Abstract: Predictive management of a network buffer is contemplated. The network buffer maybe predictively managed to control packet drop based at least in part on predicted sojourn time. The predicted sojourn time may be determined to predict time needed from an arriving packet to travel through a queue of the network buffer.

Abstract: There is provided a method of fabricating a semiconductor device by performing a process on a substrate, which includes: forming a masking film made of a polymer having a urea bond by supplying polymerizing raw materials to a surface of the substrate on which an etching target film formed; forming an etching pattern on the masking film; subsequently, etching the etching target film with a processing gas using the etching pattern; and subsequently, removing the masking film by heating the substrate to depolymerize the polymer.

Abstract: The first apparatus (2100) computes an determination accuracy representing a probability that it is correct to use, as a determination result, the first result. The first apparatus (2100) outputs the first result as the determination result in a case where the determination accuracy is greater than a first threshold value, and outputs a second result as the determination result in a case where the determination accuracy is smaller than a second threshold value. In a case where the determination accuracy is equal to or greater than the second threshold value and is equal to or smaller than the first threshold value, the first apparatus (2100) requests the second apparatus (2200) to perform the predefined determination on the determination target. The first apparatus (2100) updates at least one of the first threshold value and the second threshold value based on the determination result output by the second apparatus (2200).

Abstract: There is provided a method of fabricating a semiconductor device by performing a process on a substrate, which includes: forming a masking film made of a polymer having a urea bond by supplying polymerizing raw materials to a surface of the substrate on which an etching target film formed; forming an etching pattern on the masking film; subsequently, etching the etching target film with a processing gas using the etching pattern; and subsequently, removing the masking film by heating the substrate to depolymerize the polymer.

Abstract: There is provided a method of fabricating a semiconductor device by performing a process on a substrate, which includes: forming a masking film made of a polymer having a urea bond by supplying polymerizing raw materials to a surface of the substrate on which an etching target film formed; forming an etching pattern on the masking film; subsequently, etching the etching target film with a processing gas using the etching pattern; and subsequently, removing the masking film by heating the substrate to depolymerize the polymer.

Abstract: A method includes a step of performing a selective catalyst treatment by supplying a catalyst solution to an upper surface of an exposed interconnection layer forming a step portion of a stepped shape formed by pair layers stacked to form the stepped shape, the pair layer including an interconnection layer formed on an insulating layer, and a step of selectively growing a metal layer by performing electroless plating on the upper surface of the interconnection layer on which the catalyst treatment is performed.

Abstract: Predictive management of a network buffer is contemplated. The network buffer maybe predictively managed to control packet drop based at least in part on predicted sojourn time. The predicted sojourn time may be determined to predict time needed from an arriving packet to travel through a queue of the network buffer.

Abstract: Predictive management of a network buffer is contemplated. The network buffer maybe predictively managed to control packet drop based at least in part on predicted sojourn time. The predicted sojourn time may be determined to predict time needed from an arriving packet to travel through a queue of the network buffer.

Abstract: There is provided a method of manufacturing a semiconductor device, which includes: supplying a raw material for polymerization to a porous low dielectric constant film formed on a substrate for manufacturing a semiconductor device, and filling holes formed in the porous low dielectric constant film with a polymer having a urea bond; subsequently, forming a pattern mask for etching on a surface of the porous low dielectric constant film; subsequently, etching the porous low dielectric constant film; subsequently, removing the pattern mask; and heating the substrate to depolymerize the polymer.

Abstract: There is provided a method of manufacturing a semiconductor device, which includes: supplying a raw material for polymerization to a porous low dielectric constant film formed on a substrate for manufacturing a semiconductor device, and filling holes formed in the porous low dielectric constant film with a polymer having a urea bond; subsequently, forming a pattern mask for etching on a surface of the porous low dielectric constant film; subsequently, etching the porous low dielectric constant film; subsequently, removing the pattern mask; and heating the substrate to depolymerize the polymer.

