Patents by Inventor Takahiro Ishikawa

Takahiro Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040191558
    Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 &mgr;m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 &mgr;g/cm2.
    Type: Application
    Filed: March 24, 2004
    Publication date: September 30, 2004
    Applicant: NGK Insulators, Ltd.
    Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Seiji Yasui
  • Publication number: 20040126612
    Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
    Type: Application
    Filed: December 11, 2003
    Publication date: July 1, 2004
    Applicant: NGK Insulators, Ltd.
    Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
  • Patent number: 6746507
    Abstract: There are disclosed a method for producing a composite material composed of a dispersing agent and a matrix, and a composite material produced by the method. The matrix is formed by the steps of coating a metal-coated dispersing agent to form a metal-coated layer on the surface of the dispersing agent, filling the metal-coated dispersing agent in a jig prepared in a fixed shape, and then causing the reaction of the metal-coated layer with a molten Al by impregnating the metal-coated dispersing agent with the molten Al filled in the jig.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: June 8, 2004
    Assignee: NGK Insulators, Ltd.
    Inventors: Masayuki Shinkai, Masahiro Kida, Takahiro Ishikawa, Toshimasa Ochiai
  • Patent number: 6652803
    Abstract: When a nitride film is formed on a substrate containing at least metallic aluminum, a fluctuation in forming a nitride film can be prevented, or the formation of the nitride film can be accelerated. A substrate containing at least metallic aluminum is subjected to a heating treatment in vacuum of 10−3 torrs or less, and subsequently it is subjected to a heating/nitriding treatment in an atmosphere (5) containing at least nitrogen. During the heating/nitriding treatment, porous bodies (3) and (4) through which nitrogen atoms-containing gases (A) and (B) can flow are contacted with the atmosphere (5).
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: November 25, 2003
    Assignee: NGK Insulators, Ltd.
    Inventors: Morimichi Watanabe, Shinji Kawasaki, Takahiro Ishikawa
  • Publication number: 20030157360
    Abstract: There are provided a bonded member comprising a ceramic base material and a metal member; said bonded member comprising a ceramic base material 1 and a metal member 7 which are solid-phase bonded via a soldering material 5, an active metal 4 is placed on a surface of the ceramic base material 1, the soldering material 5 comprising Au is placed on the active metal 4, the active metal 4 and the soldering material 5 are heated so as to form a precoat layer 6, the metal member 7 is placed on the surface of the precoat layer 6 via a barrier layer 8 capable of inhibiting diffusion of a metal constituting a metal member, and the precoat layer 6 and the metal member 7 are pressurized and heated so as to be solid-phase bonded. The production method thereof also disclosed.
    Type: Application
    Filed: January 21, 2003
    Publication date: August 21, 2003
    Applicant: NGK Insulator, Ltd.
    Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
  • Publication number: 20030141345
    Abstract: There are provided a bonded member comprising different materials which are bonded together, the bonded member having air tightness at the interface between the bonded materials and also having thermal cycle properties and thermal shock properties and being able to be produced by a simple operation, and an easy-to-practice production method of the bonded member comprising different materials.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 31, 2003
    Applicant: NGK Insulators, Ltd.
    Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida, Mitsuru Ohta
  • Publication number: 20030127212
    Abstract: A composite material 5 in which a dispersing material 7 is dispersed in a matrix 6 is provided.
    Type: Application
    Filed: November 19, 2002
    Publication date: July 10, 2003
    Applicant: NGK Insulators, Ltd.
    Inventors: Masahiro Kida, Takahiro Ishikawa, Masayuki Shinkai, Takatoshi Ikematsu
  • Publication number: 20030102553
    Abstract: A member (12A) for use in an electronic circuit has a thermally conductive layer (22) mounted on a heat sink (20). The thermally conductive layer (22) comprises an insulating substrate (24), a first joint member (26) joining the insulating substrate (24) to the heat sink (20) and containing an active element, a second joint member (28) disposed on the insulating substrate (24), and an electrode (30) disposed on the second joint member (28). The insulating substrate (24) comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members (26, 28) is made of a hard brazing material containing an active element. The heat sink (20) is made of an SiC/Cu composite material or a C/Cu composite material.
