Abstract: A method of manufacturing a core product includes injecting molten resin into a resin injection portion provided in a core body so as to extend in a longitudinal direction of the core body, and forming a core product by welding the core body. A buffer region is set between the resin injection portion and a periphery of the core body in a lateral direction of the core body. The core product is formed by welding the core body so that a weld bead formed on the core body is prohibited from reaching the buffer region, and so that the weld bead is spaced apart from the resin injection portion in the lateral direction of the core body.

Abstract: A method of manufacturing a rotating body includes disposing an end plate on an end surface of the core body in a height direction, and forming the rotating body by welding the end plate and the core body together. The rotating body is formed by welding the end plate and the core body together while a temperature of the core body and the end plate is within a predetermined operational a temperature range associated with rotation of the rotating body in a manufactured state of operation.

Abstract: A case includes a terminal disposition portion which includes a disposition surface projecting from an inner wall surface toward an open area, exposes an exposure region on a front surface of an external connecting terminal, and embeds therein a rear surface of the external connecting terminal. In the case, at at least part of both sides along a pair of opposite sides of the exposure region, the disposition surface is located between the front surface and the rear surface to have a level difference to the front surface. In a semiconductor device with the above-described configuration, the case does not extend to the exposure region on the front surface of the external connecting terminal. Therefore, no encapsulation resin flows into an interfacial debonding gap between the external connecting terminal and the case, thus curbing further advance of the interfacial debonding.

Abstract: A screen printing apparatus includes an inspection region setter and an operation stop controller. The inspection region setter sets an inspection region in an inspection plane that intersects with a moving path of a mask until the mask positioned at a printing-job performing position moves to a mask shelter position by the moving mechanism. In addition, the inspection region setter excludes a passing region of the mask from the inspection region while the mask to be positioned at the mask shelter position passes over the inspection plane from the printing-job performing position.

Abstract: A semiconductor package is provided, including: a package body; and a plurality of lead terminals exposed from each of at least three side surfaces of the package body, wherein the plurality of lead terminals include: a plurality of lead terminals exposed from a first side surface, half or more of which have tips pointing in a direction along the first side surface; a plurality of lead terminals exposed from a second side surface, all of which have tips pointing in a direction along a direction orthogonal to the second side surface; and a plurality of lead terminals exposed from a third side surface, half or more of which have tips pointing in a direction along the third side surface, or all of which have tips pointing in a direction along a direction orthogonal to the third side surface.

Abstract: A tactile sensation providing system includes an electronic device and a tactile sensation providing apparatus, which includes a wearable part worn on fingers, vibrating elements disposed at portions corresponding to the fingers, sensors that detect touches of the fingers onto a manipulation input surface, and a second controlling part able to communicate with a first controlling part. Upon receiving from the second controlling part a signal representing that a touch of one finger is detected by one sensor, the first controlling part obtains, based on data representing the finger and on coordinates detected by a detector, a type of the finger touching the surface and the coordinates where the finger touches the surface, and generates a driving signal representing a tactile sensation corresponding to the data representing the finger, the coordinates, and a displayed image. The second controlling part drives one of the vibrating elements using the driving signal.

Abstract: In a semiconductor device, first to fourth circuit patterns are formed on an insulating substrate in a case. A first end of a first lead frame is connected via solder to the first circuit pattern and another end of the first lead frame extends outside from the case. In the same way, a first end of a second lead frame is connected via solder to the fourth circuit pattern and another end extends outside from a case. Portions of the second and third circuit patterns are covered by the first lead frame and are respectively buried by insulating layers. In addition, a semiconductor element is provided via solder on a region of the first lead frame above the first circuit pattern. Wires electrically connect the semiconductor element and a region of the second lead frame above the fourth circuit pattern.

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Abstract: A semiconductor package is provided, including: a package body; and a plurality of lead terminals exposed from each of at least three side surfaces of the package body, wherein the plurality of lead terminals include: a plurality of lead terminals exposed from a first side surface, half or more of which have tips pointing in a direction along the first side surface; a plurality of lead terminals exposed from a second side surface, all of which have tips pointing in a direction along a direction orthogonal to the second side surface; and a plurality of lead terminals exposed from a third side surface, half or more of which have tips pointing in a direction along the third side surface, or all of which have tips pointing in a direction along a direction orthogonal to the third side surface.

Abstract: A semiconductor device includes an insulating substrate having a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing. The circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern.

