Abstract: To provide a technology for sintering calcium phosphate to manufacture a calcium phosphate sintered body and suppressing generation of calcium oxide when calcium phosphate is sintered, there is provided a process for manufacturing a sintered calcium phosphate molded body is characterized by including a step for heating a composition containing at least a composite of calcium phosphate fine particles and polyether and sintering the calcium phosphate fine particles.

Abstract: A component comprising a core part and a surface layer is provided. The core part contains C: 0.01%? and <0.20%, Si: ?1.0%, Mn: 1.5%? and ?3.0%, P: 0.02% or less, S: ?0.06%, Cr: 0.30%? and ?3.0%, Mo: 0.005% ? and ?0.40%, V: 0.02% ? and ?0.5%, Nb: 0.003% ? and ?0.20%, Al: 0.010%? and ?2.0%, Ti: 0.005%< and <0.025%, N: <0.0200%, Sb: 0.0005% ? and ?0.02%, and the balance consisting of Fe and incidental impurities; and a steel microstructure that contains bainite phase in an area ratio of more than 50%. The surface layer has high nitrogen and carbon contents relative to the chemical composition of the core part.

Abstract: A lens barrel has at least one movable lens group that can move in one direction and the other direction along the optical axis, the lens barrel comprising: a movable lens frame; a voice coil motor for driving a movable lens group and the movable lens frame along the optical axis; and a stopper mechanism brought into contact with the movable lens frame. The stopper mechanism includes a stopper member that moves between a retracted position where the stopper member does not touch the movable lens frame when the voice coil motor is energized, and an abutting position where the stopper member is brought into contact with the movable lens frame when the voice coil motor is not energized.

Abstract: An electronic component includes a piezoelectric substrate, a functional electrode on the piezoelectric substrate, a support layer on the piezoelectric substrate, a cover layer on the support layer, the cover layer, the support layer, and the piezoelectric substrate defining a hollow space that the functional electrode faces, and connection terminals that are electrically connected to the functional electrode, that are each made from a metal particle aggregate, and that each have a porous structure. The connection terminals are each located at a position in which the connection terminals overlap at least a portion of the hollow space in plan view.

Abstract: An electronic device includes a first substrate having a wiring trace, a second substrate having an external terminal, a first electronic component disposed on a first surface of the first substrate, a second electronic component electrically connected to the first electronic component and disposed on a second surface of the first substrate, a mold layer encapsulating the first electronic component, and a conductive member disposed in the mold layer. The conductive member electrically connects the first substrate to the second substrate. A step is formed at an end of the mold layer, and the conductive member is exposed at the step. A distance between the first substrate and the second substrate is smaller than a distance between the first surface of the first substrate and a surface of the first electronic component that is positioned opposite to the first substrate.

Abstract: An electronic component device includes an electronic component embedded in a resin structure and including a portion exposed on a first main surface of the resin structure, first wiring lines extending from the first main surface of the resin structure to the electronic component and electrically connected to the electronic component, second wiring lines on a side of a second main surface of the resin structure and electrically connected to respective connection electrodes that are electrically connected to the first wiring lines, and low-elastic modulus layers at a height position between the first wiring lines and the exposed portion of the electronic component in respective regions in which the first wiring lines straddle boundaries between the resin structure and the electronic component, having elastic moduli lower than those of the first wiring lines, and made of a conductive material.

Abstract: A high manganese content deformed reinforcing bar having an austenite single phase microstructure has excellent bending workability. A deformed reinforcing bar includes a chemical composition containing, in mass %, C: 0.7% or more and 1.2% or less, Si: 1.0% or less, Mn: 9% or more and 15% or less, Cr: 1.0% or less, P: 0.03% or less, and S: 0.05% or less, the balance consisting of Fe and inevitable impurities; and a microstructure comprising an austenite single phase. The ratio of the difference between the maximum and minimum hardness at a periphery of a cross-section perpendicular to the longitudinal direction with respect to a central average hardness is 15% or less. Two or more ribs extend in the longitudinal direction at equal intervals in a cross-sectional circumferential direction. The ratio of the difference between the maximum and minimum width of the ribs to the minimum width is 50% or less.

Abstract: A method for manufacturing an elastic wave device includes successively stacking conductive films on a piezoelectric substrate on which a pattern of a first resist has been formed, removing the first resist from the piezoelectric substrate on which the conductive films have been stacked; applying a second resist to the piezoelectric substrate from which the first resist has been removed and subjecting the second resist to exposure and development, thus forming a protective layer that protects a first region with the second resist, and etching the second conductive material in a state in which the first region is protected by the protective layer.

Abstract: A manufacturing method for an electronic component includes forming an electrically conductive pillar on a surface of a support, forming an intermediate layer covering a side surface of the pillar, forming a conductor layer covering a side surface of the intermediate layer, and molding a resin structure covering a side surface of the conductor layer.

Abstract: An electronic component module includes an electronic component, a resin structure, a wiring portion, and a shield portion. The resin structure covers a second main surface and at least a portion of a side surface of the electronic component. The wiring portion is electrically connected to the electronic component. The shield portion includes a first conductor layer and a second conductor layer. The first conductor layer is spaced away from the electronic component between the electronic component and the resin structure, and has electrical conductivity. The second conductor layer is spaced away from the wiring portion between the wiring portion and the resin structure, and has electrical conductivity. In the shield portion, the first conductor layer and the second conductor layer are integrated.

