Patents by Inventor Takao Yamazaki

Takao Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7426462
    Abstract: The largest absolute value (LAV) is determined within a group of data. Based on the LAV, a difference table is identified that is to be used for selecting an optimal Huffman codebook for the group of data. The difference table is associated with two Huffman codebooks. Further, one or more indexes are calculated for the group of data using an expression associated with the two Huffman codebooks, and a size difference value is determined for the group of data using the calculated indexes and the difference table. Based on the determined size difference value, the optimal Huffman codebook is selected from the above two codebooks.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: September 16, 2008
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Jeongnam Young, Sundararam Dwarakanath, Cheung Auyeung, Takao Yamazaki
  • Patent number: 7402406
    Abstract: The present invention identified OVARC1000473 (SEQ ID NO: 1) and NT2RM1000377 (SEQ ID NO: 3) as clones showing suppression of CREB activation by forskolin, and provides evaluation methods using these genes, and/or proteins encoded by these genes. Furthermore, these proteins were found to enhance cell damage. Compounds that can be screened based on the evaluation methods of this invention are useful as agents for inhibiting the CREB dephosphorylation reaction, agents for suppressing enhancement of cell damage, and preventive and therapeutic agents for memory disorders and/or neurodegenerative disorders.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: July 22, 2008
    Assignee: Astellas Pharma Inc.
    Inventors: Masahiko Morita, Hiroyuki Arakawa, Mayako Yamazaki, Susumu Satoh, Shintaro Nishimura, Yasuhiro Kita, Takao Yamazaki
  • Publication number: 20080001288
    Abstract: A terminal pad is formed on an active surface of an LSI chip, and a composite barrier metal layer is provided over this terminal pad. In the composite barrier metal layer, a plurality of low-elasticity particles composed of a silicone resin is dispersed throughout a metal base phase composed of NiP. The composite barrier metal layer has a thickness of, e.g., 3 ?m, and the low-elasticity particles have a diameter of, e.g., 1 ?m. A semiconductor device is mounted on a wiring board by bonding a solder bump to the composite barrier metal layer. The low-elasticity particles are thereby allowed to deform according to the applied stress when the semiconductor device is bonded to the wiring board via the solder bump, whereby the stress can be absorbed.
    Type: Application
    Filed: November 25, 2005
    Publication date: January 3, 2008
    Inventors: Yoshimichi Sogawa, Takao Yamazaki, Nobuaki Takahashi
  • Publication number: 20070210400
    Abstract: In an optical unit including a photoelectric conversion chip adapted to be optically connected to an optical fiber, and a semiconductor chip for driving the photoelectric conversion chip, both the photoelectric conversion chip and the semiconductor chip are wrapped with a flexible sheet, to thereby produce an enveloper enveloping the photoelectric conversion chip and the semiconductor chip therein. At least a part of the enveloper is formed as a transparent area for allowing an optical connection between the optical fiber and the photoelectric conversion chip.
    Type: Application
    Filed: February 20, 2007
    Publication date: September 13, 2007
    Applicants: NEC ELECTRONICS CORPORATION, NEC CORPORATION
    Inventors: Shigeru Moribayashi, Yoshiaki Morishita, Kowashi Taketomi, Takao Yamazaki, Shinji Watanabe, Ichiro Hatakeyama
  • Publication number: 20070199011
    Abstract: A video coding system receives as input a video sequence including a series of picture frames. One or more long term references are selected from the input video sequence, at least one of the long term references is a long term look-behind reference frame. Short term reference frames are also selected according to the standards. The frames are then re-ordered for encoding such that the long term look-behind reference is encoded first, followed by the remaining frames according to the conventional order dictated by the standards. Each frame is encoded according to motion estimation and motion compensation, and an intra prediction method that incorporates the use of the long term look-behind reference frame. Further, encoding of each long term look-behind reference frame includes quantization according to a controlled bit-rate. The bit-rate is increased for quantization of each long term look-behind reference frame, thereby increasing its quality.