    Type: Application
    Filed: October 21, 2002
    Publication date: June 5, 2003
    Inventors: Shuhei Ishikawa, Takahiro Ishikawa, Masahiro Kida, Ken Suzuki
  • Publication number: 20030099400
    Abstract: Luminous values of pixels of coordinates previously set as an obstacle presence line are inputted to a memory as a one-dimensional signal converted from a two-dimensional image signal taken by a camera. A portion of the line has a luminous value other than a luminous value predicted as a luminous value of a normal road. The portion of the line is then extracted as a vehicle candidate range. Further, based on characteristic of the vehicle such as a vehicle width or a relative speed, presence or absence of the vehicle is determined by removing noise from the extracted vehicle candidate range.
    Type: Application
    Filed: November 25, 2002
    Publication date: May 29, 2003
    Inventor: Takahiro Ishikawa
  • Publication number: 20030059331
    Abstract: There are disclosed a method for producing a composite material composed of a dispersing agent and a matrix, and a composite material produced by the method. The matrix is formed by the steps of coating a metal-coated dispersing agent to form a metal-coated layer on the surface of the dispersing agent, filling the metal-coated dispersing agent in a jig prepared in a fixed shape, and then causing the reaction of the metal-coated layer with a molten Al by impregnating the metal-coated dispersing agent with the molten Al filled in the jig.
    Type: Application
    Filed: March 25, 2002
    Publication date: March 27, 2003
    Applicant: NGK Insulators, Ltd.
    Inventors: Masayuki Shinkai, Masahiro Kida, Takahiro Ishikawa, Toshimasa Ochiai
  • Publication number: 20030059332
    Abstract: A method of producing a ceramic matrix composite is provided, which production method reduces metal residual percentage within matrix with little energy consumption, without requiring special external heating means and special equipment while it is industrially simple and at a low price. It is a method of producing a ceramic matrix composite having the steps of filling mixed powder obtained by mixing metal powder and boron nitride powder into a predetermined container to form a green compact having a porous structure, and infiltrating the above described green compact with molten Al to form a composite material containing metal boride and having aluminum nitride as a matrix. The green compact is formed by compressing the mixed powder whose mixing ratio of metal powder to boron nitride powder is 1 : 1.8 to 1 : 2.2 (molar ratio) so that porosity of the green compact is 34 to 42%.
    Type: Application
    Filed: August 15, 2002
    Publication date: March 27, 2003
    Applicant: NGK Insulators, Ltd.
    Inventors: Makoto Kobashi, Naoyuki Kanetake, Takahiro Ishikawa, Masahiro Kida
  • Patent number: 6524401
    Abstract: While a nitride film is formed on a substrate containing metallic aluminum, a fluctuation in forming nitride film can be prevented, or the formation of the nitride film can be accelerated. A substrate containing at least metallic aluminum is subjected to a heating treatment in vacuum of 10−3 torr or less, and subsequently it is subjected to a heating/nitriding treatment in a atmosphere containing at least nitrogen to form a nitride film. A porous body through which a nitrogen atoms containing gas flow is clarified by heating at a temperature of 1000° C. or more under pressure of 10−4 torr or less, and then the porous body is contacted the atmosphere during the heating/nitriding step.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: February 25, 2003
    Assignee: NGK Insulators, Ltd.
    Inventors: Morimichi Watanabe, Shinji Kawasaki, Takahiro Ishikawa
  • Publication number: 20030030141
    Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
    Type: Application
    Filed: September 13, 2002
    Publication date: February 13, 2003
    Applicant: NGK Insulators, Ltd.
    Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
  • Patent number: 6485816
    Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: November 26, 2002
    Assignee: NGK Insulators, Ltd.
    Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
  • Publication number: 20020138973
    Abstract: An etching treatment is applied to a metal plate in accordance with a predetermined circuit pattern to form a circuit. Subsequently, a sandblast treatment is applied to an entire surface including the circuit to remove a conductive reactive layer remaining at a metal-removed portion of the circuit. Accordingly, an insulating substrate as an underlying layer is exposed from the metal-removed portion of the circuit. The sandblast treatment is performed under a condition in which an Ni plating layer remains on the circuit at a stage at which the conductive reactive layer remaining at the metal-removed portion of the circuit is removed.