Abstract: An elastic wave device includes a substrate including a piezoelectric film, a first IDT electrode, a first external electrode, and a first through via electrode. The first IDT electrode is provided on a first main surface of the substrate and includes a first busbar and first electrode fingers extending from the first busbar. The first external electrode is provided on a second main surface of the substrate. The first through via electrode penetrates the substrate from the first main surface to the second main surface and electrically connects the first IDT electrode and the first external electrode to each other. At least a portion of the first through via electrode overlaps the first busbar in a plan view from the first main surface side and is disposed below the first busbar.

Abstract: Provided is a steel for nitrocarburizing that can ensure hardened case depth by suppressing precipitation of Cr, V, and Nb in a part of the surface layer very close to the surface. The provided steel comprises: a specific chemical composition satisfying 9.5?([Cr]/52+[V]/50.9+[Nb]/92.9+M)×103?18.5, with the balance being Fe and inevitable impurities; and a steel microstructure in which an area ratio of bainite phase with respect to the entire microstructure is more than 50%.

Abstract: An electronic component module includes an electronic component, a structure body, a through wiring, and an insulator. The structure body covers at least a portion of the electronic component and has conductivity. The through wiring extends through the structure body. The insulator is disposed at least between the through wiring and the structure body.

Abstract: An electronic component module includes an electronic component, a resin structure body, a through wiring, a wiring layer, and a close-contact layer. The resin structure body covers at least a portion of the electronic component. The through wiring extends through the resin structure body. The wiring layer electrically connects the electronic component and the through wiring to each other. The close-contact layer is provided between the resin structure body and the through wiring and is in contact with the resin structure body and the through wiring. The close-contact layer includes an inorganic insulation film.

Abstract: A mechanical structural component is a toothed component obtained by performing cold forging and carburizing treatment on a steel having a predetermined chemical composition, in prior austenite grains after the carburizing treatment, an area ratio of crystal grains of 50 ?m or less is 80% or more, and an area ratio of crystal grains exceeding 300 ?m is 10% or less, and a total helix deviation of teeth after the carburizing treatment satisfies Formula (1) (Bmax/L)×103?5??(1) where Bmax is a maximum total helix deviation in all teeth in mm, and L is a face width in mm.

Abstract: An acoustic wave device includes a first acoustic wave element including a first substrate having piezoelectricity at least in a portion thereof, a first functional electrode provided on a first surface of the first substrate, and a first wiring conductor electrically connected to the first functional electrode. The first acoustic wave element further includes a relay electrode on the first surface of the first substrate and electrically connected to a second wiring conductor, and a ground electrode on the first surface of the first substrate and electrically connected to the first functional electrode. The ground electrode is between at least one of the first functional electrode and the first wiring conductor, and the relay electrode, and is electrically insulated from the relay electrode.

Abstract: A piezoelectric device includes a first piezoelectric substrate, a second piezoelectric substrate and an adhesive layer. First conductor patterns are provided on a front surface of the first piezoelectric substrate. A first piezoelectric element is defined by the first conductor patterns. Second conductor patterns are provided on a front surface of the second piezoelectric substrate. A second piezoelectric element is provided of these patterns. The adhesive layer adheres a rear surface of the first piezoelectric substrate and a rear surface of the second piezoelectric substrate to each other. The adhesive layer adheres the first and second substrates to each other such that a compressive stress is applied to the first and second piezoelectric substrates in a bonded state.

Abstract: An electronic component module includes an electronic component, a resin structure, a through wire, and a wiring layer. The resin structure covers at least a portion of the electronic component. The through wire extends through the resin structure in a predetermined direction. The wiring layer electrically connects the electronic component to the through wire. The wiring layer includes a portion located between the electronic component and the through wire in plan view in the predetermined direction. The wiring layer has a protruding portion. The protruding portion protrudes in the predetermined direction between the electronic component and the through wire.

Abstract: In a method for manufacturing a piezoelectric device while stably achieving strong bonding, a moisture-absorbing layer is formed on a bonding surface side of a piezoelectric single-crystal substrate. The moisture-absorbing layer is allowed to absorb moisture. A binder layer is formed on a bonding surface side of a supporting substrate. The moisture-absorbing layer is placed on the binder layer. A silica precursor in the binder layer is converted into silica through a hydrolysis reaction with moisture in the moisture-absorbing layer.

Abstract: In a method of manufacturing a piezoelectric device, among a +C plane on a +Z axis side of a piezoelectric thin film and a ?C plane on a ?Z axis side of the piezoelectric thin film, the ?C plane on the ?Z axis side of the piezoelectric thin film is etched. Thus, ?Z planes of the piezoelectric thin film on which epitaxial growth is possible are exposed. Ti is epitaxially grown on the ?Z planes of the piezoelectric thin film in the ?Z axis direction such that the crystal growth plane thereof is parallel to the ?Z planes of the piezoelectric thin film. Al is then epitaxially grown on the surface of the Ti electrode in the ?Z axis direction such that the crystal growth plane thereof is parallel to the ?Z planes of the piezoelectric thin film.