Abstract: In the power distributor using a semiconductor switching element, input terminals 10I and 10L, output terminals 12A-12J, connected to the element, and more preferably, the board terminals 30 and 32, are structured by a metallic plate, and arranged on the same plane perpendicular to the plate thickness. The metallic plate can be integrated by the resin mold, thereby the structure can be greatly simplified. The metallic plate can be produced by a greatly simple method by which, after the punching out of the metallic plate and the molding of the resin mold, a predetermined portion of the metallic plate is cut and the semiconductor switching element is mounted, and it can contribute to also the reduction of the cost.

Abstract: An electric power distribution unit is formed independently of a bus bar board by integrating a plurality of switching devices. The electric power distribution unit includes a heat radiation plate and a plurality of unit-forming bus bars. The switching devices are mounted on the bus bars. Input and output terminals are formed by bending appropriate unit-forming bus bars toward the heat radiation plate, and are connected to connection terminals of the bus bar board. A circuit is formed in which electric power inputted to the input terminal is supplied through the switching devices to the output terminals.

Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: In the power distributor using a semiconductor switching element, input terminals 10I and 10L, output terminals 12A-12J, connected to the element, and more preferably, the board terminals 30 and 32, are structured by a metallic plate, and arranged on the same plane perpendicular to the plate thickness. The metallic plate can be integrated by the resin mold, thereby the structure can be greatly simplified. The metallic plate can be produced by a greatly simple method by which, after the punching out of the metallic plate and the molding of the resin mold, a predetermined portion of the metallic plate is cut and the semiconductor switching element is mounted, and it can contribute to also the reduction of the cost.

Abstract: Instead of a relay block which is present in bus bar circuits in a conventional electric junction box, semiconductor switching devices 14 are provided, and a power distributing unit PD which is independent of a bus bar circuit unit JB is structured by concentrating these semiconductor switching devices 14, output terminals 12 of this power distributing unit PD being connected to appropriate bus bars 32 of the bus bar circuit unit JB. The power distributing unit PD and the bus bar circuit unit JB are incorporated in a common housing 40.

Abstract: A power module includes a heat radiating member, a power circuit section, a resin layer, and a case. The heat radiating member includes a circuit disposition surface. The power circuit section includes an external connection terminal and is disposed on the circuit disposition surface. The resin layer covers a part of the external connection terminal. The case is attached to the heat radiating member. The external connection terminal stands up from the heat radiating member. The case includes a hood, which has an opening at one end portion thereof. The external connection terminal is inserted into the hood. The resin layer prevents liquid from entering through the hood.

Abstract: A power circuit section including electronic parts of a plurality of FETs and relays having leg terminals is arranged in a circuit arrangement region on a heat radiating member. A surrounding wall member having a seal member at a lower end face thereof and capable of surrounding the power circuit section 1 including the leg terminals of the electronic parts is attached to surround the circuit arrangement region in a state of bringing a seal member into close contact with a circuit arrangement surface. After a circuit arranging step and a surrounding wall forming step, a waterproofing resin in a liquid state is poured into a space surrounded by the surrounding wall member until at least the leg terminals of the electronic parts are sealed. The waterproof resin is cured to form a waterproofing layer for sealing the electronic parts.

Abstract: A group of bus bars, forming a power circuit, are adhesively bonded to a surface of a control circuit board. Surface-mounting type relay switches are used as a switching unit for the power circuit. Contact-side terminals of each relay switch are mounted on the bus bar group while coil-side terminals thereof are mounted on the control circuit board. The opening and closing of relay contacts are controlled by a control circuit incorporated in the control circuit board.

Abstract: In an electric connection box containing a bus bar board in a case, heat radiation member-side bus bars are connected to a heat radiation member, and switching devices, such as FETs, are mounted on the bus bars. The heat radiation member-side bus bars may project beyond an end surface of the heat radiation member, and form heat radiation member-side electrical component connection terminals. Electrical component connection bus bars project from a bus bar board to form bus bar board-side electrical component connection terminals. Electrical components are bridged between the heat radiation member-side electrical component connection terminals and the bus bar board-side electrical component connector terminals.

Abstract: Unit-forming bus bars including input terminal bus bars and output terminal bus bars are secured through an insulation layer to a rear surface of a heat radiation member that is exposed outside an electric connection box case, and switching devices are mounted on the bus bars. Relay switches that are different from the switching devices are mounted on a relay board. The relay board and a control circuit board for controlling driving of the switching devices are disposed on a surface facing away from the rear surface of the heat radiation member, and are parallel to each other.

