Patents by Inventor Takahiro Yamada
Takahiro Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240246787Abstract: A sheet folder includes a conveyor conveying a sheet, a first folding roller and a second folding roller that form a first nip, a third folding roller forming a second nip with the second folding roller, a first guide movable between a first guide posture and a first retracted posture, a second guide movable between a second guide posture and a second retracted posture, and a motor. The motor rotates the second folding roller forward to convey the sheet toward the first nip, reverse to convey the sheet toward the second nip, moves the first guide to arrange in the first guide in the first guide posture or the first retracted posture, and moves the second guide to arrange the second guide in the second guide posture or the second retracted posture.Type: ApplicationFiled: January 18, 2024Publication date: July 25, 2024Inventors: Takuya MORINAGA, Yuusuke SHIBASAKI, Yusuke HIRONO, Atsushi SHINODA, Shuuto TOHKAISHI, Satoshi HIRATA, Shingo YOSHIZAWA, Suzuka FUJITA, Naofumi YOSHIDA, Ryota TAKAYAMA, Takahiro WATANABE, Yuji SUZUKI, Wataru NOZAKI, Kanako FUJISAKI, Jun YAMADA
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Publication number: 20240234575Abstract: A semiconductor device includes a substrate, a semiconductor layer, an element region, and fin transistors. The substrate includes a principal surface. The semiconductor layer is formed as a surface layer or on the principal surface of the substrate, the surface layer being the principal surface of the substrate. The semiconductor layer has a crystal structure in which an angle between two of crystal orientations with equivalent relationships on a crystal plane having a correspondence with the principal surface of the substrate is 60 degrees or 120 degrees. The element region includes unit element regions formed on the principal surface of the substrate. The fin transistors are formed in the semiconductor layer, in the respective unit element regions. The fin transistors radially extend from a center toward an outer periphery of the element region. Adjacent two of the fin transistors have a spacing with a 60° angle or a 120° angle.Type: ApplicationFiled: March 23, 2021Publication date: July 11, 2024Applicant: Mitsubishi Electric CorporationInventors: Yuki TAKIGUCHI, Eiji YAGYU, Kunihiko NISHIMURA, Hisashi SAITO, Takahiro YAMADA, Daisuke TSUNAMI, Marika NAKAMURA, Masanao ITO
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Patent number: 12021015Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 ?m and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.Type: GrantFiled: February 14, 2019Date of Patent: June 25, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Tamiya, Koji Kishino, Ryuji Takahashi, Yasunori Hoshino, Takahiro Yamada, Shimpei Obata, Hiroyuki Shiraki, Shinya Arakawa, Shigetoshi Fujita
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Publication number: 20240136439Abstract: A semiconductor device includes a substrate, a semiconductor layer, an element region, and fin transistors. The substrate includes a principal surface. The semiconductor layer is formed as a surface layer or on the principal surface of the substrate, the surface layer being the principal surface of the substrate. The semiconductor layer has a crystal structure in which an angle between two of crystal orientations with equivalent relationships on a crystal plane having a correspondence with the principal surface of the substrate is 60 degrees or 120 degrees. The element region includes unit element regions formed on the principal surface of the substrate. The fin transistors are formed in the semiconductor layer, in the respective unit element regions. The fin transistors radially extend from a center toward an outer periphery of the element region. Adjacent two of the fin transistors have a spacing with a 60° angle or a 120° angle.Type: ApplicationFiled: March 22, 2021Publication date: April 25, 2024Applicant: Mitsubishi Electric CorporationInventors: Yuki TAKIGUCHI, Eiji YAGYU, Kunihiko NISHIMURA, Hisashi SAITO, Takahiro YAMADA, Daisuke TSUNAMI, Marika NAKAMURA, Masanao ITO
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Publication number: 20240091560Abstract: A dose monitor measures a dose of a beam. The position monitor measures the beam size of the beam. The irradiation control apparatus calculates the measurement characteristic of the dose monitor based on the dose and the beam size of the beam, and controls the irradiation of the patient with the beam based on the measurement characteristic and the dose.Type: ApplicationFiled: September 15, 2022Publication date: March 21, 2024Inventors: Takuto MIYOSHI, Takuya NOMURA, Yuki ITO, Takashi TOYODA, Takahiro YAMADA
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Publication number: 20240096195Abstract: The present invention provides a notification system (10) including: a customer status information generation unit (11) generating, based on an image in which the inside of a store is captured, customer status information indicating at least one of the number of customers waiting for checkout and the number of customers in the store; a checkout work region information generation unit (12) generating, based on an image in which the inside of the store is captured, checkout work region information indicating status of a checkout work region where a clerk performing checkout work is positioned; a determination unit (13) determining, based on the customer status information and the checkout work region information, whether to make notification of an assistance request for checkout work; and a notification unit (14) making notification of the assistance request through an output apparatus when notification of the assistance request is determined to be made.Type: ApplicationFiled: October 19, 2021Publication date: March 21, 2024Applicant: NEC CorporationInventors: Takahiro YAMADA, Naomi YAMASHITA
