Abstract: A WAN node device includes a failure monitoring unit that monitors failure in a first LAN-side input-output unit and a second LAN-side input-output unit. If failure in the first LAN-side input-output unit or the second LAN-side input-output unit is detected, failure is notified to a switching controller. Upon receiving a failure notification, the switching controller selects a normally functioning LAN-side input-output unit. Thus, the WAN node device passes on packets to a LAN-communication linking device via either the first LAN-side input-output unit or the second LAN-side input-output unit selected by the switching controller.

Abstract: An object of the present invention enables provision of an optimum shape design method in which an optimum shape of a cushioning material used in cushioning packaging can easily and adequately be designed, and an optimum shape design system in which the optimum shape design method is used. In a configuration of the optimum shape design system is characterized by providing an optimizing control unit 2a. The optimizing control unit 2a detects a correlation among CAD data M of a cushioning material 4 defined by a CAD unit 2b, a mechanical response amount detected by a mechanical response amount calculation unit 2c, manufacturing decision information detected by a manufacturing decision detection unit 2d, and manufacturing cost information detected by a cost calculation unit 2e. Then, the optimizing control unit 2a updates the CAD data M of the cushioning material 4 until an optimum shape of the cushioning material 4 is detected based on the correlation.

Abstract: In an L2 switch having a VLAN function for configuring a layer 2 network in a star topology, a mesh topology, a ring topology, or the like, a VLAN functional portion maps a frame to a predetermined VLAN, a frame classifying portion assigns to the frame a first tag indicating a priority, and a policing portion assigns to the frame a second tag indicating whether or not the frame can be discarded. Also, an OAM monitor inserts a monitoring frame to the VLAN.

Abstract: There is described a semiconductor device which has an isolation region, the isolation region being polished by means of chemical-and-mechanical polishing, and which prevents occurrence of variations in a finished state of active regions even in a case where a large isolation area is present. An isolation region for separating active regions is formed on a semiconductor wafer. An annular dummy pattern is formed in an inactive region of greater than a predetermined size, so as to surround the isolation region. An isolation region is ensured between the active regions surrounding the inactive region and the dummy pattern.

Abstract: There is described a semiconductor device which has an isolation region, the isolation region being polished by means of chemical-and-mechanical polishing, and which prevents occurrence of variations in a finished state of active regions even in a case where a large isolation area is present. An isolation region for separating active regions is formed on a semiconductor wafer. An annular dummy pattern is formed in an inactive region of greater than a predetermined size, so as to surround the isolation region. An isolation region is ensured between the active regions surrounding the inactive region and the dummy pattern.

Abstract: A method of manufacturing a semiconductor device using a polishing apparatus is provided. A top ring holding a wafer is arranged on a pad. A polishing chemical liquid supply line for supplying a polishing chemical liquid is arranged above the pad in a direction ahead of rotation with respect to the top ring. Around the center of rotation of the pad, a partition plate having a columnar side surface is arranged. Above the pad on a side which goes away from the top ring when the pad is rotated, a polishing chemical liquid draining mechanism is arranged extending continuously from the partition plate to the outer periphery of the pad. Accordingly, a polishing apparatus is obtained by which the amount of polishing of the surface to be polished of the semiconductor substrate is stabilized and generation of microscratches on the surface to be polished can be suppressed.

Abstract: A heat cooking device is provided with a heater. The heater is formed of a case member, a base filling the case member, and a heat emitting member provided on one side of the base. The base is formed of insulator. An outer periphery of the heat cooking device is covered by an exterior portion. The base is positioned between the exterior portion and the heat emitting member. Thus, less heat from the heat emitting member is transferred to the exterior portion when the heat emitting member is used to heat food.

Abstract: A load distributing apparatus for a facsimile storage and exchange system exchange stored information with other storage and exchange units to balance the quantities of load to be processed by the apparatus and storage and exchange units to thereby perform efficient facsimile communication. Quantities of load to be processed by a plurality of central processing units are balanced among the units to perform efficient facsimile communication.

Abstract: An apparatus for evaporating a solution in constant proportions of the ingredients, including:(a) a solution container having a neck that extends upward from the center;(b) an impregnation member to be impregnated with the solution which is made of a water-absorbing material;(c) an impregnation member support;(d) a cylindrical tubular member that is fitted over a cylindrical tube that projects upward from the center of said support to thereby define an enclosed space;(e) a feed pipe inserted through the hole made in the center of said support, the lower part of said pipe being immersed in the solution in the container and the upper part thereof being within said cylindrical tubular member; and(f) a hole or slit made in the container and the impregnation support member so as to provide a passage that communicates the atmosphere with the space formed in the container by mounting the impregnation member support on the container,the impregnation member support being in the form of a supporting plate from the cent