Abstract: A semiconductor device, including a substrate having a mounting area on a front surface thereof, a semiconductor chip disposed in the mounting area, and an exterior member having a bottom surface bonded to the front surface of the substrate, the exterior member continuously surrounding the mounting area in a loop shape in a plan view of the semiconductor device, to thereby enclose a housing space, the mounting area being in the housing space. The semiconductor device further includes a sealing material sealing the housing space.

Abstract: A computer is caused to perform processing of: detecting, in deep learning, a sign of a failure in learning in operations that are performed with a lower number of bits compared with operations that are performed with a certain number of bits; rolling back to an operation where the sign is detected and performing a recalculation by an operation with the certain number of bits; determining whether returning from operations with the certain number of bits to operations with the lower number of bits is allowed; and, when the returning to operations with the lower number of bits is allowed, switching to operations with the lower number of bits.

Abstract: A semiconductor module includes a semiconductor element made of a wide-bandgap semiconductor, the semiconductor element having an upper surface with an edge, a buffer member that covers the edge of the upper surface of the semiconductor element, and a sealing resin that seals the semiconductor element and the buffer member. The buffer member has a thickness equal to or larger than 50 ?m.

Abstract: A case includes a terminal disposition portion which includes a disposition surface projecting from an inner wall surface toward an open area, exposes an exposure region on a front surface of an external connecting terminal, and embeds therein a rear surface of the external connecting terminal. In the case, at at least part of both sides along a pair of opposite sides of the exposure region, the disposition surface is located between the front surface and the rear surface to have a level difference to the front surface. In a semiconductor device with the above-described configuration, the case does not extend to the exposure region on the front surface of the external connecting terminal. Therefore, no encapsulation resin flows into an interfacial debonding gap between the external connecting terminal and the case, thus curbing further advance of the interfacial debonding.

Abstract: A case includes a terminal disposition portion which includes a disposition surface projecting from an inner wall surface toward an open area, exposes an exposure region on a front surface of an external connecting terminal, and embeds therein a rear surface of the external connecting terminal. In the case, at at least part of both sides along a pair of opposite sides of the exposure region, the disposition surface is located between the front surface and the rear surface to have a level difference to the front surface. In a semiconductor device with the above-described configuration, the case does not extend to the exposure region on the front surface of the external connecting terminal. Therefore, no encapsulation resin flows into an interfacial debonding gap between the external connecting terminal and the case, thus curbing further advance of the interfacial debonding.

Abstract: A screen printing apparatus includes an inspection region setter and an operation stop controller. The inspection region setter sets an inspection region in an inspection plane that intersects with a moving path of a mask until the mask positioned at a printing-job performing position moves to a mask shelter position by the moving mechanism. In addition, the inspection region setter excludes a passing region of the mask from the inspection region while the mask to be positioned at the mask shelter position passes over the inspection plane from the printing-job performing position.

Abstract: A semiconductor package is provided, including: a package body; and a plurality of lead terminals exposed from each of at least three side surfaces of the package body, wherein the plurality of lead terminals include: a plurality of lead terminals exposed from a first side surface, half or more of which have tips pointing in a direction along the first side surface; a plurality of lead terminals exposed from a second side surface, all of which have tips pointing in a direction along a direction orthogonal to the second side surface; and a plurality of lead terminals exposed from a third side surface, half or more of which have tips pointing in a direction along the third side surface, or all of which have tips pointing in a direction along a direction orthogonal to the third side surface.

Abstract: A tactile sensation providing system includes an electronic device and a tactile sensation providing apparatus, which includes a wearable part worn on fingers, vibrating elements disposed at portions corresponding to the fingers, sensors that detect touches of the fingers onto a manipulation input surface, and a second controlling part able to communicate with a first controlling part. Upon receiving from the second controlling part a signal representing that a touch of one finger is detected by one sensor, the first controlling part obtains, based on data representing the finger and on coordinates detected by a detector, a type of the finger touching the surface and the coordinates where the finger touches the surface, and generates a driving signal representing a tactile sensation corresponding to the data representing the finger, the coordinates, and a displayed image. The second controlling part drives one of the vibrating elements using the driving signal.

Abstract: In a semiconductor device, first to fourth circuit patterns are formed on an insulating substrate in a case. A first end of a first lead frame is connected via solder to the first circuit pattern and another end of the first lead frame extends outside from the case. In the same way, a first end of a second lead frame is connected via solder to the fourth circuit pattern and another end extends outside from a case. Portions of the second and third circuit patterns are covered by the first lead frame and are respectively buried by insulating layers. In addition, a semiconductor element is provided via solder on a region of the first lead frame above the first circuit pattern. Wires electrically connect the semiconductor element and a region of the second lead frame above the fourth circuit pattern.