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Publication number: 20240082603Abstract: A time required for online adaptive treatment is reduced with a workflow management system that executes a plurality of processes for radiotherapy according to a predetermined workflow. The plurality of processes include at least a first process and a second process, and the workflow management system executes the following modules, in parallel, including a first module that is included in the first process, displays a result of a first calculation based on a patient image captured during treatment by an imaging apparatus that captures a predetermined region of a patient, and requests an input from an operator; and a second module that is included in the second process, and executes a second calculation based on the patient image during the treatment.Type: ApplicationFiled: August 10, 2021Publication date: March 14, 2024Inventors: Takahiro YAMADA, Yusuke FUJII, Toru UMEKAWA, Yoshihiko NAGAMINE, Takao KIDANI
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Patent number: 11881420Abstract: A ring support is attached to an inner wall surface of a chamber that houses a semiconductor wafer to support a susceptor. When the semiconductor wafer is placed on the susceptor, an inner space of the chamber is separated into an upper space and a lower space. Particles are likely to accumulate on a lower chamber window as a floor part of the chamber. However, since the upper space and the lower space are separated, the semiconductor wafer can be prevented from being contaminated by the particles flowing into the upper space and adhering to a surface of the semiconductor wafer even when the particles on the lower chamber window are blown up by irradiation with flash light.Type: GrantFiled: February 4, 2021Date of Patent: January 23, 2024Assignee: SCREEN Holdings Co., Ltd.Inventors: Takahiro Yamada, Makoto Abe, Kazuhiko Fuse, Jun Watanabe, Shinji Miyawaki
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Publication number: 20240021115Abstract: A display device includes: a substrate temperature obtainer that obtains a substrate temperature of a substrate of a display panel; a power obtainer that obtains an amount of power used by a plurality of segmented regions of the display panel, based on image data displayed on the display panel; a first increased temperature deriver that derives an increased temperature of a panel surface of the display panel based on the amount of power used by the plurality of segmented regions; and a surface temperature estimator that estimates a temperature of the panel surface based on the substrate temperature and the increased temperature.Type: ApplicationFiled: July 10, 2023Publication date: January 18, 2024Applicant: JOLED INC.Inventor: Takahiro YAMADA
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Publication number: 20240006197Abstract: Provided is a flash heating part including a plurality of flash lamps on an upper side of a chamber housing a semiconductor wafer, and also provided is an auxiliary heating part including a plurality of VCSELs (vertical cavity surface emitting lasers) on a lower side thereof. After the semiconductor wafer is preheated by light irradiation from the VCSELs, a front surface of the semiconductor wafer is irradiated with a flash of light from the flash lamps to instantaneously increase a temperature of the surface thereof. The VCSELs can emit light having relatively higher intensity than the LEDs. Thus, when light irradiation from the plurality of VCSELs is performed, intensity of light emitted to the substrate can also be increased, and the semiconductor wafer can be efficiently heated.Type: ApplicationFiled: May 17, 2023Publication date: January 4, 2024Inventors: Takahiro YAMADA, Shogo SHIGEMASU
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Publication number: 20230417809Abstract: A stretch detection system of a power transmission mechanism is connectable to a conveyor system including a motor, a rotation mechanism driven by the motor, and the power transmission mechanism driven by rotation of the rotation mechanism. The stretch detection system converts a signal of a current of the motor into a frequency domain signal, and calculates an integral value by performing integration on the frequency domain signal obtained by the frequency domain signal conversion unit, by using, as an integration range, at least one of regions of a sideband wave having a frequency determined using a rotation frequency of the rotation mechanism. A stretch diagnosis unit diagnoses a state of stretch of the power transmission mechanism by using the integral value calculated by the integral value calculation unit. Further, an output unit outputs a diagnosis result of the stretch diagnosis unit.Type: ApplicationFiled: May 31, 2023Publication date: December 28, 2023Inventors: Akihiro NAKAMURA, Takahiro YAMADA, Daisuke YAMAZAKI
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Publication number: 20230404034Abstract: The present invention pertains to a cat claw polishing and filing tool comprising: a filing member 2 having, on at least one side surface, a filing surface 2a for filing a cat claw; a core 3 having a plurality of corrugated shapes on a side surface; and a liner 4, wherein an end face of the filing member 2, an end face of the core 3 having the corrugated shapes, and an end face of the liner 4 are formed on a top surface of the cat claw polishing and filing tool, a space is formed between the filing surface 2a of the filing member 2 and the side surface of the core 3, the space communicates with the top surface of the cat claw polishing and filing tool 1, and there is a polishing and filing surface 1a for polishing and filing a cat claw on the top face.Type: ApplicationFiled: October 6, 2021Publication date: December 21, 2023Applicant: NeCoNe Inc.Inventors: Yu SHODA, Takahiro YAMADA