    Type: Application
    Filed: February 17, 2006
    Publication date: August 23, 2007
    Inventors: Ximin Zhang, Takao Yamazaki
  • Patent number: 7230328
    Abstract: A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: June 12, 2007
    Assignee: NEC Corporation
    Inventors: Ichiro Hazeyama, Yoshimichi Sogawa, Takao Yamazaki, Sakae Kitajo
  • Publication number: 20070037882
    Abstract: In accordance with the invention, a compound with a protective action for nerve cell can be reselected by adding PPAR? agonist to a culture cell system where toxic substances such as thapsigargin, MPP+ and staurosporine are preliminarily allowed to react and reselecting a compound improving the survival rate. The compound selected by such method can be used as an active ingredient of a therapeutic agent for neurodegenerative diseases such as cerebral infarction and Parkinson's disease. Thus, the invention is very useful for research works for creating novel pharmaceutical agent.
    Type: Application
    Filed: April 15, 2004
    Publication date: February 15, 2007
    Applicant: Astellas Pharma Inc.
    Inventors: Yasuhiro Kita, Takao Yamazaki, Masakazu Muramoto, Akinori Iwashita, Akira Moriguchi, Nobuya Matsuoka
  • Patent number: 7136541
    Abstract: A method of generating a value for a missing pixel “x” by determining a “least harmful” local edge direction between pixels, or sub-pixels, on substantially opposing sides of the missing pixel, and interpolating the difference to arrive at a value for pixel “x”. The method involves generating sub-pixel values for locations within neighboring pixels, the sub-pixels may comprise half-pixels, quarter-pixels, three-quarter pixels, and so forth, wherein any fractional pixel quantity may be created. Absolute difference values are calculated between neighboring pixels, or sub-pixel values, to determine a least harmful local edge direction along which a value is generated for pixel “x” by interpolation.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: November 14, 2006
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Huipin Zhang, Cheung Auyeung, Takao Yamazaki
  • Publication number: 20060055053
    Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
    Type: Application
    Filed: November 7, 2005
    Publication date: March 16, 2006
    Inventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
  • Publication number: 20060049495
    Abstract: A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.
    Type: Application
    Filed: November 19, 2003
    Publication date: March 9, 2006
    Applicant: NEC CORPORATION
    Inventors: Ichiro Hazeyama, Yoshimichi Sogawa, Takao Yamazaki, Sakae Kitajo
  • Patent number: 6998704
    Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: February 14, 2006
    Assignee: NEC Corporation
    Inventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
  • Publication number: 20050238097
    Abstract: An apparatus and method is described for performing texture-decoding within a video decoder processing a series of macroblocks within a video bit-stream. The inventive texture decoding is particularly well suited for implementation within decoders incorporating multiple processors. The method separates data independent operations from data dependent (sequential) operations wherein multiprocessing may be efficiently utilized for processing data independent macroblocks. The method preferably makes an assumption as to prediction direction within the set of data dependent operations. A prediction determination is then made and the assumption corrected if necessary with a transposition within the data independent operations operating on the macroblocks. The method reduces the computational overhead and provides for efficiently segmenting operations within a multiprocessing decoder.
    Type: Application
    Filed: June 23, 2005
    Publication date: October 27, 2005
    Inventors: Jeongnam Youn, Takao Yamazaki
  • Publication number: 20050214888
    Abstract: The present invention identified OVARC1000473 (SEQ ID NO: 1) and NT2RM1000377 (SEQ ID NO: 3) as clones showing suppression of CREB activation by forskolin, and provides evaluation methods using these genes, and/or proteins encoded by these genes. Furthermore, these proteins were found to enhance cell damage. Compounds that can be screened based on the evaluation methods of this invention are useful as agents for inhibiting the CREB dephosphorylation reaction, agents for suppressing enhancement of cell damage, and preventive and therapeutic agents for memory disorders and/or neurodegenerative disorders.
