Patents by Inventor Takahiro Ishikawa
Takahiro Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7398912Abstract: A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.Type: GrantFiled: December 11, 2003Date of Patent: July 15, 2008Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
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Publication number: 20080130953Abstract: An operation estimating apparatus includes an image obtaining unit, a human body feature point specifying unit, and an operation estimating unit. The image obtaining unit repeatedly obtains images. The human body feature point specifying unit specifies a predetermined human body feature point of an operator in each of the images. The operation estimating unit estimates one of operations based on the human body feature points. The operation estimating unit compares an actual posture locus of the operator with a transitional estimation model for each of the operations by the operator to obtain a degree of approximation of the transitional estimation model to the actual posture locus. The operation estimating unit estimates that the operator is going to perform the one of the operations that corresponds to an estimated posture locus of the transitional estimation model having the degree of approximation that satisfies a predetermined threshold.Type: ApplicationFiled: December 4, 2007Publication date: June 5, 2008Applicant: DENSO CORPORATIONInventor: Takahiro Ishikawa
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Publication number: 20070285217Abstract: A field recognition apparatus includes a first camera for imaging a forward field and a second camera for imaging a road surface. The second camera has a light axis tilted toward a downward direction for accurately tracking a characteristic point in consecutively captured images to calculate an optical flow and for accurately recognizing road structure information. In this manner, three dimensional information of obstacles in a field is accurately processed and detected.Type: ApplicationFiled: April 11, 2007Publication date: December 13, 2007Applicants: DENSO Corporation, Takanori FukaoInventors: Takahiro Ishikawa, Takanori Fukao
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Patent number: 7170548Abstract: Luminous values of pixels of coordinates previously set as an obstacle presence line are inputted to a memory as a one-dimensional signal converted from a two-dimensional image signal taken by a camera. A portion of the line has a luminous value other than a luminous value predicted as a luminous value of a normal road. The portion of the line is then extracted as a vehicle candidate range. Further, based on characteristic of the vehicle such as a vehicle width or a relative speed, presence or absence of the vehicle is determined by removing noise from the extracted vehicle candidate range.Type: GrantFiled: November 25, 2002Date of Patent: January 30, 2007Assignee: Denso CorporationInventor: Takahiro Ishikawa
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Patent number: 7170186Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.Type: GrantFiled: July 12, 2005Date of Patent: January 30, 2007Assignee: NGK Insulators, Ltd.Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
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Patent number: 7161807Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.Type: GrantFiled: February 20, 2004Date of Patent: January 9, 2007Assignee: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Kazuyoshi Inoue
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Publication number: 20060191707Abstract: A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.Type: ApplicationFiled: April 24, 2006Publication date: August 31, 2006Applicant: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masahiro Kida, Shuhei Ishikawa, Nobuaki Nakayama
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Patent number: 7076098Abstract: An image area extract unit includes a modeling unit for generating a pixel evaluation model used for extraction, and an extract unit for extracting a characteristic portion from an original image using the pixel evaluation model. The modeling unit sequentially generates a plurality of partial polynomials according to a modified Group Method of Data Handling using a training image taken under the same condition under which the original image is taken and a supervisory image that designates the characteristic portion of the training image. Each of the generated partial polynomials is outputted to the extract unit in the form of its coefficients only when a square error satisfies a predetermined criterion. The extract unit calculates the feature values for each pixel of the original image using the pixel evaluation model, and defines the extractive area that includes the characteristic portion based on the feature values.Type: GrantFiled: February 28, 2002Date of Patent: July 11, 2006Assignee: Denso CorporationInventors: Takahiro Ishikawa, Takeshi Kawashima
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Patent number: 7069645Abstract: A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.Type: GrantFiled: March 27, 2002Date of Patent: July 4, 2006Assignee: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masahiro Kida, Shuhei Ishikawa, Nobuaki Nakayama
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Patent number: 6993753Abstract: The object of the present invention is to provided a compiler for parallel computers that enable rapid processing by introducing a new data structure. A compiler 20 which compiles a source program 10, which includes a parallelization directive, executes a step of detecting a parallelization directive in the source program; and if the parallelization directive is detected, generating a front-end intermediate language for the parallelization directive by positioning on a storage region, each processing code of at least part of the parallelization directive with a hierarchical structure in accordance with an internal structure of the parallelization directive.Type: GrantFiled: February 1, 2001Date of Patent: January 31, 2006Assignee: Fujitsu LimitedInventors: Yutaka Yamanaka, Takahiro Ishikawa