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Publication number: 20230409416Abstract: Provided is an information sharing system including at least one processor configured to: acquire a use status of use by each of a plurality of users for each of a plurality of functions relating to an information sharing service for sharing information; and execute, for each of the functions, predetermined processing relating to the function based on the use status of the function.Type: ApplicationFiled: April 27, 2023Publication date: December 21, 2023Inventors: Minoru KAWABATA, Yuya KAWABATA, Yuichi SUGIYAMA, Shogo NINOMIYA, Takahiro FUKUNISHI, Takahiro YAMADA, Kaoru NAKAJIMA
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Publication number: 20230403789Abstract: A wiring substrate includes an insulating layer, and a conductor layer including a wiring formed on the insulating layer. The wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section.Type: ApplicationFiled: May 30, 2023Publication date: December 14, 2023Applicant: IBIDEN CO., LTD.Inventors: Hiroki WAKAMORI, Ikuya TERAUCHI, Takahiro YAMADA
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Publication number: 20230376270Abstract: A character input device converts an input character string into a corresponding conversion character string, and includes a first input unit accepting input of a first character string by a first input method; a second input unit accepting input of a second character string by a second input method; and a character string combination unit that, when the input of the first character string is accepted after the input of the second character string, generates an input character string candidate by connecting the first and the second character string accepted for input this time. The character string combination unit extracts an identical character string as a duplicate character string at a tail of the first character string and a head of the second character string; and generates a character string formed by connecting the first and the second character string without the duplicate character string by the duplicate character string.Type: ApplicationFiled: April 19, 2023Publication date: November 23, 2023Applicant: OMRON CorporationInventor: Takahiro YAMADA
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Publication number: 20230352599Abstract: A source layer is provided on a first p-type layer made of a nitride-based semiconductor, and includes a semiconductor region including electrons as carriers. A drain layer faces the source layer in a first direction on the first p-type layer with a gap being provided therebetween, and includes a semiconductor region including electrons as carriers. A channel structure is provided between the source layer and the drain layer on the first p-type layer, in which a channel region and a gate region are alternately disposed in a second direction perpendicular to the first direction. A channel layer included in the channel structure forms at least a part of the channel region, and is made of a nitride-based semiconductor. A gate layer included in the channel structure forms at least a part of the gate region, and electrically connects a gate electrode and the first p-type layer.Type: ApplicationFiled: May 13, 2020Publication date: November 2, 2023Applicant: Mitsubishi Electric CorporationInventors: Hisashi SAITO, Yuki TAKIGUCHI, Shigeyoshi USAMI, Takahiro YAMADA, Marika NAKAMURA, Eiji YAGYU
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Patent number: 11792937Abstract: A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.Type: GrantFiled: September 8, 2021Date of Patent: October 17, 2023Assignee: IBIDEN CO., LTD.Inventors: Takahiro Yamada, Seiji Izawa, Katsuyuki Sano
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Patent number: 11773632Abstract: In a vehicular door outer handle device, when a handle base, to which a handle lever that is interlocked with and connected to a connecting arm portion of an outer handle is assembled, is assembled to a vehicle door, insertion of the handle lever into an opening of the vehicle door is allowed when the handle lever is in an operating position. In the vehicle door outer handle device, a state of holding the handle lever in the operating position is reliably maintained so that the handle lever is placed in the operating position.Type: GrantFiled: July 3, 2019Date of Patent: October 3, 2023Assignee: MINEBEA ACCESSSOLUTIONS INC.Inventors: Tomoyuki Kukita, Takahiro Yamada
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Publication number: 20230295402Abstract: An object of the present invention is to obtain an ethylene-based polymer composition useful as a material for shaped articles having a low surface resistivity and a low volume resistivity and exhibiting excellent slidability. The present invention pertains to an ethylene-based polymer composition containing an ethylene-based polymer (A) and a carbon-based filler (C), the ethylene-based polymer composition having a melt flow rate (MFR) in the range of 0.1 to 20 g/10 min as measured in accordance with JIS K7210-1: 2014 at a measurement temperature of 230° C. under a load of 10 kgf.Type: ApplicationFiled: July 16, 2021Publication date: September 21, 2023Applicant: MITSUI CHEMICALS, INC.Inventors: Chihiro KOMATSU, Makoto NAKANO, Yoshisada FUKAGAWA, Futoshi FUJIMURA, Takahiro YAMADA, Keisuke ENDO
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Publication number: 20230279523Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.Type: ApplicationFiled: May 12, 2023Publication date: September 7, 2023Applicant: Dowa Electronics Materials Co., Ltd.Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada