase opposite to that of the acoustic wave received as the noise-reduction error sensor; a first adaptive digital filter for processing the reference signal to output a control signal of the adding acoustic wave source, a second adaptive digital filter for setting a predicted value of a transfer function between an input signal of the adding acoustic wave source and an output signal of said noise-reduction error sensor, a filter coefficient controlling unit for optimizing a coefficient of the first adaptive digital filter with employment of the predicted value of the transfer function
    Type: Grant
    Filed: December 8, 1994
    Date of Patent: November 18, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Katsuo Ohki, Shinichi Shimode, Yukiji Iwase, Osamu Sekiguchi, Masanori Watanabe, Takahiro Daikoku, Tamotsu Tsukaguchi, Shigeru Koizumi
  • Patent number: 5595240
    Abstract: A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: January 21, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Noriyuki Ashiwake, Nobuo Kawasaki, Shizuo Zushi
  • Patent number: 5592363
    Abstract: An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: January 7, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Takayuki Atarashi, Toshio Hatada, Takahiro Daikoku, Nobuo Kawasaki, Toshiki Iino, Tamotsu Tsukaguchi, Kenichi Kasai, Fumiyuki Kobayashi, Yoshito Hayashi
  • Patent number: 5558493
    Abstract: A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: September 24, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Yutaka Hayashi, Mitsuo Miyamoto, Michihito Watarai, Takayuki Atarashi, Tetsuya Tanaka, Toshio Hatada, Yoshihiro Takada, Takahiro Daikoku
  • Patent number: 5515912
    Abstract: A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.
    Type: Grant
    Filed: March 4, 1991
    Date of Patent: May 14, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Noriyuki Ashiwake, Nobuo Kawasaki, Shizuo Zushi
  • Patent number: 5504651
    Abstract: An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.
    Type: Grant
    Filed: March 30, 1994
    Date of Patent: April 2, 1996
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Takayuki Atarashi, Toshio Hatada, Tetsuya Tanaka, Toshiki Iino, Kenichi Kasai, Takahiro Daikoku, Tamotsu Tsukaguchi
  • Patent number: 5365400
    Abstract: Disclosed are heat sinks particularly effective in cooling semiconductors of a high heat dissipating density and including a multiplicity of tabular fins laminated via spacers and having through-holes pierced in their central parts, the holes admitting introduction of cooling fluids which radially flow in between the fins. The cooling fluids are supplied to the respective heat sinks attached to the multiplicity of semiconductors mounted on a board. In a specific form of the invention, the semiconductor cooling device has a heat sink provided with parallel tabular internal fins and a cooling fluid nozzle having an elongated opening substantially orthogonal to the fins, the nozzle being disposed to span over the parallel tabular fins substantially at longitudinal mid portions of these fins, so that the cooling fluid is evenly distributed from the mid portions of the fins to both longitudinal ends of the fins.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: November 15, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Ashiwake, Takahiro Daikoku, Toshio Hatsuda, Shizuo Zushi, Satomi Kobayashi
  • Patent number: 5349831
    Abstract: An apparatus for cooling heat generating members such as semiconductor devices on a multichip module. A discharge device discharges cooling liquid for contacting the heat generating members and cooling them. A mixing device mixes the now high temperature cooling liquid, which has cooled the heat generating members, with another portion of the aforesaid cooling liquid still at a lower temperature. As a result, the temperature of the high temperature cooling liquid, which has been heated because it had cooled the heat generating members, can be lowered because the high temperature cooling liquid is mixed with the low temperature cooling liquid. Furthermore, a cooling liquid discharge device is provided for each heat generating member and a mixing device is located between the cooling liquid discharge devices or between heat generating members. In addition, the mixing device has a guide member for guiding the flow.
    Type: Grant
    Filed: November 6, 1992
    Date of Patent: September 27, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Hiroshi Inouye
  • Patent number: 5345107
    Abstract: The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
    Type: Grant
    Filed: February 20, 1992
    Date of Patent: September 6, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Nobuo Kawasaki, Noriyuki Ashiwake, Keizou Kawamura, Shizuo Zushi, Mitsuo Miyamoto, Atsushi Morihara
  • Patent number: 5276586
    Abstract: A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of semiconductor chips, respectively, and a cooling jacket, on which the plurality of heat conduction members are bonded with heat conductive bonding agent, sealed with the substrate, wherein, in a surface of each of the plurality of heat conduction members adjacent to the cooling jacket and in a surface of the cooling jacket adjacent to the heat conduction members, around a portion corresponding to the back surface of each of the semiconductor chip is formed a portion which has non-affinity for the heat conductive bonding agent. Further, it is preferred that a reservoir having an affinity for the heat conductive bonding agent and serving to receive an excessive bonding agent is formed around each of the non-affinity portions of the plurality of heat conduction members and the cooling jacket.
    Type: Grant
    Filed: April 22, 1992
    Date of Patent: January 4, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Toshio Hatsuda, Takahiro Daikoku, Tetsuya Hayashida, Noriyuki Ashiwake, Fumiyuki Kobayashi, Keizou Kawamura, Sohji Sakata
  • Patent number: 5270572
    Abstract: A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: December 14, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Tadakatsu Nakajima, Shigeo Ohashi, Heikichi Kuwahara, Noriyuki Ashiwake, Motohiro Sato, Toshio Hatsuda, Takahiro Daikoku, Toshio Hatada, Shigeyuki Sasaki, Hiroshi Inouye, Atsuo Nishihara, Kenichi Kasai
  • Patent number: 5133403
    Abstract: A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.
    Type: Grant
    Filed: October 19, 1989
    Date of Patent: July 28, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Yokono, Takao Terabayashi, Nobuo Kayaba, Takahiro Daikoku, Shigekazu Kieda, Fumiyuki Kobayashi, Shizuo Zushi
  • Patent number: 5126829
    Abstract: A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: June 30, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Nobuo Kawasaki, Noriyuki Ashiwake, Shizuo Zushi
  • Patent number: 5089936
    Abstract: In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.
    Type: Grant
    Filed: September 7, 1989
    Date of Patent: February 18, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyuki Kojima, Toshio Hatsuda, Takahiro Daikoku, Shizuo Zushi, Fumiyuki Kobayashi
  • Patent number: 5077601
    Abstract: A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid.
    Type: Grant
    Filed: September 7, 1989
    Date of Patent: December 31, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Toshio Hatada, Takayuki Atarashi, Takahiro Daikoku, Satomi Kobayashi, Shizuo Zushi, Fumiyuki Kobayashi, Susumu Iwai
  • Patent number: RE35721
    Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: February 3, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Takahiro Daikoku, Tadakatsu Nakajima, Noriyuki Ashiwake, Keizo Kawamura, Motohiro Sato, Fumiyuki Kobayashi, Wataru Nakayama