Abstract: A panel drive circuit having an input interface to which an image signal is input, a gamma correction circuit that corrects an image processing signal generated by an image processing circuit performing image processing on the image signal input to the input interface, such that a gamma correction signal thus generated has predetermined gamma characteristics, an unevenness correction circuit that corrects the gamma correction signal generated through the correction by the gamma correction circuit, based on correction data for reducing unevenness of a display panel, and an D/A convertor that has a variable output voltage range, and performs D/A conversion on an unevenness correction signal generated through the correction by the unevenness correction circuit and outputs the signal thus generated to the display panel, and the unevenness correction circuit changes the correction method according to the output voltage range of the D/A convertor.

Abstract: An unevenness correction data generation device suppressing the appearance of color unevenness when turning on R, G and B together includes a pattern generation unit causing red, green and blue images, in which display panel subpixels are turned on at the same gray level, to be displayed, a monochrome camera, a control unit generating first red, green and blue luminance correction data based on shooting data of the monochrome camera, a pattern generation unit causing the display panel to display a white image by causing red, green and blue images corrected with the respective luminance correction data to be displayed simultaneously, a color camera shooting the white image in color, and a control unit generating color correction data for correcting color unevenness based on shooting data of the color camera and generates unevenness correction data based on the red, green and blue luminance correction data and the color correction data.

Abstract: A terminal device 100 has a storage unit 180 storing a first personally identifiable information; and an operation unit 121 for inputting second personally identifiable information that is associated with the first personally identifiable information stored in the storage unit, that has lower specificity than the first personally identifiable information, and that can be browsed at a providing destination. The terminal device 100 provides the second personally identifiable information to the providing destination.

Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: A work machine includes a work unit, and an adjustment unit configured to adjust a working height of the work unit. The adjustment unit includes a lifting mechanism configured to lift and lower the work unit; a torque limiter configured to interrupt transmission of a driving force of a motor to the lifting mechanism when the work unit reaches an upper and lower limit positions; and a sensor. The torque limiter includes a transmission member provided to be displaceable between a transmission position at which the driving force is transmitted to the lifting mechanism and a non-transmission position at which the driving force is not transmitted to the lifting mechanism, and an elastic member configured to bias the transmission member to the transmission position. The sensor detects displacement of the transmission member.

Abstract: Provided is a functional unit for a bathroom that includes a functional component for a bathroom, separated from a water faucet device and fixed to a bathroom wall part; and a reforming unit that is formed integrally with the functional component for a bathroom and that includes a cartridge capable of reforming raw water flowing through a water supply passage from the water faucet device to a water discharge device. The reforming unit includes a casing that houses the cartridge, and the casing is detachably connected to the functional component.

Abstract: Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 ?m or less, and the solder material has a spherical diameter of 1 to 230 ?m and a sphericity of 0.95 or more.

Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Abstract: A waterproof sheet comprising a rubber base and a pressure-sensitive adhesive layer of silicone resin or gel thereon is applicable to the boundary between an outdoor tank and a concrete pedestal. The waterproof sheet maintains waterproofness over a long period of time and is in long-term service without degradation of physical properties.

Abstract: The present technology relates to a distance measuring apparatus, a distance measuring method, and a program that enable accurate measurement of the distance to a target.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Abstract: Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.

Abstract: Provided is a flux that can delay cured time of a resin within room temperature range and suppress the glass transition point of the resin from being reduced. The flux contains at least one species of ?-amino acid and ?-amino acid and a thermosetting resin wherein 1 part by weight or more and 30 parts by weight or less of ?-amino acid or ?-amino acid, or ?-amino acid and ?-amino acid are added for 100 parts by weight of the thermosetting agent.

Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.