Abstract: The object of the present invention is to provide compiling technology to compile even source programs written in an object-oriented programming language so as to enable parallel processing. In order to realize parallel processing, in addition to the object 1000 specified by the source program, objects of said class for parallelization processing 1010, 1020 must be generated, for class variables specified by parallelization directive and class-type variables contained in execution statements to be executed in parallel. In addition, on completion of parallel processing, objects for parallelization processing are destroyed.

Abstract: When a nitride film is formed on a substrate containing at least metallic aluminum, a fluctuation in forming a nitride film can be prevented, or the formation of the nitride film can be accelerated. A substrate containing at least metallic aluminum is subjected to a heating treatment in vacuum of 10−3 torrs or less, and subsequently it is subjected to a heating/nitriding treatment in an atmosphere (5) containing at least nitrogen. During the heating/nitriding treatment, porous bodies (3) and (4) through which nitrogen atoms-containing gases (A) and (B) can flow are contacted with the atmosphere (5).

Abstract: The object of the present invention is to provided a compiler for parallel computers that enable rapid processing by introducing a new data structure. A compiler 20 which compiles a source program 10, which includes a parallelization directive, executes a step of detecting a parallelization directive in the source program; and if the parallelization directive is detected, generating a front-end intermediate language for the parallelization directive by positioning on a storage region, each processing code of at least part of the parallelization directive with a hierarchical structure in accordance with an internal structure of the parallelization directive.

Abstract: A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.

Abstract: The object is to provide a laminated radiation member and a power semiconductor apparatus in which no cracks occur due to thermal stress caused by cooling and thermal cycle and which are low in thermal resistance.