Abstract: A semiconductor package is provided, including: a package body; and a plurality of lead terminals exposed from each of at least three side surfaces of the package body, wherein the plurality of lead terminals include: a plurality of lead terminals exposed from a first side surface, half or more of which have tips pointing in a direction along the first side surface; a plurality of lead terminals exposed from a second side surface, all of which have tips pointing in a direction along a direction orthogonal to the second side surface; and a plurality of lead terminals exposed from a third side surface, half or more of which have tips pointing in a direction along the third side surface, or all of which have tips pointing in a direction along a direction orthogonal to the third side surface.

Abstract: A semiconductor device includes an insulating substrate having a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing. The circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern.

Abstract: A screen printing apparatus includes an inspection region setter and an operation stop controller. The inspection region setter sets an inspection region in an inspection plane that intersects with a moving path of a mask until the mask positioned at a printing-job performing position moves to a mask shelter position by the moving mechanism. In addition, the inspection region setter excludes a passing region of the mask from the inspection region while the mask to be positioned at the mask shelter position passes over the inspection plane from the printing-job performing position.

Abstract: An input apparatus includes a top panel having a manipulation input surface on which a manipulation input is performed; a pressure sensor having two terminals and configured to output a voltage in accordance with a pressure applied by the manipulation input on the manipulation input surface; a switch connected to the two terminals of the pressure sensor and configured to equalize electric potentials between the two terminals when the switch is turned on; and a controller configured to turn on the switch, after the pressure applied on the manipulation input surface is detected based on an output of the pressure sensor, when the manipulation input on the manipulation input surface is stopped or the output of the pressure sensor becomes equal to or less than a predetermined level that represents non-pressing.

Abstract: A tactile sensation providing system includes an electronic device and a tactile sensation providing apparatus, which includes a wearable part worn on fingers, vibrating elements disposed at portions corresponding to the fingers, sensors that detect touches of the fingers onto a manipulation input surface, and a second controlling part able to communicate with a first controlling part. Upon receiving from the second controlling part a signal representing that a touch of one finger is detected by one sensor, the first controlling part obtains, based on data representing the finger and on coordinates detected by a detector, a type of the finger touching the surface and the coordinates where the finger touches the surface, and generates a driving signal representing a tactile sensation corresponding to the data representing the finger, the coordinates, and a displayed image. The second controlling part drives one of the vibrating elements using the driving signal.

Abstract: In a semiconductor device, a first end of a first lead frame is connected via solder to a first circuit pattern and another end extends outside from a case. In the same way, a first end of a second lead frame is connected via solder to a third circuit pattern and another end extends outside from a case. Third and fourth circuit patterns that are covered by the first lead frame are respectively buried by insulating layers. In addition, a semiconductor element is provided via solder on a region of the first lead frame above the first circuit pattern. Wires electrically connect the semiconductor element and a region of the second lead frame above the third circuit pattern.

Abstract: An input apparatus includes a top panel having a manipulation input surface on which a manipulation input is performed; a pressure sensor having two terminals and configured to output a voltage in accordance with a pressure applied by the manipulation input on the manipulation input surface; a switch connected to the two terminals of the pressure sensor and configured to equalize electric potentials between the two terminals when the switch is turned on; and a controller configured to turn on the switch, after the pressure applied on the manipulation input surface is detected based on an output of the pressure sensor, when the manipulation input on the manipulation input surface is stopped or the output of the pressure sensor becomes equal to or less than a predetermined level that represents non-pressing.

Abstract: A component mounting line has a screen printing apparatus and component mounting apparatuses. Each component mounting apparatus includes a first substrate carrying lane and a second substrate carrying lane, carries a first type substrate on which a first pattern has been printed in the first substrate carrying lane, performs a component mounting-relevant operation on the first type substrate, carries a second type substrate on which a second pattern has been printed in the second substrate carrying lane, and performs a component mounting-relevant operation on the second type substrate. The screen printing apparatus selects a type of the substrate to be carried in depending on whether a substrate is carried in the second component mounting apparatus downstream from the screen printing apparatus.

Abstract: A semiconductor device includes an insulating substrate including a metal plate, an insulating plate, and a circuit plate laminated sequentially in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode provided on a surface of the semiconductor element, the circuit plate, or the electrode and the circuit plate; a plastic housing having a hollow shape to receive the insulating substrate, the semiconductor element, and the wiring member therein, the plastic housing having an inner frame on an inner surface and a step formed in a front end of the inner frame; and a sealing material made of a thermosetting resin to seal the insulating substrate, the semiconductor element, and the wiring member inside the plastic housing.

Abstract: A semiconductor device includes an insulating substrate having a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing. The circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern.

Abstract: A component mounting line has a screen printing apparatus and component mounting apparatuses. The screen printing apparatus carries in substrates based on substrate carrying-in order data which is determined so that alternate carrying-in in which a first type substrate and a second type substrate are alternately carried in and continuous carrying-in in which the first type substrate or the second type substrate which has a shorter line tact time is continuously carried in are mixed.