Abstract: Provided is a mold part which does not generate periodic irregularities (scale pattern) which appear in the direction orthogonal to the drawing direction (MD) of the mold part having a surface which slides parallel to a molded article when the molded article is removed from the mold after injection molding during injection molding of a thermoplastic resin (in particular, a thermoplastic fluoropolymer), an injection molding method using the same, and a molded article in which periodic irregularities (scale pattern) (which appear in the direction orthogonal to the drawing direction (MD) of the mold part) do not appear. The mold part is used for injection molding of a thermoplastic resin, and includes a surface which slides substantially parallel to a molded article when the molded article is removed from the mold after injection molding, wherein the average tilt angle in the sliding direction (MD) is 1.5° or higher.

Abstract: This underwater optical wireless communication system (100) is provided with a plurality of moving bodies (1) capable of moving underwater. The plurality of moving bodies each includes a plurality of optical wireless communication units (2) each configured to perform bidirectional communication between the plurality of moving bodies using communication light beams (30) having wavelengths different from each other in a plurality of directions which are mutually opposite directions. The plurality of optical wireless communication units is configured to perform bidirectional communication between the plurality of moving bodies using communication light beams, the communication beams having the same wavelength with respect to each of the plurality of directions.

Abstract: A nuclear reactor fuel integrity monitor includes: a ?-ray detector which detects ?-ray of a specific radionuclide of a subject measurement medium of a nuclear reactor; a sample container which retains the subject measurement medium therein and surrounds the circumference of the ?-ray detector; and a measurement control device which performs a control so that a predetermined amount of the subject measurement medium is introduced into the sample container and calculates a concentration of the specific radionuclide from ?-ray data per each unit time detected by the ?-ray detector and a volume of the subject measurement medium introduced into the sample container.

Abstract: A nuclear reactor fuel integrity monitor includes: a ?-ray detector which detects ?-ray of a specific radionuclide of a subject measurement medium of a nuclear reactor; a sample container which retains the subject measurement medium therein and surrounds the circumference of the ?-ray detector; and a measurement control device which performs a control so that a predetermined amount of the subject measurement medium is introduced into the sample container and calculates a concentration of the specific radionuclide from ?-ray data per each unit time detected by the ?-ray detector and a volume of the subject measurement medium introduced into the sample container.

Abstract: An object is to reduce radiation exposure in a nuclear plant. A nuclear plant 1 is a nuclear power generating plant where steam is generated by thermal energy generated by nuclear fission of a nuclear fuel 2C in a nuclear reactor 2, and a turbine 8 is driven by the steam to generate heat by a power generator 10. After a nuclear plant 1 is newly constructed, when a primary cooling system of the nuclear reactor 2 raises the temperature to around a power operation temperature for the first time, zinc is injected into a primary coolant C1 present in the primary cooling system by a zinc injector 20.

Abstract: A nuclear reactor fuel integrity monitor includes: a ?-ray detector which detects ?-ray of a specific radionuclide of a subject measurement medium of a nuclear reactor; a sample container which retains the subject measurement medium therein and surrounds the circumference of the ?-ray detector; and a measurement control device which performs a control so that a predetermined amount of the subject measurement medium is introduced into the sample container and calculates a concentration of the specific radionuclide from ?-ray data per each unit time detected by the ?-ray detector and a volume of the subject measurement medium introduced into the sample container.

Abstract: An ECU increases an engine rotation speed when the ECU determines that an inclination angle of an uphill is larger than or equal to a predetermined value, an accelerator is off and a vehicle speed in a direction opposite to a travelling direction of a vehicle, indicated by a specified range, is increasing. Subsequently, the ECU acquires an engine stall predicted vehicle speed, and calculates a predetermined value used in an immediate engine stall determination condition from a current rate of increase per unit time of a turbine rotation speed. Then, the ECU determines that immediate engine stall determination is affirmative when a rotation speed difference between the engine rotation speed and the turbine rotation speed becomes smaller than the predetermined value, and executes engine stall prevention control.

Abstract: An ECU increases an engine rotation speed when the ECU determines that an inclination angle of an uphill is larger than or equal to a predetermined value, an accelerator is off and a vehicle speed in a direction opposite to a travelling direction of a vehicle, indicated by a specified range, is increasing. Subsequently, the ECU acquires an engine stall predicted vehicle speed, and calculates a predetermined value used in an immediate engine stall determination condition from a current rate of increase per unit time of a turbine rotation speed. Then, the ECU determines that immediate engine stall determination is affirmative when a rotation speed difference between the engine rotation speed and the turbine rotation speed becomes smaller than the predetermined value, and executes engine stall prevention control.

Abstract: In a semiconductor chip, a first semiconductor chip 21 is provided on a chip-mounting component 11, and bonding wires 36 connected to electrode pads 21E of the first semiconductor chip 21 are fixed by being covered with a first insulating adhesive 31. A second semiconductor chip 22 is mounted by being stacked on the first semiconductor chip 21, with the first insulating adhesive 31 therebetween. This structure can prevent problems such as breaking and short-circuits of bonding wires of the chip disposed directly on a substrate when another chip is mounted by being stacked.

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract: A semiconductor device includes a supporting board, a first semiconductor element mounted on a main surface of the supporting board; and an electronic component provided between the supporting board and the first semiconductor element; wherein the supporting board includes a concave part formed in a direction separated from the first semiconductor element; and at least a part of the electronic component is accommodated in the concave part.

Abstract: A wiring board includes a main surface where an electronic component is mounted in a face-down manner so that a surface of the electronic component having plurality of external connecting terminals faces the main surface of the wiring board, the electronic component being fixed to the wiring board by an adhesive; an insulating layer formed on the main surface where the electronic component is mounted; an opening part formed in the insulating layer so that a plurality of adjacent wiring patterns are commonly and partially opened, the adjacent wiring patterns having electrodes where electrodes of the electronic component are connected; wherein an outer periphery of the opening part situated at a center side of the wiring board is formed in an oblique direction against extending directions of the wiring patterns.

Abstract: A nuclear reactor fuel integrity monitor includes: a ?-ray detector which detects ?-ray of a specific radionuclide of a subject measurement medium of a nuclear reactor; a sample container which retains the subject measurement medium therein and surrounds the circumference of the ?-ray detector; and a measurement control device which performs a control so that a predetermined amount of the subject measurement medium is introduced into the sample container and calculates a concentration of the specific radionuclide from ?-ray data per each unit time detected by the ?-ray detector and a volume of the subject measurement medium introduced into the sample container.

Abstract: A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Abstract: A semiconductor device includes a supporting board, a first semiconductor element mounted on a main surface of the supporting board; and an electronic component provided between the supporting board and the first semiconductor element; wherein the supporting board includes a concave part formed in a direction separated from the first semiconductor element; and at least a part of the electronic component is accommodated in the concave part.

Abstract: A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

Abstract: A semiconductor device includes a supporting base whereupon an electrode terminal is placed; an intermediate member mounted on said supporting base; a semiconductor element, a portion thereof being supported with said intermediate member, and placed on said supporting base; and a convex-shaped member which corresponds to the electrode terminal of said semiconductor element and placed on said supporting base or said intermediate member; wherein the electrode terminal of said semiconductor element and the electrode terminal of said supporting base are connected with a bonding wire.

Abstract: To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.

Abstract: A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first linear portion in a direction different from a direction of the first linear portion; and a bent portion that is a part where the first linear portion and the second linear portion are connected.