Pump mount base for vacuum compression apparatus
Latest Ebara Corporation Patents:
- Substrate processing apparatus
- Damper control system and damper control method
- Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
- Polishing apparatus having surface-property measuring device of polishing pad and polishing system
- POLISHING APPARATUS
The dashed lines depict environmental subject matter only and form no part of the claimed design.
Claims
The ornamental design for a pump mount base for vacuum compression apparatus, as shown and described.
D296075 | June 7, 1988 | Jones |
D380479 | July 1, 1997 | Cantley et al. |
D490820 | June 1, 2004 | Schoemneyr |
D537453 | February 27, 2007 | Chu |
D537839 | March 6, 2007 | Bruno et al. |
D537844 | March 6, 2007 | Chu |
D541815 | May 1, 2007 | Drummond, Jr. |
D563435 | March 4, 2008 | Charlet |
2007-231935 | September 2007 | JP |
2007/088989 | August 2007 | WO |
Type: Grant
Filed: Jan 10, 2008
Date of Patent: Dec 21, 2010
Assignee: Ebara Corporation (Tokyo)
Inventors: Kensuke Fujita (Tokyo), Takashi Hozumi (Tokyo)
Primary Examiner: Ralf Seifert
Attorney: Sughrue Mion, PLLC
Application Number: 29/302,093