Abstract: A radio-frequency module includes a module substrate, an inductor, and an acoustic wave filter. The inductor overlaps at least a portion of the acoustic wave filter when seen in a plan view from the normal direction of the module substrate. The inductor includes first and second coils connected in series. Each of the first and second coils is a spiral or helical coil that is wound with more than one turn. At least a portion of the first coil overlaps the second coil when seen in a plan view from the normal direction of the module substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.

Abstract: A conveyance system according to the present disclosure includes a conveyance request receiver that receives the conveyance requests of the conveyance targets, a starting area selector that selects a starting area from among the partial areas, a partial area traveling order setter that sets the starting area to one of the partial areas to be traveled first and sets partial area traveling order for traveling of an automatic conveyance apparatus, and a storage position traveling order setter that sets storage position traveling order of the automatic conveyance apparatus inside each of the partial areas. The automatic conveyance apparatus travels the partial areas in accordance with the partial area traveling order and travels the storage positions in accordance with the storage position traveling order inside each of the partial areas so as to convey the conveyance targets corresponding to the received conveyance requests inside the entire area.

Abstract: A duplexer includes a piezoelectric substrate including an upper surface and a lower surface, a functional element on the lower surface, a flat plate electrode on a side of the upper surface of the piezoelectric substrate, and a dielectric portion that is located between the functional element and the flat plate electrode and has a permittivity lower than a permittivity of the piezoelectric substrate.

Abstract: An acoustic wave module includes a hollow space defined by first and second piezoelectric bodies, a support layer, and a first functional element. A second functional element and a shield layer are disposed in the hollow space. The shield layer includes first and second layers disposed on the first functional element side and a second layer disposed on the second functional element side. The second layer adds, to the first layer, a force that causes the first layer to warp so that the first layer at a peripheral end portion and a peripheral end portion approaches the first functional element.

Abstract: A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween. An outer surface of the first region and an outer surface of the first electronic component have a step difference therebetween in a height direction of the structural body. The connection pad is on the outer surface of the first region, an outer surface of the first electronic component, and a step-difference surface of a portion of the step difference.

Abstract: A component comprising a core part and a surface layer is provided. The core part contains C: 0.01%? and <0.20%, Si: ?1.0%, Mn: 1.5%? and ?3.0%, P: 0.02% or less, S: ?0.06%, Cr: 0.30%? and ?3.0%, Mo: 0.005%? and ?0.40%, V: 0.02%? and ?0.5%, Nb: 0.003%? and ?0.20%, Al: 0.010%? and ?2.0%, Ti: 0.005%< and <0.025%, N: ?0.0200%, Sb: 0.0005%? and ?0.02%, and the balance consisting of Fe and incidental impurities; and a steel microstructure that contains bainite phase in an area ratio of more than 50%. The surface layer has high nitrogen and carbon contents relative to the chemical composition of the core part.

Abstract: A method of manufacturing an electronic component module includes a sacrificial-body arrangement step of disposing a sacrificial body on a first principal surface of a support, the support including the first principal surface and a second principal surface, the sacrificial body being smaller than the first principal surface when viewed in a thickness direction of the support, a resin molding step of molding a resin structure on the first principal surface so as to cover the sacrificial body disposed on the first principal surface, a recess forming step of forming a recess in the resin structure by removing the sacrificial body, a wiring-layer forming step of forming a wiring layer on a side surface of the recess and on a principal surface of the resin structure, the principal surface connecting with the side surface, and a component mounting step of mounting an electronic component in the recess.

Abstract: A transport system includes: a reception processor that receives a transport request to transport a first picking object corresponding to a first automatic transport device; and a determination processor that determines a destination of the first automatic transport device based on the number of automatic transport devices present in a first picking area that includes a first picking location for the first picking object and space availability at one or more picking locations in the first picking area.

Abstract: An electronic device includes a substrate, a base substrate, a metal connection body, a support body, a metal body, and a via. The substrate includes one main surface with a functional element and is a piezoelectric substrate or a compound semiconductor substrate. The substrate is mounted on the base substrate such that the one main surface faces the base substrate. The metal body is in contact with the support body and includes at least a portion extending to outside the substrate in plan view from the support body. The via connects the portion of the metal body outside the substrate and the base substrate to each other and has a higher thermal conductivity than the substrate.

Abstract: An electronic device includes a substrate, a support body, and a conductive film. The substrate is a piezoelectric substrate or a compound semiconductor substrate including a first main surface with functional elements. The support body is provided at a second main surface of the substrate opposite to the first main surface and has a higher thermal conductivity than the substrate. The conductive film is located in a through hole extending through the support body and has a higher thermal conductivity than the support body.

Abstract: An electronic device includes a substrate, a base substrate, a metal connection body, a metal body, and a via. The substrate includes a first main surface provided with functional elements and is a piezoelectric substrate or a compound semiconductor substrate. The substrate is mounted on the base substrate such that a second main surface of the substrate opposite to the one main surface faces the base substrate. The metal body is provided at the first main surface of the substrate and includes at least a portion that extends to outside the substrate in plan view from the one main surface. The via connects the portion of the metal body outside the substrate and the base substrate to each other and has a higher thermal conductivity than the substrate.

