Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

Abstract: Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.

Abstract: A water faucet includes a water faucet main body and a spout head detachably attached to the water faucet main body. The water faucet main body has a support column having a water path and a coupling pipe protruding in a radial direction of the support column. The spout head is attached to the water faucet main body in a state of accommodating the coupling pipe.

Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Abstract: A waterproof sheet comprising a rubber base and a pressure-sensitive adhesive layer of silicone resin or gel thereon is applicable to the boundary between an outdoor tank and a concrete pedestal. The waterproof sheet maintains waterproofness over a long period of time and is in long-term service without degradation of physical properties.

Abstract: A waterproof sheet comprising a rubber base and a pressure-sensitive adhesive layer of silicone resin or gel thereon is applicable to the boundary between an outdoor tank and a concrete pedestal. The waterproof sheet maintains waterproofness over a long period of time and is in long-term service without degradation of physical properties.

Abstract: Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 ?m or less, and the solder material has a spherical diameter of 1 to 230 ?m and a sphericity of 0.95 or more.

Abstract: Provided herein is a flux-coated ball having a ball-like joining material and a flux layer that covers a surface of the joining material. The flux layer is formed from high volatile flux solvent including ethyl acetate, acetone or methyl ethyl ketone. Thickness of the flux layer ranges from 2.5 ?m to 50 ?m. A diameter of the flux-coated ball is 600 ?m or less. A sphericity of the flux-coated ball is 0.9 or more.

Abstract: A mold for molding an expanded resin, wherein a silicone rubber layer (40) having a JIS-A hardness of 20 to 70 is formed as a heat-insulating layer at least on a part or the whole of the inner wall surface that forms a cavity (20) of a mold main body (10) which is for use in molding an expanded resin and which is made of an aluminum material. This mold for molding an expanded resin is effectively usable in molding expanded polystyrene or the like by a bead molding method, and can produce a molded product of an expanded resin with high thermal efficiency by virtue of high heat insulation performance. Further, the mold can be easily produced with good execution efficiency.

Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

Abstract: A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.

Abstract: Provided is flux composition which is capable of removing any metal oxide formed on a surface of aluminum and is unnecessary for washing any flux residues. The composition contains water-insoluble resin of 65 through 94 mass % as base material, at least amine of 3 through 22 mass %, and amine fluoride salt of 1 through 30 mass % as fluorine series activator, the amine fluoride salt being formed by reacting the amine with acid. It is preferable that the amine contains at least any one species of a pyridine derivative, an imidazole derivative, a guanidine derivative, ethylamine and picoperine. It is preferable to contain, as the amine fluoride salt, an amine compound containing any of the pyridine derivative, the imidazole derivative, the guanidine derivative, the ethylamine and the picoperine, and at least any one species of salt formed from any of hydrofluoric acid, fluoboric acid, hexafluorosilicic acid or amine-borontrifluoride complex.

Abstract: [Problems] Addition of an organic acid such as a dicarboxylic acid to a soldering flux in order to improve wettability causes a reaction with copper oxide to form a metallic soap of copper having a green color. Although this metallic soap of copper is not corrosive and does not decrease reliability, its external appearance is impossible to distinguish it from verdigris which is indicative of corrosion. There is need for a soldering flux which does not form a metallic soap of copper. [Means for Solving the Problems] Addition of a tetrazole or a tetrazole derivative to a soldering flux can prevent carboxyl groups from reacting exclusively with copper ions, thereby suppressing the formation of a metallic soap of copper having a green color.

Abstract: A decoding device that decodes demodulated data obtained by demodulating a quadrature modulated signal arising from digital modulation of a carrier and detects synchronization, the decoding device includes, a decoder configured to decode first demodulated data that is the demodulated data obtained by demodulating the quadrature modulated signal and is composed of in-phase axis data and quadrature axis data. The decoding device decodes second demodulated data obtained by interchanging the in-phase axis data and the quadrature axis data of the first demodulated data. A synchronization detector is configured to detect a boundary between predetermined information symbol sequences from first decoded data obtained by decoding the first demodulated data and detect the boundary from second decoded data obtained by decoding the second demodulated data. The synchronization detector selects and outputs one of the first decoded data and the second decoded data based on a result of the detection of the boundary.

Abstract: An apparatus includes a vector unit to process a vector data, a cache memory which includes a plurality of cache lines to store a plurality of divisional data being sent from a main memory, each of the divisional data of vector data having been divided according to a capacity of a cache line, and a cache controller to send all of the divisional data as the vector data to the vector unit after the cache lines have stored all of the divisional data including the vector data.

Abstract: A cleaning fluid comprising at least two components selected from organic acids, organic acid salts, electrolytes, alcohols, and water is safe. When the existing antifouling coating is to be overcoated or repaired, the surface of the existing coating is cleaned with the cleaning fluid so that a repair coating composition may strongly bond to the existing coating.

Abstract: A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.

Abstract: An apparatus includes a vector unit to process a vector data, a cache memory which includes a plurality of cache lines to store a plurality of divisional data being sent from a main memory, each of the divisional data of vector data having been divided according to a capacity of a cache line, and a cache controller to send all of the divisional data as the vector data to the vector unit after the cache lines have stored all of the divisional data including the vector data.

Abstract: Disclosed herein is a decoding device that decodes demodulated data obtained by demodulating a quadrature modulated signal arising from digital modulation of a carrier and detects synchronization, the decoding device including, a decoder configured to decode first demodulated data that is the demodulated data obtained by demodulating the quadrature modulated signal and is composed of in-phase axis data and quadrature axis data, and decode second demodulated data obtained by interchanging the in-phase axis data and the quadrature axis data of the first demodulated data, and a synchronization detector configured to detect a boundary between predetermined information symbol sequences from first decoded data obtained by decoding the first demodulated data and detect the boundary from second decoded data obtained by decoding the second demodulated data, the synchronization detector selecting and outputting one of the first decoded data and the second decoded data based on a result of the detection of the boundary.

Abstract: An apparatus includes a queue element which stores a plurality of memory access requests to be issued to a memory device, the memory access requests including a store request and a load request, and a controller which changes an order of the store and load requests so that the order includes a string of the store requests and a string of the load requests.