Abstract: There is provided a method of fabricating a semiconductor device by performing a process on a substrate, which includes: forming a masking film made of a polymer having a urea bond by supplying polymerizing raw materials to a surface of the substrate on which an etching target film formed; forming an etching pattern on the masking film; subsequently, etching the etching target film with a processing gas using the etching pattern; and subsequently, removing the masking film by heating the substrate to depolymerize the polymer.

Abstract: Predictive management of a network buffer is contemplated. The network buffer maybe predictively managed to control packet drop based at least in part on predicted sojourn time. The predicted sojourn time may be determined to predict time needed from an arriving packet to travel through a queue of the network buffer.

Abstract: Predictive management of a network buffer is contemplated. The network buffer maybe predictively managed to control packet drop based at least in part on predicted sojourn time. The predicted sojourn time may be determined to predict time needed from an arriving packet to travel through a queue of the network buffer.

Abstract: The present invention provides an exposure apparatus which transfers a pattern of a reticle onto a substrate, including a stage configured to place the reticle, a holding mechanism configured to hold the reticle placed on the stage, a driving unit configured to drive the stage, a determination unit configured to determine a feature including at least one of a type or shape of the reticle placed on the stage, and a decision unit configured to decide, based on the feature determined by the determination unit, at least one of a holding state of the reticle held by the holding mechanism, or control regarding driving of the stage.

Abstract: An etching method for anisotropically etching a Cu film on a substrate surface includes providing a substrate having a Cu film on a surface thereof in a chamber and supplying an organic compound into the chamber while setting the inside of the chamber to a vacuum state and irradiating an oxygen gas cluster ion beam to the Cu film. The etching method further includes oxidizing Cu or the Cu film to a copper oxide by oxygen gas cluster ions in the oxygen gas cluster ion beam and anisotropically etching the Cu film by reacting the copper oxide and the organic compound.

Abstract: Disclosed is method of manufacturing a semiconductor device. The method includes: forming an insulating film on one side of a substrate; forming a carbon film on the insulating film formed in the forming of the insulating film; forming an insulating film-carbon film laminate including a plurality of insulating films and carbon films alternately laminated on the one side of the substrate, by repeating the forming of the insulating film and the forming of the carbon film multiple times; removing the carbon films included in the insulating film-carbon film laminate; and forming electrode films in regions from which the carbon films are removed in the removing of the carbon films to obtain an insulating film-electrode film laminate in which the insulating films and the electrode films are laminated in a plurality of layers.

Abstract: A solar cell module includes a solar cell module body (11), an adhesive (30), and a support rail (12) bonded and fixed by the adhesive (30) to a back surface of the solar cell module body (11), in which a spacer member (40) for ensuring the thickness of the adhesive (30) is arranged between the back surface of the solar cell module body (11) and an adhesive surface (12a1) of the support rail (12).

Abstract: A substrate 1 for a photoelectric conversion device includes a first transparent conductive layer 5 formed on at least a part of the surface region of a transparent substrate 3, the first transparent conductive layer 5 having at least an opening portion 7 exposing the substrate 3.

Abstract: A method for manufacturing semiconductor device includes preparing a structure including a substrate, an insulating layer on the substrate and having a recess, a barrier film on the insulating layer, and a copper film on the barrier such that the copper film is filling the recess with the barrier between the insulating layer and copper film, removing the copper film down to interface with the barrier such that copper wiring is formed in the recess, etching the wiring such that surface of the wiring is recessed from surface of the insulating layer, and removing the barrier from the surface of the insulating layer such that the surface of the insulating layer is exposed. The etching includes positioning the structure removed down to the barrier in organic compound atmosphere having vacuum state, and irradiating oxygen gas cluster ion beam on the surface of the wiring to anisotropically etch the wiring.

Abstract: The present invention provides an exposure apparatus which transfers a pattern of a reticle onto a substrate, including a stage configured to place the reticle, a holding mechanism configured to hold the reticle placed on the stage, a driving unit configured to drive the stage, a determination unit configured to determine a feature including at least one of a type or shape of the reticle placed on the stage, and a decision unit configured to decide, based on the feature determined by the determination unit, at least one of a holding state of the reticle held by the holding mechanism, or control regarding driving of the stage.