Patents by Inventor Takahiro Yamada

Takahiro Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11881420
    Abstract: A ring support is attached to an inner wall surface of a chamber that houses a semiconductor wafer to support a susceptor. When the semiconductor wafer is placed on the susceptor, an inner space of the chamber is separated into an upper space and a lower space. Particles are likely to accumulate on a lower chamber window as a floor part of the chamber. However, since the upper space and the lower space are separated, the semiconductor wafer can be prevented from being contaminated by the particles flowing into the upper space and adhering to a surface of the semiconductor wafer even when the particles on the lower chamber window are blown up by irradiation with flash light.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: January 23, 2024
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Takahiro Yamada, Makoto Abe, Kazuhiko Fuse, Jun Watanabe, Shinji Miyawaki
  • Publication number: 20240021115
    Abstract: A display device includes: a substrate temperature obtainer that obtains a substrate temperature of a substrate of a display panel; a power obtainer that obtains an amount of power used by a plurality of segmented regions of the display panel, based on image data displayed on the display panel; a first increased temperature deriver that derives an increased temperature of a panel surface of the display panel based on the amount of power used by the plurality of segmented regions; and a surface temperature estimator that estimates a temperature of the panel surface based on the substrate temperature and the increased temperature.
    Type: Application
    Filed: July 10, 2023
    Publication date: January 18, 2024
    Applicant: JOLED INC.
    Inventor: Takahiro YAMADA
  • Publication number: 20240006197
    Abstract: Provided is a flash heating part including a plurality of flash lamps on an upper side of a chamber housing a semiconductor wafer, and also provided is an auxiliary heating part including a plurality of VCSELs (vertical cavity surface emitting lasers) on a lower side thereof. After the semiconductor wafer is preheated by light irradiation from the VCSELs, a front surface of the semiconductor wafer is irradiated with a flash of light from the flash lamps to instantaneously increase a temperature of the surface thereof. The VCSELs can emit light having relatively higher intensity than the LEDs. Thus, when light irradiation from the plurality of VCSELs is performed, intensity of light emitted to the substrate can also be increased, and the semiconductor wafer can be efficiently heated.
    Type: Application
    Filed: May 17, 2023
    Publication date: January 4, 2024
    Inventors: Takahiro YAMADA, Shogo SHIGEMASU
  • Publication number: 20230417809
    Abstract: A stretch detection system of a power transmission mechanism is connectable to a conveyor system including a motor, a rotation mechanism driven by the motor, and the power transmission mechanism driven by rotation of the rotation mechanism. The stretch detection system converts a signal of a current of the motor into a frequency domain signal, and calculates an integral value by performing integration on the frequency domain signal obtained by the frequency domain signal conversion unit, by using, as an integration range, at least one of regions of a sideband wave having a frequency determined using a rotation frequency of the rotation mechanism. A stretch diagnosis unit diagnoses a state of stretch of the power transmission mechanism by using the integral value calculated by the integral value calculation unit. Further, an output unit outputs a diagnosis result of the stretch diagnosis unit.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 28, 2023
    Inventors: Akihiro NAKAMURA, Takahiro YAMADA, Daisuke YAMAZAKI
  • Publication number: 20230404034
    Abstract: The present invention pertains to a cat claw polishing and filing tool comprising: a filing member 2 having, on at least one side surface, a filing surface 2a for filing a cat claw; a core 3 having a plurality of corrugated shapes on a side surface; and a liner 4, wherein an end face of the filing member 2, an end face of the core 3 having the corrugated shapes, and an end face of the liner 4 are formed on a top surface of the cat claw polishing and filing tool, a space is formed between the filing surface 2a of the filing member 2 and the side surface of the core 3, the space communicates with the top surface of the cat claw polishing and filing tool 1, and there is a polishing and filing surface 1a for polishing and filing a cat claw on the top face.
    Type: Application
    Filed: October 6, 2021
    Publication date: December 21, 2023
    Applicant: NeCoNe Inc.
    Inventors: Yu SHODA, Takahiro YAMADA
  • Publication number: 20230409416
    Abstract: Provided is an information sharing system including at least one processor configured to: acquire a use status of use by each of a plurality of users for each of a plurality of functions relating to an information sharing service for sharing information; and execute, for each of the functions, predetermined processing relating to the function based on the use status of the function.
    Type: Application
    Filed: April 27, 2023
    Publication date: December 21, 2023
    Inventors: Minoru KAWABATA, Yuya KAWABATA, Yuichi SUGIYAMA, Shogo NINOMIYA, Takahiro FUKUNISHI, Takahiro YAMADA, Kaoru NAKAJIMA
  • Publication number: 20230403789
    Abstract: A wiring substrate includes an insulating layer, and a conductor layer including a wiring formed on the insulating layer. The wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section.