    Type: Application
    Filed: October 31, 2002
    Publication date: September 29, 2005
    Inventors: Masahiko Morita, Hiroyuki Arakawa, Mayako Yamazaki, Susumu Satoh, Shintaro Nishimura, Yasuhiro Kita, Takao Yamazaki
  • Patent number: 6949815
    Abstract: A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: September 27, 2005
    Assignee: NEC Corporation
    Inventors: Takao Yamazaki, Toru Mori, Akinobu Shibuya, Shintaro Yamamichi, Yuzo Shimada
  • Patent number: 6931061
    Abstract: An apparatus and method is described for performing texture-decoding within a video decoder processing a series of macroblocks within a video bit-stream. The inventive texture decoding is particularly well suited for implementation within decoders incorporating multiple processors. The method separates data independent operations from data dependent (sequential) operations wherein multiprocessing may be efficiently utilized for processing data independent macroblocks. The method preferably makes an assumption as to prediction direction within the set of data dependent operations. A prediction determination is then made and the assumption corrected if necessary with a transposition within the data independent operations operating on the macroblocks. The method reduces the computational overhead and provides for efficiently segmenting operations within a multiprocessing decoder.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: August 16, 2005
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Jeongnam Youn, Takao Yamazaki
  • Publication number: 20050075888
    Abstract: The largest absolute value (LAV) is determined within a group of data. Based on the LAV, a difference table is identified that is to be used for selecting an optimal Huffman codebook for the group of data. The difference table is associated with two Huffman codebooks. Further, one or more indexes are calculated for the group of data using an expression associated with the two Huffman codebooks, and a size difference value is determined for the group of data using the calculated indexes and the difference table. Based on the determined size difference value, the optimal Huffman codebook is selected from the above two codebooks.
    Type: Application
    Filed: September 29, 2003
    Publication date: April 7, 2005
    Inventors: Jeongnam Young, Sundararam Dwarakanath, Cheung Auyeung, Takao Yamazaki
  • Publication number: 20040135264
    Abstract: A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.
    Type: Application
    Filed: December 23, 2003
    Publication date: July 15, 2004
    Inventors: Takao Yamazaki, Toru Mori, Akinobu Shibuya, Shintaro Yamamichi, Yuzo Shimada
  • Publication number: 20040115920
    Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
    Type: Application
    Filed: August 21, 2003
    Publication date: June 17, 2004
    Applicant: NEC CORPORATION
    Inventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
  • Publication number: 20040091052
    Abstract: An apparatus and method is described for performing texture-decoding within a video decoder processing a series of macroblocks within a video bit-stream. The inventive texture decoding is particularly well suited for implementation within decoders incorporating multiple processors. The method separates data independent operations from data dependent (sequential) operations wherein multiprocessing may be efficiently utilized for processing data independent macroblocks. The method preferably makes an assumption as to prediction direction within the set of data dependent operations. A prediction determination is then made and the assumption corrected if necessary with a transposition within the data independent operations operating on the macroblocks. The method reduces the computational overhead and provides for efficiently segmenting operations within a multiprocessing decoder.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 13, 2004
    Applicants: SONY CORPORATION, SONY ELECTRONICS, INC.
    Inventors: Jeongnam Youn, Takao Yamazaki
  • Publication number: 20040076343
    Abstract: A method of generating a value for a missing pixel “x” by determining a “least harmful” local edge direction between pixels, or sub-pixels, on substantially opposing sides of the missing pixel, and interpolating the difference to arrive at a value for pixel “x”. The method involves generating sub-pixel values for locations within neighboring pixels, the sub-pixels may comprise half-pixels, quarter-pixels, three-quarter pixels, and so forth, wherein any fractional pixel quantity may be created. Absolute difference values are calculated between neighboring pixels, or sub-pixel values, to determine a least harmful local edge direction along which a value is generated for pixel “x” by interpolation.
    Type: Application
    Filed: October 18, 2002
    Publication date: April 22, 2004
    Applicant: SONY CORPORATION and SONY ELECTRONICS, INC.
    Inventors: Huipin Zhang, Cheung Auyeung, Takao Yamazaki