    Type: Application
    Filed: March 27, 2002
    Publication date: October 3, 2002
    Applicant: NGK Insulators, Ltd.
    Inventors: Takahiro Ishikawa, Masahiro Kida, Shuhei Ishikawa, Nobuaki Nakayama
  • Patent number: 6450231
    Abstract: A coating film transfer apparatus capable of affixing a transfer coating film on a surface of a base tape to a desired location of a paper or the like accurately and easily with a strong adhesive performance and cutting off an excessive portion of a transferred coating film accurately and beautifully. A bottom end face 9b of a pressing lever 9 for guiding a coating film provided tape or a corrective tape 12 provided in a case 1 and pressing it onto a paper surface 13 is formed in a flat surface having a width in the back and forth direction and a front edge thereof is formed in a sharp linear angle edge.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: September 17, 2002
    Assignee: Tombow Pencil Co., Ltd.
    Inventor: Takahiro Ishikawa
  • Publication number: 20020125300
    Abstract: Provided is a bonding method in which two or more different members are bonded through a fitting structure by forming a bonding layer of an adhesive composition controlled in expansion coefficient, even if the clearance between wall surfaces of the different members in the fitting structure is not enough to pour a given amount of a hard solder therein, and a composite member made by the method is further provided.
    Type: Application
    Filed: January 3, 2002
    Publication date: September 12, 2002
    Applicant: NGK INSULATORS, LTD.
    Inventors: Takahiro Ishikawa, Masayuki Shinkai, Masahiro Kida
  • Publication number: 20020122592
    Abstract: An image area extract unit includes a modeling unit for generating a pixel evaluation model used for extraction, and an extract unit for extracting a characteristic portion from an original image using the pixel evaluation model. The modeling unit sequentially generates a plurality of partial polynomials according to a modified Group Method of Data Handling using a training image taken under the same condition under which the original image is taken and a supervisory image that designates the characteristic portion of the training image. Each of the generated partial polynomials is outputted to the extract unit in the form of its coefficients only when a square error satisfies a predetermined criterion. The extract unit calculates the feature values for each pixel of the original image using the pixel evaluation model, and defines the extractive area that includes the characteristic portion based on the feature values.
    Type: Application
    Filed: February 28, 2002
    Publication date: September 5, 2002
    Inventors: Takahiro Ishikawa, Takeshi Kawashima
  • Publication number: 20020076942
    Abstract: While a nitride film is formed on a substrate containing metallic aluminum, a fluctuation in forming nitride film can be prevented, or the formation of the nitride film can be accelerated. A substrate containing at least metallic aluminum is subjected to a heating treatment in vacuum of 10−3 torr or less, and subsequently it is subjected to a heating/nitriding treatment in a atmosphere containing at least nitrogen to form a nitride film. A porous body through which a nitrogen atoms containing gas flow is clarified by heating at a temperature of 1000° C. or more under pressure of 10−4 torr or less, and then the porous body is contacted the atmosphere during the heating/nitriding step.
    Type: Application
    Filed: July 30, 2001
    Publication date: June 20, 2002
    Applicant: NGK Insulators, Ltd.
    Inventors: Morimichi Watanabe, Shinji Kawasaki, Takahiro Ishikawa
  • Publication number: 20020062928
    Abstract: A coating film transfer apparatus capable of affixing a transfer coating film on a surface of a base tape to a desired location of a paper or the like accurately and easily with a strong adhesive performance and cutting off an excessive portion of a transferred coating film accurately and beautifully. A bottom end face 9b of a pressing lever 9 for guiding a coating film provided tape or a corrective tape 12 provided in a case 1 and pressing it onto a paper surface 13 is formed in a flat surface having a width in the back and forth direction and a front edge thereof is formed in a sharp linear angle edge.
    Type: Application
    Filed: February 23, 1999
    Publication date: May 30, 2002
    Inventor: TAKAHIRO ISHIKAWA