    Type: Application
    Filed: May 30, 2023
    Publication date: December 14, 2023
    Applicant: IBIDEN CO., LTD.
    Inventors: Hiroki WAKAMORI, Ikuya TERAUCHI, Takahiro YAMADA
  • Publication number: 20230376270
    Abstract: A character input device converts an input character string into a corresponding conversion character string, and includes a first input unit accepting input of a first character string by a first input method; a second input unit accepting input of a second character string by a second input method; and a character string combination unit that, when the input of the first character string is accepted after the input of the second character string, generates an input character string candidate by connecting the first and the second character string accepted for input this time. The character string combination unit extracts an identical character string as a duplicate character string at a tail of the first character string and a head of the second character string; and generates a character string formed by connecting the first and the second character string without the duplicate character string by the duplicate character string.
    Type: Application
    Filed: April 19, 2023
    Publication date: November 23, 2023
    Applicant: OMRON Corporation
    Inventor: Takahiro YAMADA
  • Publication number: 20230352599
    Abstract: A source layer is provided on a first p-type layer made of a nitride-based semiconductor, and includes a semiconductor region including electrons as carriers. A drain layer faces the source layer in a first direction on the first p-type layer with a gap being provided therebetween, and includes a semiconductor region including electrons as carriers. A channel structure is provided between the source layer and the drain layer on the first p-type layer, in which a channel region and a gate region are alternately disposed in a second direction perpendicular to the first direction. A channel layer included in the channel structure forms at least a part of the channel region, and is made of a nitride-based semiconductor. A gate layer included in the channel structure forms at least a part of the gate region, and electrically connects a gate electrode and the first p-type layer.
    Type: Application
    Filed: May 13, 2020
    Publication date: November 2, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hisashi SAITO, Yuki TAKIGUCHI, Shigeyoshi USAMI, Takahiro YAMADA, Marika NAKAMURA, Eiji YAGYU
  • Patent number: 11792937
    Abstract: A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: October 17, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Takahiro Yamada, Seiji Izawa, Katsuyuki Sano
  • Patent number: 11773632
    Abstract: In a vehicular door outer handle device, when a handle base, to which a handle lever that is interlocked with and connected to a connecting arm portion of an outer handle is assembled, is assembled to a vehicle door, insertion of the handle lever into an opening of the vehicle door is allowed when the handle lever is in an operating position. In the vehicle door outer handle device, a state of holding the handle lever in the operating position is reliably maintained so that the handle lever is placed in the operating position.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 3, 2023
    Assignee: MINEBEA ACCESSSOLUTIONS INC.
    Inventors: Tomoyuki Kukita, Takahiro Yamada
  • Publication number: 20230295402
    Abstract: An object of the present invention is to obtain an ethylene-based polymer composition useful as a material for shaped articles having a low surface resistivity and a low volume resistivity and exhibiting excellent slidability. The present invention pertains to an ethylene-based polymer composition containing an ethylene-based polymer (A) and a carbon-based filler (C), the ethylene-based polymer composition having a melt flow rate (MFR) in the range of 0.1 to 20 g/10 min as measured in accordance with JIS K7210-1: 2014 at a measurement temperature of 230° C. under a load of 10 kgf.
    Type: Application
    Filed: July 16, 2021
    Publication date: September 21, 2023
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Chihiro KOMATSU, Makoto NAKANO, Yoshisada FUKAGAWA, Futoshi FUJIMURA, Takahiro YAMADA, Keisuke ENDO
  • Publication number: 20230279523
    Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
  • Patent number: 11742105
    Abstract: A scanning magnet that deflects a charged particle beam has a winding U provided with grooves SL1 and SL4 provided at facing positions. A passing direction of a conductive wire forming the winding U passes through the groove SL1 in a ?-axis positive direction, and passes through the groove SL4 in a ?-axis negative direction. The winding U has a loop path SL1-SL4 in which the groove SL1 is directed to the ?-axis positive direction, and the groove SL4 is directed to the ?-axis negative direction. When a current flows in the ?-axis positive direction in a winding section U+ disposed in the groove SL1, a current flows in the ?-axis negative direction in a winding section U? disposed in the groove SL4. A yoke, the winding U, a winding V, and a winding W have a 120° rotationally symmetric structure with respect to a central axis of the yoke.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: August 29, 2023
    Assignee: HITACHI, LTD.