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Publication number: 20050263877Abstract: A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.Type: ApplicationFiled: July 12, 2005Publication date: December 1, 2005Applicant: NGK Insulators, Ltd.Inventors: Kiyoshi Araki, Masahiro Kida, Takahiro Ishikawa, Yuki Bessyo, Takuma Makino
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Publication number: 20050176115Abstract: A practical method for producing methionine is presented. When a substance capable of producing methionine through hydrolysis is used as raw material and converted into methionine by using a biocatalyst, the biocatalyst is repeatedly usable and the accumulation amount of methionine dissolved in the reaction solution is increased, and methionine is obtained in a solid form from the reaction solution.Type: ApplicationFiled: July 22, 2003Publication date: August 11, 2005Applicant: Nippon Soda Co., Ltd.Inventors: Yoichi Kobayashi, Ippei Ono, Koichi Hayakawa, Ryousuke Mizui, Takahiro Ishikawa
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Patent number: 6918530Abstract: A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.Type: GrantFiled: January 21, 2003Date of Patent: July 19, 2005Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida, Mitsuru Ohta
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Patent number: 6916355Abstract: A composite material 5 in which a dispersing material 7 is dispersed in a matrix 6 is provided. The composite material 5 is producible by steps of filling said mixed material in a space forming region to be defined by at least two container elements when said at least two container elements are integrated into one body, and then infiltrating said aluminum (Al) being molten due to heat generated by said self-combustion reaction into pores inside said mixed material through at least one hole formed in an upper part of a reaction container formed by combining said at least two container elements in which said mixed material is filled in said space forming region in a state being fixed to a predetermined shape, thereby an aluminide intermetallic compound is formed by self-combustion reaction between said metal powder and said aluminum (Al), and a dispersing material is dispersed into said matrix.Type: GrantFiled: November 19, 2002Date of Patent: July 12, 2005Assignee: NGK Insulators, Ltd.Inventors: Masahiro Kida, Takahiro Ishikawa, Masayuki Shinkai, Takatoshi Ikematsu
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Patent number: 6911728Abstract: A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.Type: GrantFiled: December 19, 2001Date of Patent: June 28, 2005Assignee: NGK Insulators, Ltd.Inventors: Shuhei Ishikawa, Takahiro Ishikawa, Masahiro Kida, Ken Suzuki
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Publication number: 20050119475Abstract: With the object of providing a method for separating glycolipids (particularly gangliosides) capable of processing a large number of samples easily and at low cost, and capable of recovering multiple types of glycolipids with high recovery, in the method for separating glycolipids of the present invention (a) a sample solution obtained by hydrolysis of an extract derived from a biological sample with a mixture of a nonpolar solvent and a polar solvent is first brought into contact via a semipermeable membrane with a solution having lower osmotic pressure than the sample solution, and (b) the contact is continued until the sample solution divides into two or three layers, and the middle layer and/or bottom layer are/is separated.Type: ApplicationFiled: April 16, 2004Publication date: June 2, 2005Inventors: Takahiro Ishikawa, Akira Yamaguchi, Kyoko Suzuki, Kayoko Katsuyama
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Patent number: 6881499Abstract: A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the soldering material, which includes Au, is placed on the active metal, and the active metal and the soldering material are heated so as to form a precoat layer. The metal member is placed on the surface of the precoat layer via a barrier layer, which is capable of inhibiting diffusion of a metal constituting the metal member, and the precoat layer and the metal member are pressurized heated so as to be solid-phase bonded. The production method of the bonded member is also disclosed.Type: GrantFiled: January 21, 2003Date of Patent: April 19, 2005Assignee: NGK Insulators, Ltd.Inventors: Masayuki Shinkai, Takahiro Ishikawa, Masahiro Kida
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Patent number: 6857556Abstract: A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.Type: GrantFiled: January 3, 2002Date of Patent: February 22, 2005Assignee: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masayuki Shinkai, Masahiro Kida
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Patent number: 6830724Abstract: A method of producing a ceramic matrix composite is provided, which production method reduces metal residual percentage within matrix with little energy consumption, without requiring special external heating means and special equipment while it is industrially simple and at a low price. It is a method of producing a ceramic matrix composite having the steps of filling mixed powder obtained by mixing metal powder and boron nitride powder into a predetermined container to form a green compact having a porous structure, and infiltrating the above described green compact with molten Al to form a composite material containing metal boride and having aluminum nitride as a matrix. The green compact is formed by compressing the mixed powder whose mixing ratio of metal powder to boron nitride powder is 1:1.8 to 1:2.2 (molar ratio) so that porosity of the green compact is 34 to 42%.Type: GrantFiled: August 15, 2002Date of Patent: December 14, 2004Assignees: NGK Insulators, Ltd.Inventors: Makoto Kobashi, Naoyuki Kanetake, Takahiro Ishikawa, Masahiro Kida
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Publication number: 20040207987Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.Type: ApplicationFiled: February 20, 2004Publication date: October 21, 2004Applicant: NGK Insulators, Ltd.Inventors: Takahiro Ishikawa, Masayuki Shinkai, Makoto Miyahara, Shuhei Ishikawa, Nobuaki Nakayama, Kazuyoshi Inoue