Abstract: In a power distributor for a vehicle, each of semiconductor switching elements 14 is disposed between an input terminal 10 and corresponding one of a plurality of output terminals 12. The semiconductor switching elements 14 are disposed in one direction and a control circuit board 18 is provided thereon. The input terminal 10, the output terminals 12 and board terminals 16 coupled to the control circuit board 18 are disposed in parallel to the arrangement direction of the semiconductor switching elements 14 and protruded from the casing 22 in the same direction to thereby directly form a connector.

Abstract: An electric power distribution unit is formed independently of a bus bar board by integrating a plurality of switching devices. The electric power distribution unit includes a heat radiation plate and a plurality of unit-forming bus bars. The switching devices are mounted on the bus bars. Input and output terminals are formed by bending appropriate unit-forming bus bars toward the heat radiation plate, and are connected to connection terminals of the bus bar board. A circuit is formed in which electric power inputted to the input terminal is supplied through the switching devices to the output terminals.

Abstract: A circuit-constituting unit forming a distribution circuit or the like in a vehicle. The circuit-constituting unit includes a plurality of bus bars for constituting a power circuit; a semiconductor switching device provided in the power circuit; and a control circuit board. The bus bars are bonded to a surface of the control circuit board such that the bus bars are arranged to be generally coplanar with each other. The semiconductor switching device is mounted on both of the corresponding bus bars and the control circuit board. An opening may be formed through the control circuit board. In this case, one of terminals of the semiconductor switching device may be connected to a surface of the control circuit board facing away from the surface to which the bus bars are bonded. The other terminals may be connected respectively to the bus bar through the opening.

Abstract: A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.

Abstract: A fuse device is provided with a plurality of separate fuse main bodies in which fuse terminals and fuse terminals are formed at the opposite ends of fusing elements, and a plurality of connection terminals which are members separate from the fuse main bodies. A fuse circuit in which the fusing elements are provided between the connection terminals is formed by directly connecting the fuse terminals of the respective fuse main bodies with the connection terminals. The fusing characteristics of the fusing elements and the strength of the connection terminals can be adjusted without influencing each other.

Abstract: Instead of a relay block which is present in bus bar circuits in a conventional electric junction box, semiconductor switching devices 14 are provided, and a power distributing unit PD which is independent of a bus bar circuit unit JB is structured by concentrating these semiconductor switching devices 14, output terminals 12 of this power distributing unit PD being connected to appropriate bus bars 32 of the bus bar circuit unit JB. The power distributing unit PD and the bus bar circuit unit JB are incorporated in a common housing 40.

Abstract: A plurality of board connecting terminals each having a board connecting portion and a pressed-in portion are fixed to an insulating connecting element and thus integrally formed as a circuit board connecting terminal assembly. The board connecting portion of each of the terminals is inserted into a corresponding one of through holes formed in the printed circuit board in such a manner as to penetrate therethrough. Thus, the board connecting portion of each of the terminals is electrically connected thereto, so that the printed circuit board with the board connecting terminals are constituted. Then, a pressed-in portion of each of the circuit connecting terminals is press-fitted into a corresponding press-fitting hole and electrically connected to a corresponding one of the bus bars.

Abstract: A terminal is mounted on an electric wiring board that has both a wire circuit formed by a wire and a printed circuit formed by a printed conductor. The terminal includes a connecting portion capable of electrically connecting an internal circuit of the electric wiring board to an external circuit, a lead portion capable of being electrically connected to the printed circuit of the electric wiring board, and a press-fitting portion capable of being electrically connected to the wire circuit. The electric wiring board may be mounted in an electric junction box. A load supporting member may be provided which transfer a load acting on the terminal from a connector of the external circuit to the housing. The load supporting member may include an engaging portion provided at an end surface of a wiring circuit board, and a retaining portion provided on a side wall of the housing.

Abstract: An electric power distributor is mountable on a motor vehicle for distributing power from a power source installed in the motor vehicle to a plurality of electric load units equipped in the vehicle, and is provided with an input conductive strip having an input terminal at one end thereof, a plurality of output conductive strips each having an output terminal at one end thereof, an insulating holder for holding the input conductive strip and the output conductive strips on the same plane, and a plurality of semiconductor switching elements. The input terminal and the output terminals are projected in the same direction substantially orthogonal to the plane of the insulating holder.

Abstract: A MOSFET 150 composed of a bare tip is surface mounted on a bus bar 141 disposed on the surface of an insulated plate 140, and the MOSFET 150 is circuit connected to a bus bar substrate 14 or to a printed circuit board 145 disposed integrally on the bus bar substrate 14 through a wire 151. In the bus bar 141, there is disposed a heat radiating member 155 which is used to radiate heat generated from the MOSFET 150 into an external space.