    Inventors: Takahiro Yamada, Takuya Nomura, Seiji Soeda
  • Publication number: 20230249772
    Abstract: A control device of a leaning vehicle for controlling bright lighting and dim lighting for a plurality of oblique areas. When the leaning vehicle is upright, the control device controls the lighting by designating one or more of the plurality of oblique areas as in a brightly lit area to which adaptive lighting control is applied, and by designating the other oblique areas as in a dim area. The dim area includes an uppermost oblique area. When the leaning vehicle turns left or right, as a lean angle in a direction of the turn increases, the control device controls the lighting by designating a second uppermost oblique area that is located immediately below the uppermost oblique area in the up-down direction as in the brightly lit area, and moving the uppermost oblique area from the dim area to the brightly lit area.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 10, 2023
    Inventors: Takehiro INOUE, Atsushi KAMO, Takahiro YAMADA
  • Publication number: 20230249771
    Abstract: A headlight device includes a headlight and a control device. The headlight includes a plurality of light sources that is configured to light one or more left oblique areas located in the ahead-driving direction of the leaning vehicle on the left, one or more right oblique areas located in the ahead-driving direction of the leaning vehicle on the right, and one or more lower areas located in the ahead-driving direction of the leaning vehicle. The control device controls the headlight to light at least the left oblique areas and the right oblique areas based on adaptive lighting control. At least one of the left oblique areas and at least one of the right oblique areas that are lit based on the adaptive lighting control spread more outwardly in a left-right direction than any of the lower areas.
    Type: Application
    Filed: April 19, 2023
    Publication date: August 10, 2023
    Inventors: Takehiro INOUE, Atsushi KAMO, Takahiro YAMADA
  • Publication number: 20230228434
    Abstract: A control system for a HVAC system for a structure and including a blower that flows air over an indoor heat exchanger. The control system may include a first input device, a first sensor, and a processor in electronic communication with the first input device, the first sensor, and the blower of the HVAC system. The first input device may be operable to accept a zoning mode selection. The first sensor may be sensor operable to measure a first temperature at a first location within the structure. The processor may be programmed to determine a cooling or heating demand on the HVAC system based on an input temperature and the first measured temperature. The processor may be further programmed to adjust an air flow rate produced by the blower based on the demand on the HVAC system and the zoning mode selection.
    Type: Application
    Filed: March 7, 2023
    Publication date: July 20, 2023
    Applicants: Goodman Global Group, Inc., Daikin Industries, Ltd.
    Inventors: Akinori Nakai, Takahiro Yamada, Cheng Li, Hideyuki Nakagawa, Shinichi Takahashi
  • Patent number: 11692241
    Abstract: While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: July 4, 2023
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
  • Publication number: 20230207348
    Abstract: A plurality of substrate support pins are erected on a susceptor that holds a semiconductor wafer that is an object being treated. The plurality of substrate support pins are set in a ring shape at equal intervals. A flash lamp irradiates the semiconductor wafer supported by the plurality of substrate support pins with flash light to heat the semiconductor wafer. The radius of a setting circle in which the plurality of substrate support pins are set is made larger as the pulse width of flash light emitted from the flash lamp decreases. To irradiate the semiconductor wafer with flash light while having the semiconductor wafer supported by the plurality of substrate support pins can prevent cracking of the semiconductor wafer despite possible abrupt deformation of the semiconductor wafer due to the flash-light irradiation.
    Type: Application
    Filed: May 25, 2021
    Publication date: June 29, 2023
    Inventors: Yukio ONO, Takahiro YAMADA, Makoto ABE
  • Publication number: 20230143585
    Abstract: A first nitride semiconductor layer and a second nitride semiconductor layer are laminated in a first direction. The first and second nitride semiconductor layers form a heterojunction, and a two-dimensional carrier gas is induced in the first nitride semiconductor layer. A drain electrode is opposite to a source electrode via gate electrode in a third direction. The source electrode and the drain electrode conduct with the first nitride semiconductor layer. The first and second nitride semiconductor layers form a Schottky junction with the gate electrode. A first layer is located between the gate electrode and the drain electrode in the third direction and is in contact with the gate electrode, and is in contact with the second nitride semiconductor layer in a second direction. The first layer suppresses induction of the two-dimensional carrier gas in the first nitride semiconductor layer opposite to the first layer in the first direction.
    Type: Application
    Filed: May 21, 2021
    Publication date: May 11, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Marika NAKAMURA, Shigeyoshi USAMI, Yuki TAKIGUCHI, Takahiro YAMADA, Hisashi SAITO, Tatsuro WATAHIKI, Eiji YAGYU