Abstract: A screen printing apparatus includes an inspection region setter and an operation stop controller. The inspection region setter sets an inspection region in an inspection plane that intersects with a moving path of a mask until the mask positioned at a printing-job performing position moves to a mask shelter position by the moving mechanism. In addition, the inspection region setter excludes a passing region of the mask from the inspection region while the mask to be positioned at the mask shelter position passes over the inspection plane from the printing-job performing position.

Abstract: An input apparatus includes a top panel having a manipulation input surface on which a manipulation input is performed; a pressure sensor having two terminals and configured to output a voltage in accordance with a pressure applied by the manipulation input on the manipulation input surface; a switch connected to the two terminals of the pressure sensor and configured to equalize electric potentials between the two terminals when the switch is turned on; and a controller configured to turn on the switch, after the pressure applied on the manipulation input surface is detected based on an output of the pressure sensor, when the manipulation input on the manipulation input surface is stopped or the output of the pressure sensor becomes equal to or less than a predetermined level that represents non-pressing.

Abstract: A tactile sensation providing system includes an electronic device and a tactile sensation providing apparatus, which includes a wearable part worn on fingers, vibrating elements disposed at portions corresponding to the fingers, sensors that detect touches of the fingers onto a manipulation input surface, and a second controlling part able to communicate with a first controlling part. Upon receiving from the second controlling part a signal representing that a touch of one finger is detected by one sensor, the first controlling part obtains, based on data representing the finger and on coordinates detected by a detector, a type of the finger touching the surface and the coordinates where the finger touches the surface, and generates a driving signal representing a tactile sensation corresponding to the data representing the finger, the coordinates, and a displayed image. The second controlling part drives one of the vibrating elements using the driving signal.

Abstract: In a semiconductor device, a first end of a first lead frame is connected via solder to a first circuit pattern and another end extends outside from a case. In the same way, a first end of a second lead frame is connected via solder to a third circuit pattern and another end extends outside from a case. Third and fourth circuit patterns that are covered by the first lead frame are respectively buried by insulating layers. In addition, a semiconductor element is provided via solder on a region of the first lead frame above the first circuit pattern. Wires electrically connect the semiconductor element and a region of the second lead frame above the third circuit pattern.

Abstract: An input apparatus includes a top panel having a manipulation input surface on which a manipulation input is performed; a pressure sensor having two terminals and configured to output a voltage in accordance with a pressure applied by the manipulation input on the manipulation input surface; a switch connected to the two terminals of the pressure sensor and configured to equalize electric potentials between the two terminals when the switch is turned on; and a controller configured to turn on the switch, after the pressure applied on the manipulation input surface is detected based on an output of the pressure sensor, when the manipulation input on the manipulation input surface is stopped or the output of the pressure sensor becomes equal to or less than a predetermined level that represents non-pressing.

Abstract: A semiconductor device includes an insulating substrate including a metal plate, an insulating plate, and a circuit plate laminated sequentially in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode provided on a surface of the semiconductor element, the circuit plate, or the electrode and the circuit plate; a plastic housing having a hollow shape to receive the insulating substrate, the semiconductor element, and the wiring member therein, the plastic housing having an inner frame on an inner surface and a step formed in a front end of the inner frame; and a sealing material made of a thermosetting resin to seal the insulating substrate, the semiconductor element, and the wiring member inside the plastic housing.

Abstract: A component mounting line has a screen printing apparatus and component mounting apparatuses. Each component mounting apparatus includes a first substrate carrying lane and a second substrate carrying lane, carries a first type substrate on which a first pattern has been printed in the first substrate carrying lane, performs a component mounting-relevant operation on the first type substrate, carries a second type substrate on which a second pattern has been printed in the second substrate carrying lane, and performs a component mounting-relevant operation on the second type substrate. The screen printing apparatus selects a type of the substrate to be carried in depending on whether a substrate is carried in the second component mounting apparatus downstream from the screen printing apparatus.

Abstract: A semiconductor device includes an insulating substrate having a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing. The circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern.

Abstract: A component mounting line has a screen printing apparatus and component mounting apparatuses. The screen printing apparatus carries in substrates based on substrate carrying-in order data which is determined so that alternate carrying-in in which a first type substrate and a second type substrate are alternately carried in and continuous carrying-in in which the first type substrate or the second type substrate which has a shorter line tact time is continuously carried in are mixed.

Abstract: A semiconductor device has an insulating substrate, a semiconductor element which is mounted on the insulating substrate, a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein, and a sealing material which is charged into the casing to seal the inside of the casing. The casing has protrusion portions each of which partially protrudes from an upper surface of the casing. Thus, it is possible to provide a semiconductor device in which poor external appearance or lowering of adhesion to a cover can be prevented even when a sealing material is injected up to the vicinity of an upper surface of a casing.