Abstract: The present invention provides a connector that can be easily and properly connected to a sheet-like electrically conductive member that is provided with a plurality of electrically conductive portions arranged at different height positions in the thickness direction. A connector 1 includes a plurality of contacts 2, a body housing 5 that holds the contacts 2, and a cover housing 7 that is attached to the body housing 5. The body housing 5 has a plurality of holding portions 51 that hold the contacts 2. The holding portions 51 are provided in the body housing 5 so as to hold the contacts 2 at different height positions in the thickness direction of the body housing 5. A plurality of electrically conductive portions 101 come into contact with the contacts 2 in a state where an electrically conductive member 100 is sandwiched between the cover housing 7 and the body housing 5.

Abstract: An elastic wave device includes a plate-shaped elastic wave element and a resin structure including a high elastic modulus resin portion and low elastic modulus resin portions. The low elastic modulus resin portions are provided in regions of side surfaces of an elastic wave element substrate, which extend from end portions at an IDT electrode formation surface side and do not reach a surface at a side opposite to an IDT electrode formation surface, and a remaining resin portion of a portion of the resin structure, which contacts with the side surfaces of the elastic wave element substrate, is the high elastic modulus resin portion.

Abstract: A high-frequency module includes a semiconductor element, a first insulating layer, an acoustic wave element, a second insulating layer, a first intermediate layer, and a second intermediate layer. The first intermediate layer is interposed between the acoustic wave element and the semiconductor element, and has a thermal conductivity lower than the first and second insulating layers. The second intermediate layer is interposed between the first insulating layer and the second insulating layer, and has a thermal conductivity lower than the first and second insulating layers. A step is provided between a first principal surface of the first insulating layer and one principal surface of the semiconductor element. The distance between first and second principal surfaces of the first insulating layer is greater than the distance between the second principal surface of the first insulating layer and the one principal surface of the semiconductor element.

Abstract: A radio-frequency module includes a module substrate, an inductor, and an acoustic wave filter. The inductor overlaps at least a portion of the acoustic wave filter when seen in a plan view from the normal direction of the module substrate. The inductor includes first and second coils connected in series. Each of the first and second coils is a spiral or helical coil that is wound with more than one turn. At least a portion of the first coil overlaps the second coil when seen in a plan view from the normal direction of the module substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.

Abstract: Provided is a steel component with excellent surface fatigue strength. The steel component has a nitride compound layer with a thickness of 5.0 ?m to 30.0 ?m and a hardened layer in an order from a component surface to a component inside, where a thickness of a porous layer on an outermost surface of the nitride compound layer is 3.0 ?m or less and 40.0% or less of a thickness of the nitride compound layer, and the hardened layer has a hardness of HV600 or more at a position of 50 ?m inward from the component surface, a hardness of HV400 or more at a position from the component surface to the component inside of 400 ?m, and a hardness of HV250 or more at a position from the component surface to the component inside of 600 ?m.

Abstract: An acoustic wave device includes an acoustic wave element substrate, filter electrodes on a first surface of the acoustic wave element substrate, a first insulator layer covering a second surface of the acoustic wave element substrate, and a second insulator layer laminated on the first insulator layer and sandwiching the first insulator layer between the second insulator layer and the acoustic wave element substrate. The products of propagation speeds of an acoustic wave in those layers and densities of those layers satisfy a predetermined relationship.

Abstract: Provided is steel for nitrocarburizing with excellent surface fatigue strength. The steel has a nitride compound layer with a thickness of 5.0 ?m to 30.0 ?m and a hardened layer in an order from a steel surface to steel inside, where a thickness of a porous layer on an outermost surface of the compound layer is 3.0 ?m or less and 40.0% or less of a compound layer's thickness, the hardened layer has hardness of HV600 or more, HV400 or more and HV250 or more at 50 ?m inward from the steel surface, from the steel surface to the steel inside of 400 ?m, and from the steel surface to the steel inside of 600 ?m, respectively, an unhardened portion excluding the compound and hardened layers has a predetermined chemical composition, and the hardened layer has a chemical composition with a higher N content than the unhardened portion.

Abstract: It is a composition comprising young barley grass, used for promoting salivary IgA secretion, maintaining or improving oral immune function, or mucosal immune function, or preventing or alleviating upper airway infection.

Abstract: A lens barrel has at least one movable lens group that can move in one direction and the other direction along the optical axis, the lens barrel comprising: a movable lens frame; a voice coil motor for driving a movable lens group and the movable lens frame along the optical axis; and a stopper mechanism brought into contact with the movable lens frame. The stopper mechanism includes a stopper member that moves between a retracted position where the stopper member does not touch the movable lens frame when the voice coil motor is energized, and an abutting position where the stopper member is brought into contact with the movable lens frame when the voice coil motor is not energized.